METHODS FOR MANUFACTURING MAGNETORESISTIVE STACK DEVICES

    公开(公告)号:US20210328138A1

    公开(公告)日:2021-10-21

    申请号:US17270151

    申请日:2019-08-22

    IPC分类号: H01L43/12 H01L43/02

    摘要: Fabrication of a magnetic memory element, including a via (125) in an interlevel dielectric layer (120), providing an electrical connection between an underlying metal region (110) and a magnetoresistive stack device, such as a magnetic tunnel junction (150), involves forming a transition metal layer (130) in the via by atomic layer deposition. The via optionally includes a tantalum-rich layer (140) above, and/or a cap layer (115) below, the transition metal layer, and may have a diameter less than or equal than a diameter of the magnetoresistive stack device.

    MAGNETORESISTIVE DEVICES AND METHODS THEREFOR

    公开(公告)号:US20210359201A1

    公开(公告)日:2021-11-18

    申请号:US17285122

    申请日:2019-10-29

    摘要: A magnetoresistive stack includes a fixed magnetic region, one or more dielectric layers disposed on and in contact with the fixed magnetic region, and a free magnetic region disposed above the one or mom dielectric layers. The fixed magnetic region may include a first ferromagnetic region, a coupling layer, a second ferromagnetic region, a transition layer disposed, a reference layer, and at least one interfacial layer disposed above the second ferromagnetic region. Another interfacial layer may be disposed between the one or more dielectric layers and the free magnetic region.