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    MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS
    1.
    发明申请
    MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS 审中-公开

    公开(公告)号：US20190259683A1

    公开(公告)日：2019-08-22

    申请号：US16404949

    申请日：2019-05-07

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： CHARLES L. ARVIN ,  STEVEN P. OSTRANDER ,  KRISHNA R. TUNGA

    IPC: H01L23/367 ,  F28F21/08 ,  H01L23/373 ,  H01L21/48

    Abstract: A multipart lid is provided. The multipart lid may include a formed upper lid designed for maximum heat dissipation, a coined lower lid joined to the formed upper lid, where the coined lower lid comprises a coefficient of thermal expansion (CTE) substantially equal to a CTE of a first semiconductor component. A structure is provided. The structure may include a substrate, a first semiconductor component electrically connected and mounted on the substrate, one or more discrete components electrically connected and mounted on the substrate, a substrate mounted multipart lid covering both the semiconductor component and the one or more discrete components, where the multipart lid comprises a heat dissipating upper lid and a lower lid, where a coefficient of thermal expansion (CTE) of the lower lid substantially matches a CTE of the first semiconductor component.

    MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS
    2.
    发明申请
    MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS 审中-公开

    公开(公告)号：US20190164864A1

    公开(公告)日：2019-05-30

    申请号：US15826856

    申请日：2017-11-30

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： CHARLES L. ARVIN ,  STEVEN P. OSTRANDER ,  KRISHNA R. TUNGA

    IPC: H01L23/367 ,  H01L23/373 ,  H01L21/48 ,  F28F21/08

    Abstract: A multipart lid is provided. The multipart lid may include a formed upper lid designed for maximum heat dissipation, a coined lower lid joined to the formed upper lid, where the coined lower lid comprises a coefficient of thermal expansion (CTE) substantially equal to a CTE of a first semiconductor component. A structure is provided. The structure may include a substrate, a first semiconductor component electrically connected and mounted on the substrate, one or more discrete components electrically connected and mounted on the substrate, a substrate mounted multipart lid covering both the semiconductor component and the one or more discrete components, where the multipart lid comprises a heat dissipating upper lid and a lower lid, where a coefficient of thermal expansion (CTE) of the lower lid substantially matches a CTE of the first semiconductor component.

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