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公开(公告)号：US08630209B2
公开(公告)日：2014-01-14
申请号：US12850214
申请日：2010-08-04
Applicant: Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada
Inventor： Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada
CPC classification number: H04B3/52 , H01L23/48 , H01L23/66 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/105 , H01L27/0248 , H01L2223/6677 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2225/1023 , H01L2924/00014 , H01L2924/14 , H01L2924/3011 , H04L12/40013 , H05K1/0239 , H05K1/144 , H05K2201/09618 , H01L2224/45099 , H01L2924/00
Abstract: Disclosed herein is a wireless transmission system, including: a plurality of systems of millimeter wave signal transmission lines capable of individually transmitting information in a millimeter waveband independently of each other; a sending section disposed on one end side of each of the plural systems of millimeter wave signal transmission lines; and a reception section disposed on the other end side of each of the plural systems of millimeter wave signal transmission lines. The sending section is adapted to convert a signal of an object of transmission into a millimeter wave signal and supply the millimeter wave signal to the millimeter signal transmission line. The reception section is adapted to receive the millimeter wave signal transmitted thereto through the millimeter wave signal transmission line and convert the received millimeter wave signal into the signal of the object of transmission.
Abstract translation: 本文公开了一种无线传输系统，包括：能够独立于毫米波波段单独发送信息的多个毫米波信号传输线系统; 发送部，其设置在所述多个毫米波信号传输线系统中的每一个的一端侧; 以及设置在所述多个毫米波信号传输线系统中的每一个的另一端侧的接收部分。 发送部分适于将传输对象的信号转换为毫米波信号，并将毫米波信号提供给毫米波信号传输线。 接收部适于接收通过毫米波信号传输线传输的毫米波信号，并将接收的毫米波信号转换成传输对象的信号。
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2.发明授权公开(公告)号：US09007981B2
公开(公告)日：2015-04-14
申请号：US13384120
申请日：2010-08-09
Applicant: Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada , Naoto Nakamura , Yoshiyuki Akiyama
Inventor： Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada , Naoto Nakamura , Yoshiyuki Akiyama
CPC classification number: H04B7/022 , H04B7/0413
Abstract: Signal distribution, signal switching, and signal collection are performed with a simple configuration. An electronic device comprises a transmission unit (108) for transmitting, as a wireless signal, a signal to be transmitted and a reception unit (208) for receiving the wireless signal transmitted from the transmission unit. In the electronic device, a plurality of pairs of wireless signal transmission points in the transmission unit and wireless signal reception points in the reception unit can be formed. Using the pairs of transmission points and reception points make it possible to execute at least either one of signal distribution in which the same signal to be transmitted from a transmission point is transmitted to the multiple reception points and signal switching in which a signal to be transmitted from a transmission point is selectively transmitted to any of the multiple reception points. The signal to be transmitted is transmitted as a wireless signal. In this case, the signal distribution, signal switching, and signal collection are performed in a wireless signal portion. Since a portion where a signal transmission is performed through electric wiring does not interpose the portion where the signal distribution, signal switching, and signal collection are performed, the signal distribution, signal switching, and signal collection can be performed with a simple configuration.
Abstract translation: 以简单的配置进行信号分配，信号切换和信号采集。 电子设备包括用于作为无线信号发送要发送的信号的发送单元（108）和用于接收从发送单元发送的无线信号的接收单元（208）。 在电子设备中，可以形成发送单元中的多对无线信号发送点和接收单元中的无线信号接收点。 使用发送点和接收点对可以执行信号分配中的至少一个，其中从发送点发送的相同信号被发送到多个接收点，并且其中要发送的信号的信号切换 从发送点选择性地发送到多个接收点中的任一个。 要发送的信号作为无线信号发送。 在这种情况下，在无线信号部分中执行信号分配，信号切换和信号采集。 由于通过电线执行信号传输的部分不会插入执行信号分配，信号切换和信号收集的部分，所以可以以简单的配置进行信号分配，信号切换和信号收集。
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3.发明申请公开(公告)号：US20110165839A1
公开(公告)日：2011-07-07
申请号：US13063057
申请日：2009-09-15
Applicant: Hirofumi Kawamura , Yasuhiro Okada
Inventor： Hirofumi Kawamura , Yasuhiro Okada
CPC classification number: H01P3/16 , G01S7/032 , G01S2013/9371 , H01P5/02 , H01Q9/0407 , H01Q9/045 , H04B1/3822 , H04B10/00 , H04B10/501 , H04B10/5161 , H04B10/556 , Y10T29/49016
Abstract: Provided is an in-millimeter wave dielectric transmission device including a first signal processing board for processing a millimeter wave signal, a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal, and a viscoelastic member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The viscoelastic member constitutes a dielectric transmission path. With such a configuration, the viscoelastic member absorbs vibration when external force is applied to the signal processing boards, so that vibration of the first signal processing board and the second signal processing board can be reduced, and a millimeter wave signal between the signal processing boards can be transmitted through the viscoelastic member at a high speed without using connectors and cables.
Abstract translation: 提供了一种毫米波介质传输装置，其包括用于处理毫米波信号的第一信号处理板，信号耦合到第一信号处理板以接收毫米波信号的第二信号处理板，并执行关于 毫米波信号和设置在第一信号处理板和第二信号处理板之间并具有预定的相对介电常数和预定的介电损耗系数的粘弹元件。 粘弹性构件构成电介质传输路径。 通过这样的结构，当对信号处理板施加外力时，粘弹性体吸收振动，能够降低第一信号处理板和第二信号处理板的振动，并且信号处理板之间的毫米波信号 可以高速传输通过粘弹性部件，而不使用连接器和电缆。
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4.发明授权公开(公告)号：US08983399B2
公开(公告)日：2015-03-17
申请号：US13141726
申请日：2009-12-08
Applicant: Hirofumi Kawamura , Yasuhiro Okada
Inventor： Hirofumi Kawamura , Yasuhiro Okada
IPC: H04B1/38 , H01L23/48 , H01L23/66 , H01L23/00 , H01L25/065 , H01L25/10 , H01P3/12 , H01Q9/04 , H01Q23/00
CPC classification number: H01Q21/00 , H01L23/48 , H01L23/66 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2223/6627 , H01L2223/6677 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01042 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1903 , H01L2924/19104 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01P3/121 , H01P3/122 , H01Q9/0407 , H01Q23/00 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
Abstract: Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.
Abstract translation: 提供了一种毫米波介电传输装置。 毫米波介质传输装置包括：设置在一个插入器基板上并能够进行毫米波介质传输的半导体芯片，连接到半导体芯片的天线结构，包括被构造成覆盖半导体的模制树脂的两个半导体封装 芯片和天线结构，以及设置在两个半导体封装之间以传输毫米波信号的电介质传输路径。 安装半导体封装，使得其天线结构被布置成介于其间的电介质传输路径。
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5.发明申请公开(公告)号：US20110309893A1
公开(公告)日：2011-12-22
申请号：US13141726
申请日：2009-12-08
Applicant: Hirofumi Kawamura , Yasuhiro Okada
Inventor： Hirofumi Kawamura , Yasuhiro Okada
CPC classification number: H01Q21/00 , H01L23/48 , H01L23/66 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2223/6627 , H01L2223/6677 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01042 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1903 , H01L2924/19104 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01P3/121 , H01P3/122 , H01Q9/0407 , H01Q23/00 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
Abstract: Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.
Abstract translation: 提供了一种毫米波介电传输装置。 毫米波电介质传输装置包括设置在一个插入器基板上并能够进行毫米波电介质传输的半导体芯片，连接到半导体芯片的天线结构，包括被构造成覆盖半导体的模制树脂的两个半导体封装 芯片和天线结构，以及设置在两个半导体封装之间以传输毫米波信号的电介质传输路径。 安装半导体封装，使得其天线结构被布置成介于其间的电介质传输路径。
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Patent Agency Ranking
6.发明授权公开(公告)号：US08848389B2
公开(公告)日：2014-09-30
申请号：US13062121
申请日：2009-09-15
Applicant: Hirofumi Kawamura , Yasuhiro Okada
Inventor： Hirofumi Kawamura , Yasuhiro Okada
CPC classification number: H01P5/107 , H01P1/047 , H01P5/028 , H04B3/52 , H05K1/0237 , H05K1/144 , H05K2201/037 , H05K2201/042 , H05K2201/10303 , Y10T29/49016
Abstract: An electronic device provided with a plurality of circuit boards uses a support member for supporting the circuit boards as the transmission path of a wireless signal. For example, the electronic device is provided with a first printed circuit board for processing a millimeter-wave signal, a second printed circuit board which is signal-coupled to the printed circuit board and receives the millimeter-wave signal to subject the received signal to signal processing, and a waveguide which is disposed with a predetermined dielectric constant between the printed circuit boards, wherein the waveguide constitutes the dielectric transmission path, and the waveguide supports the printed circuit boards. This configuration makes it possible to receive the electromagnetic wave based on a millimeter-wave signal radiated from one end of the waveguide constituting the dielectric transmission path, at the other end thereof.
Abstract translation: 设置有多个电路板的电子设备使用支撑部件来支持电路板作为无线信号的传输路径。 例如，电子设备设置有用于处理毫米波信号的第一印刷电路板，与印刷电路板信号耦合的第二印刷电路板，并接收毫米波信号以将接收到的信号 信号处理以及布置在印刷电路板之间的预定介电常数的波导，其中波导构成电介质传输路径，并且波导支撑印刷电路板。 该结构使得可以在其另一端接收基于构成介质传输路径的波导的一端辐射的毫米波信号的电磁波。
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7.发明授权公开(公告)号：US08725069B2
公开(公告)日：2014-05-13
申请号：US13063057
申请日：2009-09-15
Applicant: Hirofumi Kawamura , Yasuhiro Okada
Inventor： Hirofumi Kawamura , Yasuhiro Okada
IPC: H04B5/00
CPC classification number: H01P3/16 , G01S7/032 , G01S2013/9371 , H01P5/02 , H01Q9/0407 , H01Q9/045 , H04B1/3822 , H04B10/00 , H04B10/501 , H04B10/5161 , H04B10/556 , Y10T29/49016
Abstract: Provided is an in-millimeter wave dielectric transmission device including a first signal processing board for processing a millimeter wave signal, a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal, and a viscoelastic member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The viscoelastic member constitutes a dielectric transmission path. With such a configuration, the viscoelastic member absorbs vibration when external force is applied to the signal processing boards, so that vibration of the first signal processing board and the second signal processing board can be reduced, and a millimeter wave signal between the signal processing boards can be transmitted through the viscoelastic member at a high speed without using connectors and cables.
Abstract translation: 提供了一种毫米波介质传输装置，其包括用于处理毫米波信号的第一信号处理板，信号耦合到第一信号处理板以接收毫米波信号的第二信号处理板，并执行关于 毫米波信号和设置在第一信号处理板和第二信号处理板之间并具有预定的相对介电常数和预定的介电损耗系数的粘弹元件。 粘弹性构件构成电介质传输路径。 通过这样的结构，当对信号处理板施加外力时，粘弹性体吸收振动，能够降低第一信号处理板和第二信号处理板的振动，并且信号处理板之间的毫米波信号 可以高速传输通过粘弹性部件，而不使用连接器和电缆。
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8.发明申请公开(公告)号：US20120120862A1
公开(公告)日：2012-05-17
申请号：US13384120
申请日：2010-08-09
Applicant: Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada , Naoto Nakamura , Yoshiyuki Akiyama
Inventor： Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada , Naoto Nakamura , Yoshiyuki Akiyama
CPC classification number: H04B7/022 , H04B7/0413
Abstract: Signal distribution, signal switching, and signal collection are performed with a simple configuration. An electronic device comprises a transmission unit (108) for transmitting, as a wireless signal, a signal to be transmitted and a reception unit (208) for receiving the wireless signal transmitted from the transmission unit. In the electronic device, a plurality of pairs of wireless signal transmission points in the transmission unit and wireless signal reception points in the reception unit can be formed. Using the pairs of transmission points and reception points make it possible to execute at least either one of signal distribution in which the same signal to be transmitted from a transmission point is transmitted to the multiple reception points and signal switching in which a signal to be transmitted from a transmission point is selectively transmitted to any of the multiple reception points. The signal to be transmitted is transmitted as a wireless signal. In this case, the signal distribution, signal switching, and signal collection are performed in a wireless signal portion. Since a portion where a signal transmission is performed through electric wiring does not interpose the portion where the signal distribution, signal switching, and signal collection are performed, the signal distribution, signal switching, and signal collection can be performed with a simple configuration.
Abstract translation: 以简单的配置进行信号分配，信号切换和信号采集。 电子设备包括用于作为无线信号发送要发送的信号的发送单元（108）和用于接收从发送单元发送的无线信号的接收单元（208）。 在电子设备中，可以形成发送单元中的多对无线信号发送点和接收单元中的无线信号接收点。 使用发送点和接收点对可以执行信号分配中的至少一个，其中从发送点发送的相同信号被发送到多个接收点，并且其中要发送的信号的信号切换 从发送点选择性地发送到多个接收点中的任一个。 要发送的信号作为无线信号发送。 在这种情况下，在无线信号部分中执行信号分配，信号切换和信号采集。 由于通过电线执行信号传输的部分不会插入执行信号分配，信号切换和信号收集的部分，所以可以以简单的配置进行信号分配，信号切换和信号收集。
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9.发明申请公开(公告)号：US20110158344A1
公开(公告)日：2011-06-30
申请号：US13062121
申请日：2009-09-15
Applicant: Hirofumi Kawamura , Yasuhiro Okada
Inventor： Hirofumi Kawamura , Yasuhiro Okada
CPC classification number: H01P5/107 , H01P1/047 , H01P5/028 , H04B3/52 , H05K1/0237 , H05K1/144 , H05K2201/037 , H05K2201/042 , H05K2201/10303 , Y10T29/49016
Abstract: An electronic device provided with a plurality of circuit boards uses a support member for supporting the circuit boards as the transmission path of a wireless signal. For example, the electronic device is provided with a first printed circuit board for processing a millimeter-wave signal, a second printed circuit board which is signal-coupled to the printed circuit board and receives the millimeter-wave signal to subject the received signal to signal processing, and a waveguide which is disposed with a predetermined dielectric constant between the printed circuit boards, wherein the waveguide constitutes the dielectric transmission path, and the waveguide supports the printed circuit boards. This configuration makes it possible to receive the electromagnetic wave based on a millimeter-wave signal radiated from one end of the waveguide constituting the dielectric transmission path, at the other end thereof.
Abstract translation: 设置有多个电路板的电子设备使用支撑部件来支持电路板作为无线信号的传输路径。 例如，电子设备设置有用于处理毫米波信号的第一印刷电路板，与印刷电路板信号耦合的第二印刷电路板，并接收毫米波信号以将接收到的信号 信号处理以及布置在印刷电路板之间的预定介电常数的波导，其中波导构成电介质传输路径，并且波导支撑印刷电路板。 该结构使得可以在其另一端接收基于构成介质传输路径的波导的一端辐射的毫米波信号的电磁波。
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公开(公告)号：US20110038282A1
公开(公告)日：2011-02-17
申请号：US12850214
申请日：2010-08-04
Applicant: Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada
Inventor： Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada
CPC classification number: H04B3/52 , H01L23/48 , H01L23/66 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/105 , H01L27/0248 , H01L2223/6677 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2225/1023 , H01L2924/00014 , H01L2924/14 , H01L2924/3011 , H04L12/40013 , H05K1/0239 , H05K1/144 , H05K2201/09618 , H01L2224/45099 , H01L2924/00
Abstract: Disclosed herein is a wireless transmission system, including: a plurality of systems of millimeter wave signal transmission lines capable of individually transmitting information in a millimeter waveband independently of each other; a sending section disposed on one end side of each of the plural systems of millimeter wave signal transmission lines; and a reception section disposed on the other end side of each of the plural systems of millimeter wave signal transmission lines. The sending section is adapted to convert a signal of an object of transmission into a millimeter wave signal and supply the millimeter wave signal to the millimeter signal transmission line. The reception section is adapted to receive the millimeter wave signal transmitted thereto through the millimeter wave signal transmission line and convert the received millimeter wave signal into the signal of the object of transmission.
Abstract translation: 本文公开了一种无线传输系统，包括：能够独立于毫米波波段单独发送信息的多个毫米波信号传输线系统; 发送部，其设置在所述多个毫米波信号传输线系统中的每一个的一端侧; 以及设置在所述多个毫米波信号传输线系统中的每一个的另一端侧的接收部分。 发送部分适于将传输对象的信号转换为毫米波信号，并将毫米波信号提供给毫米波信号传输线。 接收部适于接收通过毫米波信号传输线传输的毫米波信号，并将接收的毫米波信号转换成传输对象的信号。
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