摘要:
The present invention provides a high-temperature lead-free solder alloy which has no variation in strength of the soldered portion and has an excellent balance between strength and soldering properties, and a method for producing the alloy. The present invention relates to a lead-free jointing material made of an alloy of two elements A and B selected from elements other than Pb, wherein the element A has a melting point higher than a melting point of the element B, wherein the alloy is an alloy which has a room-temperature stable phase composed of the element B and a room-temperature stable phase AmBn composed of the elements A and B (provided that m and n are specific numerals in accordance with an alloy constituting a stable phase at room temperature) and satisfies AxB1-x (provided that 0
摘要:
The present invention provides a high-temperature lead-free solder alloy which has no variation in strength of the soldered portion and has an excellent balance between strength and soldering properties, and a method for producing the alloy. The present invention relates to a lead-free jointing material made of an alloy of two elements A and B selected from elements other than Pb, wherein the element A has a melting point higher than a melting point of the element B, wherein the alloy is an alloy which has a room-temperature stable phase composed of the element B and a room-temperature stable phase AmBn composed of the elements A and B (provided that m and n are specific numerals in accordance with an alloy constituting a stable phase at room temperature) and satisfies AxB1-x (provided that 0
摘要:
Disclosed herein is an electronic apparatus produced using a high-temperature lead-free solder alloy which makes it possible to form soldered joints having no variations in strength and which has an excellent balance between strength and solderability. The lead-free solder alloy is an alloy which is made of an element A and an element B and which has a composition composed of AmBn being a stable phase and the element B in an equilibrium state at room temperature. When the lead-free solder alloy is solidified by quenching, the element A is dissolved in a room-temperature stable phase of the element B so that a supersaturated solid solution is formed, and when melted for soldering and then solidified, the alloy returns to its equilibrium state and has a composition composed of the stable phase AmBn and the element B and therefore maintains strength due to the presence of the stable phase AmBn even when reheated to a soldering temperature.
摘要:
Disclosed herein is an electronic apparatus produced using a high-temperature lead-free solder alloy which makes it possible to form soldered joints having no variations in strength and which has an excellent balance between strength and solderability. The lead-free solder alloy is an alloy which is made of an element A and an element B and which has a composition composed of AmBn being a stable phase and the element B in an equilibrium state at room temperature. When the lead-free solder alloy is solidified by quenching, the element A is dissolved in a room-temperature stable phase of the element B so that a supersaturated solid solution is formed, and when melted for soldering and then solidified, the alloy returns to its equilibrium state and has a composition composed of the stable phase AmBn and the element B and therefore maintains strength due to the presence of the stable phase AmBn even when reheated to a soldering temperature.
摘要:
There are provided a surface coating material for a molten zinc bath member with improved zinc corrosion resistance, a production method thereof, and a molten zinc bath member. The surface coating material comprises WC powder particles and a binder metal. The binder metal comprises Co and a metal element electrochemically nobler than Co and constitutes an alloy structure having a single phase.
摘要:
An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive material to the second electrically conductive material at least for electric conduction. The bonding material is made of a metallic structure containing copper-tin based intermetallic compound phases and tin-bismuth phases, the copper-tin based intermetallic compound phases being continuous between the first electrically conductive material and the second electrically conductive material, the tin-bismuth phases being surrounded by the copper-tin based intermetallic compound phases.
摘要:
There are provided a surface coating material for a molten zinc bath member with improved zinc corrosion resistance, a production method thereof, and a molten zinc bath member. The surface coating material comprises WC powder particles and a binder metal. The binder metal comprises Co and a metal element electrochemically nobler than Co and constitutes an alloy structure having a single phase.
摘要:
In a gain-switching-type transimpedance amplifier, in order to provide a technique capable of preventing unnecessary gain switching caused when noise is received, and preventing decrease in sensitivity caused when noise with a large input level is received, and then, a burst signal with a small input level is received, a transimpedance amplifier 5 includes: a pre-amplifier 200 to which the burst signal is inputted; an average detection start determination unit 300 for comparing an output of a pre-amplifier 200 with a first threshold voltage; an average detection circuit 400 for detecting and outputting an average value of the output of the pre-amplifier 200 during a certain period of time from a time point when the output of the pre-amplifier 200 exceeds the first threshold voltage; and a gain switching control unit 500 for determining whether to switch a gain of the pre-amplifier 200 based on an output of the average detection circuit 400.
摘要:
An abnormality detecting apparatus includes an imaging device for obtaining image data of a TIM, a failure detecting section for detecting appearance failures of the TIM on the basis of the image data of the TIM obtained by the imaging device, and a determining device for determining whether an abnormality occurs at the TIM on the basis of a detection result by the failure detecting section.
摘要:
Provided is an optical access system comprising: an optical line terminal connected to another network; a plurality of optical network units, each connected to a user terminal; and at least one of an optical switching unit and an optical splitter, which is installed between the optical line terminal and the plurality of optical network units. The optical line terminal allocates a length of time to a discovery phase for detecting the plurality of optical network units, and a length of time to data transmission phases for transferring data from the plurality of optical network units; and changes a ratio of the length of time of the discovery phase to the length of time of the data transmission phases so that the length of time of the discovery phase is shortened in the case where a number of the optical network units that are registered in the optical line terminal increase.