Invention Application
- Patent Title: NON-POROUS COPPER TO COPPER INTERCONNECT
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Application No.: US16695121Application Date: 2019-11-25
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Publication No.: US20200098723A1Publication Date: 2020-03-26
- Inventor: CHARLES L. ARVIN , Christopher D. Muzzy
- Applicant: International Business Machines Corporation
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498
Abstract:
A semiconductor structure which includes a first semiconductor substrate having a first plurality of copper connectors; a second semiconductor substrate having a second plurality of copper connectors; and a joining structure joining the first plurality of copper connectors to the second plurality of copper connectors, the joining structure including a copper intermetallic mesh having pores filled with silver.
Public/Granted literature
- US10804241B2 Non-porous copper to copper interconnect Public/Granted day:2020-10-13
Information query
IPC分类:
