Material management in substrate processing
    1.
    发明申请
    Material management in substrate processing 审中-公开
    衬底加工中的材料管理

    公开(公告)号:US20060292846A1

    公开(公告)日:2006-12-28

    申请号:US11418800

    申请日:2006-05-05

    IPC分类号: H01L29/00 H01L21/44 C23C16/00

    摘要: Substrate processing systems and methods are described for processing substrates. The processing includes transferring electronic identification (ID) information of one or more materials contained in one or more processing subsystems. Materials are transferred between one or more material containers and respective one or more process cells during transfer events of the processing. Information or data of the transferred materials is automatically captured during the transfer events. Processing systems described include at least one identification (ID) device coupled to the subsystems. A data device is coupled to the ID device and to a device that performs the material transfers. The data device is configured to send or receive identification information of the subsystems from the ID device, and to send or receive information of transferred material from the material handling device.

    摘要翻译: 描述了用于处理衬底的衬底处理系统和方法。 该处理包括传送包含在一个或多个处理子系统中的一个或多个材料的电子识别(ID)信息。 在处理的转移事件期间,材料在一个或多个材料容器和相应的一个或多个处理单元之间转移。 传输材料的信息或数据在传输事件期间自动捕获。 所描述的处理系统包括耦合到子系统的至少一个识别(ID)设备。 数据设备耦合到ID设备和执行物料传送的设备。 数据设备被配置为从ID设备发送或接收子系统的识别信息,并且从物料处理设备发送或接收传送的材料的信息。

    METHOD AND APPARATUS FOR COMBINATORIALLY VARYING MATERIALS, UNIT PROCESS AND PROCESS SEQUENCE
    2.
    发明申请
    METHOD AND APPARATUS FOR COMBINATORIALLY VARYING MATERIALS, UNIT PROCESS AND PROCESS SEQUENCE 审中-公开
    用于组合变化材料的方法和装置,单元过程和过程序列

    公开(公告)号:US20070202614A1

    公开(公告)日:2007-08-30

    申请号:US11674132

    申请日:2007-02-12

    IPC分类号: H01L21/66

    摘要: A method for analyzing and optimizing fabrication techniques using variations of materials, unit processes, and process sequences is provided. In the method, a subset of a semiconductor manufacturing process sequence and build is analyzed for optimization. During the execution of the subset of the manufacturing process sequence, the materials, unit processes, and process sequence for creating a certain structure is varied. During the combinatorial processing, the materials, unit processes, or process sequence is varied between the discrete regions of a semiconductor substrate, wherein within each of the regions the process yields a substantially uniform or consistent result that is representative of a result of a commercial manufacturing operation. A tool for optimizing a process sequence is also provided.

    摘要翻译: 提供了一种使用材料,单元过程和工艺顺序的变化来分析和优化制造技术的方法。 在该方法中,分析半导体制造过程序列和构建的子集以进行优化。 在执行制造过程序列的子集期间,用于创建特定结构的材料,单元过程和过程顺序是变化的。 在组合处理期间,材料,单元工艺或工艺顺序在半导体衬底的离散区域之间变化,其中在每个区域内,该工艺产生基本均匀或一致的结果,其代表商业制造的结果 操作。 还提供了用于优化处理顺序的工具。

    CHEMICAL MECHANICAL POLISHING TEST STRUCTURES AND METHODS FOR INSPECTING THE SAME
    4.
    发明申请
    CHEMICAL MECHANICAL POLISHING TEST STRUCTURES AND METHODS FOR INSPECTING THE SAME 有权
    化学机械抛光试验结构及其检测方法

    公开(公告)号:US20070111342A1

    公开(公告)日:2007-05-17

    申请号:US11621512

    申请日:2007-01-09

    IPC分类号: H01L21/66 H01L23/58

    摘要: Disclosed is a semiconductor die having a plurality of dummy fillings positioned and sized to minimize defects during chemical mechanical polishing is disclosed. At least one of the dummy fillings is coupled to an underlying test structure. In a preferred embodiment, the semiconductor die also includes a plurality of conductive layers and a substrate. The underlying test structure includes a first layer portion formed from a first one of the plurality of conductive layer and a via coupling the first layer portion to the at least one dummy filling. In another aspect, the underlying test structure also has a via coupling the first layer portion to the substrate, and the underlying test structure comprises a plurality of layer portions and vias to form a multilevel test structure.

    摘要翻译: 公开了一种具有多个虚拟填料的半导体管芯,其中所述多个虚拟填料的位置和尺寸被设计成使化学机械抛光期间的缺陷最小化。 虚拟填充物中的至少一个耦合到底层测试结构。 在优选实施例中,半导体管芯还包括多个导电层和衬底。 下面的测试结构包括由多个导电层中的第一个形成的第一层部分和将第一层部分连接到至少一个虚拟填充物的通孔。 在另一方面,基础测试结构还具有将第一层部分耦合到衬底的通孔,并且底层测试结构包括多个层部分和通孔以形成多层测试结构。

    Media servowriting system
    5.
    发明申请
    Media servowriting system 审中-公开
    媒体伺服系统

    公开(公告)号:US20060119977A1

    公开(公告)日:2006-06-08

    申请号:US11239557

    申请日:2005-09-28

    IPC分类号: G11B5/596 G11B21/02 G11B27/36

    CPC分类号: G11B5/59633

    摘要: A system and methods for efficiently performing media writing functions is disclosed. The system and methods include: detecting media movement with respect to a base and heads during reading and writing, and moving the heads in response; using an interferometer, such as a dual beam differential interferometer, to dynamically monitor disk position and address perceived errors; and minimizing repeatable and non repeatable runout error by writing data, such as servo bursts, in multiple revolutions to average adverse runout conditions. The present system has the ability to use an interferometer to enhance media certification and perform on line, in situ monitoring of the media, and includes shrouding, head mounting, disk biasing, and related mechanical aspects beneficial to media writing.

    摘要翻译: 公开了一种用于有效执行媒体写入功能的系统和方法。 该系统和方法包括:在读取和写入期间相对于基座和头部检测媒体移动,并且响应地移动头部; 使用诸如双光束差分干涉仪的干涉仪来动态地监测磁盘位置并解决感知到的错误; 并通过以多次旋转将数据(例如伺服脉冲串)写入平均不利的跳动条件来最小化可重复和不可重复的跳动误差。 本系统能够使用干涉仪来增强媒体认证,并在线进行现场监控媒体,并且包括遮蔽,头部安装,磁盘偏置以及有利于媒体写作的相关机械方面。