公开(公告)号：US20190164864A1

公开(公告)日：2019-05-30

申请号：US15826856

申请日：2017-11-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： CHARLES L. ARVIN ,  STEVEN P. OSTRANDER ,  KRISHNA R. TUNGA

IPC: H01L23/367 ,  H01L23/373 ,  H01L21/48 ,  F28F21/08

Abstract: A multipart lid is provided. The multipart lid may include a formed upper lid designed for maximum heat dissipation, a coined lower lid joined to the formed upper lid, where the coined lower lid comprises a coefficient of thermal expansion (CTE) substantially equal to a CTE of a first semiconductor component. A structure is provided. The structure may include a substrate, a first semiconductor component electrically connected and mounted on the substrate, one or more discrete components electrically connected and mounted on the substrate, a substrate mounted multipart lid covering both the semiconductor component and the one or more discrete components, where the multipart lid comprises a heat dissipating upper lid and a lower lid, where a coefficient of thermal expansion (CTE) of the lower lid substantially matches a CTE of the first semiconductor component.

公开(公告)号：US20190259683A1

公开(公告)日：2019-08-22

申请号：US16404949

申请日：2019-05-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： CHARLES L. ARVIN ,  STEVEN P. OSTRANDER ,  KRISHNA R. TUNGA

IPC: H01L23/367 ,  F28F21/08 ,  H01L23/373 ,  H01L21/48

Abstract: A multipart lid is provided. The multipart lid may include a formed upper lid designed for maximum heat dissipation, a coined lower lid joined to the formed upper lid, where the coined lower lid comprises a coefficient of thermal expansion (CTE) substantially equal to a CTE of a first semiconductor component. A structure is provided. The structure may include a substrate, a first semiconductor component electrically connected and mounted on the substrate, one or more discrete components electrically connected and mounted on the substrate, a substrate mounted multipart lid covering both the semiconductor component and the one or more discrete components, where the multipart lid comprises a heat dissipating upper lid and a lower lid, where a coefficient of thermal expansion (CTE) of the lower lid substantially matches a CTE of the first semiconductor component.

公开(公告)号：US20180368756A1

公开(公告)日：2018-12-27

申请号：US15631064

申请日：2017-06-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： MAHMOUD AMIN ,  ZHENXING BI ,  LAWRENCE A. CLEVENGER ,  LEIGH ANNE H. CLEVENGER ,  KRISHNA R. TUNGA

IPC: A61B5/00 ,  G06F19/00

Abstract: Embodiments of the invention are directed to a computer-implemented method for generating a sleep optimization plan. A non-limiting example of the computer-implemented method includes receiving, by a processor, genetic data for a user. The method also includes receiving, by the processor, Internet of Things (IoT) device data for the user. The method also includes generating, by the processor, a sleep duration measurement for the user based at last in part upon the IoT device data. The method also includes generating, by the processor, a sleep optimization plan for the user based at least in part upon the genetic data.