公开(公告)号：US20220181511A1

公开(公告)日：2022-06-09

申请号：US17593073

申请日：2020-03-06

Applicant: H.B. Fuller Company

Inventor： Peter Remmers ,  Volker K. Kestler ,  Thomas F. Kauffman

IPC: H01L31/18 ,  H01L21/67 ,  H01L31/048

Abstract: A method of encapsulating an electronic component. The method includes applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate. The applicator roll comprises an outer surface and is spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component. The gap controls the thickness of the first layer of encapsulating composition. The first layer of encapsulating composition encapsulates the electronic component on the substrate. An interface between the surface of the electronic component and the encapsulating composition being substantially free of voids.

公开(公告)号：US09878515B2

公开(公告)日：2018-01-30

申请号：US14290539

申请日：2014-05-29

Applicant: H.B. FULLER COMPANY

Inventor： Peter Remmers ,  Dirk Laukien ,  Lynne Purvis ,  Nicholas Porro ,  Nicholas Taylor

IPC: B32B1/02 ,  B65G19/18 ,  C09J7/02 ,  A61L15/22 ,  A61L31/04 ,  A61L15/58 ,  A61L31/14 ,  B32B27/30 ,  B32B1/08 ,  B32B27/18 ,  B32B27/22 ,  B32B27/32 ,  B65G27/00 ,  D06N3/00 ,  D06N3/04 ,  C09J5/06

CPC classification number: B32B1/02 ,  A61L15/225 ,  A61L15/585 ,  A61L31/041 ,  A61L31/14 ,  B32B1/08 ,  B32B27/18 ,  B32B27/22 ,  B32B27/30 ,  B32B27/306 ,  B32B27/32 ,  B32B27/325 ,  B32B27/327 ,  B65G19/18 ,  B65G27/00 ,  C09J5/06 ,  C09J7/243 ,  C09J7/387 ,  C09J2201/61 ,  C09J2423/003 ,  D06N3/0011 ,  D06N3/0086 ,  D06N3/045 ,  D06N2203/042 ,  D06N2205/06 ,  D06N2209/16 ,  D10B2509/00 ,  D10B2509/026 ,  Y10T428/1334 ,  Y10T428/1341 ,  Y10T428/1352 ,  Y10T428/1379 ,  Y10T428/23 ,  Y10T428/28 ,  Y10T428/2967 ,  Y10T442/2754

Abstract: The present invention relates to a packaged hot-melt pressure sensitive adhesive comprising a hot-melt pressure sensitive adhesive composition and a coextrusion coating consisting of neat low density polyethylene, neat polypropylene, or neat ethylene vinyl acetate. The present invention further relates to the use of the packaged adhesive formed as individual forms in an adhesive application process, and the use of the packaged adhesive in the production of laminated articles, including nonwoven hygiene articles, disposable medical drapes, and also laminate constructions such as tapes and labels.

公开(公告)号：US20140162082A1

公开(公告)日：2014-06-12

申请号：US13780255

申请日：2013-02-28

Applicant: H.B. FULLER COMPANY

Inventor： Ryan T. Gleason ,  Kevin P. Davis ,  Peter M. Simone ,  Peter Remmers ,  Mark S. Kroll

IPC: B32B37/12 ,  C09J123/12

CPC classification number: B32B37/1207 ,  A61F13/53 ,  A61F2013/530554 ,  C09J7/21 ,  C09J7/35 ,  C09J123/12 ,  C09J2400/24 ,  C09J2400/26 ,  C09J2423/00 ,  C09J2423/10 ,  D04H1/587 ,  Y10T428/31938

Abstract: A composition, an article and a method for the bonding of non-woven substrates is disclosed. The composition includes solid particles comprising one or more polymers which are emulsified, dispersed and or suspended in a fluid carrier. The composition forms a molten blend when energy activated at temperatures in excess of 60° C. (140° F.).

Abstract translation: 公开了一种组合物，制品和粘合无纺基材的方法。 该组合物包括固体颗粒，其包含一种或多种乳化，分散和/或悬浮在流体载体中的聚合物。 当能量在超过60℃（140°F）的温度下活化时，组合物形成熔融共混物。

公开(公告)号：US10350325B2

公开(公告)日：2019-07-16

申请号：US14290420

申请日：2014-05-29

Applicant: H.B. FULLER COMPANY

Inventor： Peter Remmers ,  Thomas Wittkopf ,  Ursula Ruediger ,  Carlos Briseno

IPC: A61L15/24 ,  A61F13/15 ,  A61F13/539 ,  A61L15/58 ,  C09J123/10 ,  C08L23/10 ,  A61F13/49 ,  C09J123/12

Abstract: Disclosed is a disposable absorbent article including two substrates; and an adhesive composition including a first polymer that is propylene-based and has a Mw of no greater than about 75,000, and a second polymer that is propylene-based and has a Mw of at least about 100,000, where the adhesive composition is used for at least two applications in the disposable absorbent article and is delivered via a molten bulk tank.

公开(公告)号：US10265225B2

公开(公告)日：2019-04-23

申请号：US14849226

申请日：2015-09-09

Applicant: H.B FULLER COMPANY

Inventor： Kristy J. Beckman ,  David B. Malcolm ,  Kevin P. Davis ,  Yuanyan Gu ,  Peter Remmers ,  Thomas Wittkopf ,  Mark S. Kroll

IPC: A61F13/515 ,  A61L15/58 ,  B32B27/12 ,  B32B27/30 ,  C09J153/00 ,  A61F13/49 ,  A61F13/496 ,  A61F13/15 ,  C09J5/06 ,  C09J153/02 ,  B32B5/02 ,  B32B5/26 ,  B32B7/12 ,  B32B5/08 ,  B32B7/04 ,  B32B7/14 ,  B32B37/12 ,  B32B38/00

Abstract: This invention claims a disposable article including at least two bonded regions, one of the regions has elastic properties; the other region is different from the first.

公开(公告)号：US20190161649A1

公开(公告)日：2019-05-30

申请号：US16206300

申请日：2018-11-30

Applicant: H.B. Fuller Company

Inventor： Steven R. Vaughan ,  Kevin P. Davis ,  Thomas Wittkopf ,  Peter Remmers ,  Seth Urtel

IPC: C09J7/35 ,  C09J123/12 ,  C09J11/08 ,  C09J11/06 ,  A61F13/539

Abstract: The invention includes a hot melt adhesive composition including an olefin polymer and a high melt point hydrocarbon tackifying agent, such compositions unexpectedly provide improved bonding between the layers found in a disposable absorbent article. In particular, such compositions improve the bond between the nonwoven top sheet and the acquisition distribution layer.

公开(公告)号：US20160068721A1

公开(公告)日：2016-03-10

申请号：US14849139

申请日：2015-09-09

Applicant: H.B. FULLER COMPANY

Inventor： David B. Malcolm ,  Kevin P. Davis ,  Yuanyan Gu ,  Peter Remmers ,  Thomas Wittkopf ,  Kristy J. Beckman ,  Mark S. Kroll

IPC: C09J153/00 ,  B32B27/12 ,  B32B27/30 ,  B32B5/02

CPC classification number: A61F13/515 ,  A61F13/15699 ,  A61F13/15739 ,  A61F13/49009 ,  A61F13/4902 ,  A61F13/4963 ,  A61F2013/1591 ,  A61F2013/49022 ,  A61F2013/49049 ,  A61L15/58 ,  B32B5/022 ,  B32B5/08 ,  B32B5/26 ,  B32B7/05 ,  B32B7/12 ,  B32B7/14 ,  B32B27/12 ,  B32B27/302 ,  B32B37/1292 ,  B32B2037/1215 ,  B32B2038/0072 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2262/0253 ,  B32B2262/0276 ,  B32B2262/04 ,  B32B2262/06 ,  B32B2262/14 ,  B32B2305/20 ,  B32B2307/51 ,  B32B2307/54 ,  B32B2307/726 ,  B32B2437/00 ,  B32B2535/00 ,  B32B2555/02 ,  C09J5/06 ,  C09J153/00 ,  C09J153/02 ,  C09J153/025 ,  C09J2400/263 ,  C09J2453/00 ,  C08L25/06

Abstract: This invention claims hot melt adhesive compositions that can be used to form elastic composites that are useful in disposable absorbent articles. The compositions have good elastic recovery and high peel adhesion at a viscosity of less than about 15,000 cps at 177° C. (350° F.). The low viscosity makes it possible to apply the hot melt adhesive at a high line speed and target application to only those areas requiring elastic performance.

Abstract translation: 本发明要求可用于形成可用于一次性吸收制品的弹性复合材料的热熔粘合剂组合物。 该组合物在177℃（350°F）下的粘度小于约15,000cps时具有良好的弹性恢复性和高剥离粘合性。 低粘度使得可以以高线速度将目标应用于仅需要弹性的区域的热熔粘合剂。

公开(公告)号：US20140358100A1

公开(公告)日：2014-12-04

申请号：US14290420

申请日：2014-05-29

Applicant: H.B. Fuller Company

Inventor： Peter Remmers ,  Thomas Wittkopf ,  Ursula Ruediger ,  Carlos Briseno

IPC: A61F13/539 ,  A61F13/15 ,  A61L26/00

CPC classification number: A61L15/24 ,  A61F13/15699 ,  A61F13/49009 ,  A61F13/539 ,  A61F2013/15121 ,  A61F2013/1591 ,  A61F2013/53908 ,  A61L15/585 ,  C08L23/10 ,  C09J123/10 ,  C09J123/12 ,  C08L23/12

Abstract: Disclosed is a disposable absorbent article comprising two substrates; and an adhesive composition including a first polymer that is propylene-based and has a Mw of no greater than about 75,000, and a second polymer that is propylene-based and has a Mw of at least about 100,000, where the adhesive composition is used for at least two applications in the disposable absorbent article and is delivered via a molten bulk tank.

Abstract translation: 公开了一种包含两个基底的一次性吸收制品; 以及粘合剂组合物，其包含基于丙烯并且Mw不大于约75,000的第一聚合物和基于丙烯的Mw为至少约100,000的第二聚合物，其中所述粘合剂组合物用于 在一次性吸收制品中的至少两个应用，并且经由熔融本体罐输送。

公开(公告)号：US12119422B2

公开(公告)日：2024-10-15

申请号：US17593073

申请日：2020-03-06

Applicant: H.B. Fuller Company

Inventor： Peter Remmers ,  Volker K. Kestler ,  Thomas F. Kauffman

IPC: H01L21/67 ,  H01L31/048 ,  H01L31/18

CPC classification number: H01L31/18 ,  H01L21/67126 ,  H01L31/0481

Abstract: A method of encapsulating an electronic component. The method includes applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate. The applicator roll comprises an outer surface and is spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component. The gap controls the thickness of the first layer of encapsulating composition. The first layer of encapsulating composition encapsulates the electronic component on the substrate. An interface between the surface of the electronic component and the encapsulating composition being substantially free of voids.

公开(公告)号：US11242470B2

公开(公告)日：2022-02-08

申请号：US16206300

申请日：2018-11-30

Applicant: H.B. Fuller Company

Inventor： Steven R. Vaughan ,  Kevin P. Davis ,  Thomas Wittkopf ,  Peter Remmers ,  Seth Urtel

IPC: C09J7/35 ,  C09J123/12 ,  C09J11/08 ,  C09J11/06 ,  A61F13/539 ,  C09J123/14 ,  A61F13/537 ,  A61F13/15

Abstract: The invention includes a hot melt adhesive composition including an olefin polymer and a high melt point hydrocarbon tackifying agent, such compositions unexpectedly provide improved bonding between the layers found in a disposable absorbent article. In particular, such compositions improve the bond between the nonwoven top sheet and the acquisition distribution layer.