公开(公告)号：US20090035105A1

公开(公告)日：2009-02-05

申请号：US12219666

申请日：2008-07-25

Applicant: Cheal-Sang Yoon ,  Yong-Dae Ha ,  Jae-Ryoung Lee ,  Jeong-Soon Cho ,  Bum-Woo Lee ,  Young-Gon Hwang ,  Mok-Kun Kwon

Inventor： Cheal-Sang Yoon ,  Yong-Dae Ha ,  Jae-Ryoung Lee ,  Jeong-Soon Cho ,  Bum-Woo Lee ,  Young-Gon Hwang ,  Mok-Kun Kwon

IPC: H01L21/67

CPC classification number: H01L21/67092 ,  H01L21/67132

Abstract: Provided are an apparatus, method for separating a chip and a method for fabricating the apparatus. An apparatus for separating a chip, according to example embodiments, may include a suction holder. The suction holder may include an upper surface with at least one suction hole to suction and fix an adhesive tape to which a plurality of semiconductor chips may be attached. The apparatus for separating a chip may also include a rotatable plunger in the suction holder. The rotatable plunger may include an upper end configured to pass through the at least one suction hole and to project over the suction holder upon rotation of the rotatable plunger. The apparatus for separating a chip may also include a vertically movable plunger lifter. The vertically movable plunger lifter may be configured to rotate the rotatable plunger by contacting and raising a lower end of the rotatable plunger.

Abstract translation: 提供了一种用于分离芯片的装置，方法和用于制造该装置的方法。 根据示例性实施例的用于分离芯片的设备可以包括抽吸保持器。 抽吸保持器可以包括具有至少一个吸入孔的上表面，以吸引和固定可以附着多个半导体芯片的胶带。 用于分离芯片的装置还可以包括在吸持架中的可旋转柱塞。 可旋转柱塞可以包括构造成穿过至少一个吸入孔的上端，并且在可旋转柱塞转动时突出在吸持保持器上。 用于分离芯片的装置还可以包括可垂直移动的柱塞升降器。 可垂直移动的柱塞升降器可构造成通过接触和升高可旋转柱塞的下端来旋转可旋转柱塞。

公开(公告)号：US20090020229A1

公开(公告)日：2009-01-22

申请号：US12174771

申请日：2008-07-17

Applicant: Cheal-Sang YOON ,  Yong-Dae Ha ,  Jae-Ryoung Lee ,  Jeong-Soon Cho ,  Bum-Woo Lee ,  Pil-June Kim

Inventor： Cheal-Sang YOON ,  Yong-Dae Ha ,  Jae-Ryoung Lee ,  Jeong-Soon Cho ,  Bum-Woo Lee ,  Pil-June Kim

IPC: B29C65/00 ,  B29C65/78

CPC classification number: H01L24/95 ,  H01L21/6838 ,  H01L24/28 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/75733 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T156/17 ,  H01L2924/00

Abstract: A semiconductor chip bonding apparatus maintains a semiconductor chip a parallel state with a lead frame when applying a bonding load.

Abstract translation: 当施加结合负载时，半导体芯片接合装置将半导体芯片与引线框架保持平行状态。

公开(公告)号：US08042593B2

公开(公告)日：2011-10-25

申请号：US12174771

申请日：2008-07-17

Applicant: Cheal-Sang Yoon ,  Yong-Dae Ha ,  Jae-Ryoung Lee ,  Jeong-Soon Cho ,  Bum-Woo Lee ,  Pil-June Kim

Inventor： Cheal-Sang Yoon ,  Yong-Dae Ha ,  Jae-Ryoung Lee ,  Jeong-Soon Cho ,  Bum-Woo Lee ,  Pil-June Kim

IPC: B32B37/00

CPC classification number: H01L24/95 ,  H01L21/6838 ,  H01L24/28 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/75733 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T156/17 ,  H01L2924/00

Abstract: A semiconductor chip bonding apparatus maintains a semiconductor chip in a parallel state with respect to a lead frame when applying a bonding load.

Abstract translation: 当施加接合负载时，半导体芯片接合装置将半导体芯片相对于引线框架保持在并联状态。

公开(公告)号：US20080000587A1

公开(公告)日：2008-01-03

申请号：US11710521

申请日：2007-02-26

Applicant: Yong-dae Ha ,  Cheal-sang Yoon ,  Jeong-soon Cho ,  Bum-woo Lee ,  Young-gon Hwang ,  Mok-kun Kwon

Inventor： Yong-dae Ha ,  Cheal-sang Yoon ,  Jeong-soon Cho ,  Bum-woo Lee ,  Young-gon Hwang ,  Mok-kun Kwon

IPC: B29C65/00

CPC classification number: H01L21/67092 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/83121 ,  H01L2224/8385 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/00

Abstract: A bonding apparatus for a semiconductor package determines whether a bottom of a bonding head is contaminated, and may include a contamination detecting unit for a bonding head attached to a body to apply pressure to the semiconductor package. The contamination detecting unit is below the bonding head to detect contamination on the bottom of the bonding head, a bonding block, and a bonding stage.

Abstract translation: 用于半导体封装的接合装置确定接合头的底部是否被污染，并且可以包括用于连接到主体的接合头的污染检测单元，以向半导体封装施加压力。 污染检测单元在接合头下面，以检测接合头，接合块和接合台的底部的污染。