公开(公告)号：US20200161272A1

公开(公告)日：2020-05-21

申请号：US16773368

申请日：2020-01-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： CHARLES L. ARVIN ,  CLEMENT J. FORTIN ,  CHRISTOPHER D. MUZZY ,  BRIAN W. QUINLAN ,  THOMAS A. WASSICK ,  THOMAS WEISS

IPC: H01L23/00 ,  H01L23/498

Abstract: A method and structure for joining a semiconductor device and a laminate substrate or two laminate substrates where the joint is formed with lead free solders and lead free compositions. The various lead free solders and lead free compositions are chosen so that there is a sufficient difference in liquidus temperatures such that some components may be joined to, or removed from, the laminate substrate without disturbing other components on the laminate substrate.