Invention Application
- Patent Title: LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
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Application No.: US15640475Application Date: 2017-07-01
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Publication No.: US20190006312A1Publication Date: 2019-01-03
- Inventor: CHARLES L. ARVIN , Clement Fortin , Christopher D. Muzzy , Brian W. Quinlan , Thomas A. Wassick , Thomas Weiss
- Applicant: International Business Machines Corporation
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498
Abstract:
A method and structure for joining a semiconductor device and a laminate substrate or two laminate substrates where the joint is formed with lead free solders and lead free compositions. The various lead free solders and lead free compositions are chosen so that there is a sufficient difference in liquidus temperatures such that some components may be joined to, or removed from, the laminate substrate without disturbing other components on the laminate substrate.
Public/Granted literature
- US10586782B2 Lead-free solder joining of electronic structures Public/Granted day:2020-03-10
Information query
IPC分类:
