公开(公告)号：US12002700B2

公开(公告)日：2024-06-04

申请号：US17346743

申请日：2021-06-14

Applicant: Kioxia Corporation

Inventor： Sho Kawadahara

IPC: H01L21/683 ,  H01L23/00

CPC classification number: H01L21/683 ,  H01L24/74 ,  H01L24/741 ,  H01L24/743 ,  H01L24/744 ,  H01L24/80 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/84 ,  H01L24/94 ,  H01L24/95 ,  H01L2224/75733 ,  H01L2224/75734 ,  H01L2224/76733 ,  H01L2224/77733 ,  H01L2224/8022 ,  H01L2224/8122 ,  H01L2224/8221 ,  H01L2224/8322 ,  H01L2224/8421 ,  H01L2224/9512 ,  H01L2224/95133 ,  H01L2224/95144 ,  H01L2224/95145

Abstract: According to one embodiment, there is provided a substrate bonding apparatus including a first chuck stage and a second chuck stage. The first chuck stage includes a first electromagnetic force generation unit. The first chuck stage is chuckable for a first substrate. The second chuck stage includes a second electromagnetic force generation unit. The second electromagnetic force generation unit faces the first electromagnetic force generation unit. The second chuck stage is chuckable for a second substrate.