摘要:
Substrate processing systems and methods are described for processing substrates. The processing includes transferring electronic identification (ID) information of one or more materials contained in one or more processing subsystems. Materials are transferred between one or more material containers and respective one or more process cells during transfer events of the processing. Information or data of the transferred materials is automatically captured during the transfer events. Processing systems described include at least one identification (ID) device coupled to the subsystems. A data device is coupled to the ID device and to a device that performs the material transfers. The data device is configured to send or receive identification information of the subsystems from the ID device, and to send or receive information of transferred material from the material handling device.
摘要:
A method for analyzing and optimizing fabrication techniques using variations of materials, unit processes, and process sequences is provided. In the method, a subset of a semiconductor manufacturing process sequence and build is analyzed for optimization. During the execution of the subset of the manufacturing process sequence, the materials, unit processes, and process sequence for creating a certain structure is varied. During the combinatorial processing, the materials, unit processes, or process sequence is varied between the discrete regions of a semiconductor substrate, wherein within each of the regions the process yields a substantially uniform or consistent result that is representative of a result of a commercial manufacturing operation. A tool for optimizing a process sequence is also provided.
摘要:
A method for analyzing and optimizing fabrication techniques using variations of materials, unit processes, and process sequences is provided. In the method, a subset of a semiconductor manufacturing process sequence and build is analyzed for optimization. During the execution of the subset of the manufacturing process sequence, the materials, unit processes, and process sequence for creating a certain structure is varied. During the combinatorial processing, the materials, unit processes, or process sequence is varied between the discrete regions of a semiconductor substrate, wherein within each of the regions the process yields a substantially uniform or consistent result that is representative of a result of a commercial manufacturing operation. A tool for optimizing a process sequence is also provided.
摘要:
Disclosed is a semiconductor die having a plurality of dummy fillings positioned and sized to minimize defects during chemical mechanical polishing is disclosed. At least one of the dummy fillings is coupled to an underlying test structure. In a preferred embodiment, the semiconductor die also includes a plurality of conductive layers and a substrate. The underlying test structure includes a first layer portion formed from a first one of the plurality of conductive layer and a via coupling the first layer portion to the at least one dummy filling. In another aspect, the underlying test structure also has a via coupling the first layer portion to the substrate, and the underlying test structure comprises a plurality of layer portions and vias to form a multilevel test structure.
摘要:
A system and methods for efficiently performing media writing functions is disclosed. The system and methods include: detecting media movement with respect to a base and heads during reading and writing, and moving the heads in response; using an interferometer, such as a dual beam differential interferometer, to dynamically monitor disk position and address perceived errors; and minimizing repeatable and non repeatable runout error by writing data, such as servo bursts, in multiple revolutions to average adverse runout conditions. The present system has the ability to use an interferometer to enhance media certification and perform on line, in situ monitoring of the media, and includes shrouding, head mounting, disk biasing, and related mechanical aspects beneficial to media writing.
摘要:
Disclosed is a method of inspecting a sample. The sample is scanned in a first direction with at least one particle beam. The sample is scanned in a second direction with at least one particle beam. The second direction is at an angle to the first direction. The number of defects per an area of the sample are found as a result of the first scan, and the position of one or more of the found defects is determined from the second scan. In a specific embodiment, the sample includes a test structure having a plurality of test elements thereon. A first portion of the test elements is exposed to the beam during the first scan to identify test elements having defects, and a second portion of the test elements is exposed during the second scan to isolate and characterize the defect.