公开(公告)号：US20090224383A1

公开(公告)日：2009-09-10

申请号：US12044314

申请日：2008-03-07

Applicant: Erwin Victor Cruz ,  Maria Cristina Estacio

Inventor： Erwin Victor Cruz ,  Maria Cristina Estacio

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/49562 ,  H01L23/49524 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37147 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A clip structure and semiconductor die package. The clip structure includes a first portion and a second portion, with a connecting structure located between the first and second portion. The clip structure is substantially planar. The semiconductor die package includes a semiconductor die located between a leadframe structure and a clip structure. Slots are formed within the molding material covering portions of the semiconductor die package. The slots are located between a first portion and the second portion of the clip structure, and the slot overlap with the semiconductor die.

Abstract translation: 夹子结构和半导体管芯封装。 夹子结构包括第一部分和第二部分，其中连接结构位于第一部分和第二部分之间。 夹子结构基本上是平面的。 半导体管芯封装包括位于引线框架结构和夹子结构之间的半导体管芯。 在覆盖半导体管芯封装的部分的成型材料内形成槽。 槽位于夹结构的第一部分和第二部分之间，并且槽与半导体管芯重叠。

公开(公告)号：US08513059B2

公开(公告)日：2013-08-20

申请号：US13186246

申请日：2011-07-19

Applicant: Erwin Victor Cruz ,  Maria Cristina B. Estacio

Inventor： Erwin Victor Cruz ,  Maria Cristina B. Estacio

IPC: H01L21/00

CPC classification number: H01L23/49562 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/03912 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40249 ,  H01L2224/4103 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.

Abstract translation: 公开了一种制造预制夹子结构的方法。 该方法包括获得第一夹子和第二夹子，以及围绕第一夹子形成包括第一表面的模制材料，并且第二夹子包括第二表面。 第一夹子结构的第一表面和第二夹子结构的第二表面通过模制材料暴露，然后形成预制的夹子结构。

公开(公告)号：US20090057855A1

公开(公告)日：2009-03-05

申请号：US11847670

申请日：2007-08-30

Applicant: Maria Clemens Quinones ,  Erwin Victor Cruz ,  Marvin Gestole ,  Ruben P. Madrid ,  Connie N. Tangpuz

Inventor： Maria Clemens Quinones ,  Erwin Victor Cruz ,  Marvin Gestole ,  Ruben P. Madrid ,  Connie N. Tangpuz

IPC: H01L23/495 ,  H01L21/00

CPC classification number: H01L23/49562 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37599 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/73153 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: A semiconductor die package. It includes a semiconductor die including a first surface and a second surface opposite the first surface, an optional conductive structure, and a leadframe structure. The leadframe structure comprises a central portion suitable for supporting the semiconductor die, and a plurality of stand-off structures coupled to the central portion of the leadframe structure. The stand-off structures can support the conductive structure, and the conductive structure is attached to the second surface of the semiconductor die.

Abstract translation: 半导体管芯封装。 其包括半导体管芯，其包括第一表面和与第一表面相对的第二表面，可选的导电结构和引线框架结构。 引线框架结构包括适于支撑半导体管芯的中心部分，以及耦合到引线框架结构的中心部分的多个隔离结构。 支架结构可以支撑导电结构，并且导电结构附着到半导体管芯的第二表面。

公开(公告)号：US20100258924A1

公开(公告)日：2010-10-14

申请号：US12822932

申请日：2010-06-24

Applicant: Erwin Victor Cruz ,  Maria Cristina B. Estacio

Inventor： Erwin Victor Cruz ,  Maria Cristina B. Estacio

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/49562 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/03912 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40249 ,  H01L2224/4103 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.

公开(公告)号：US20110272794A1

公开(公告)日：2011-11-10

申请号：US13186246

申请日：2011-07-19

Applicant: Erwin Victor Cruz ,  Maria Cristina B. Estacio

Inventor： Erwin Victor Cruz ,  Maria Cristina B. Estacio

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/49562 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/03912 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40249 ,  H01L2224/4103 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.

Abstract translation: 公开了一种制造预制夹子结构的方法。 该方法包括获得第一夹子和第二夹子，以及围绕第一夹子形成包括第一表面的模制材料，并且第二夹子包括第二表面。 第一夹子结构的第一表面和第二夹子结构的第二表面通过模制材料暴露，然后形成预制的夹子结构。

公开(公告)号：US08008759B2

公开(公告)日：2011-08-30

申请号：US12822932

申请日：2010-06-24

Applicant: Erwin Victor Cruz ,  Maria Cristina B. Estacio

Inventor： Erwin Victor Cruz ,  Maria Cristina B. Estacio

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/49562 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/03912 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40249 ,  H01L2224/4103 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.

Abstract translation: 公开了一种制造预制夹子结构的方法。 该方法包括获得第一夹子和第二夹子，以及围绕第一夹子形成包括第一表面的模制材料，并且第二夹子包括第二表面。 第一夹子结构的第一表面和第二夹子结构的第二表面通过模制材料暴露，然后形成预制的夹子结构。

公开(公告)号：US20080173991A1

公开(公告)日：2008-07-24

申请号：US11626503

申请日：2007-01-24

Applicant: Erwin Victor Cruz ,  Maria Cristina B. Estacio

Inventor： Erwin Victor Cruz ,  Maria Cristina B. Estacio

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L23/49562 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/03912 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40249 ,  H01L2224/4103 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.

Abstract translation: 公开了一种制造预制夹子结构的方法。 该方法包括获得第一夹子和第二夹子，以及围绕第一夹子形成包括第一表面的模制材料，并且第二夹子包括第二表面。 第一夹子结构的第一表面和第二夹子结构的第二表面通过模制材料暴露，然后形成预制的夹子结构。

公开(公告)号：US20060189116A1

公开(公告)日：2006-08-24

申请号：US11404650

申请日：2006-04-14

Applicant: Rajeev Joshi ,  Consuelo Tangpuz ,  Margie Rios ,  Erwin Victor Cruz

Inventor： Rajeev Joshi ,  Consuelo Tangpuz ,  Margie Rios ,  Erwin Victor Cruz

IPC: H01L21/44

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2224/05124

Abstract: A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a core and an oxidation-resistant coating. The formed ball is pressed to the conductive region on the semiconductor die. The coated wire is cut, thereby leaving a conductive stud bump on the conductive region, where the conductive stud bump includes an inner conductive portion and an outer oxidation-resistant layer.

公开(公告)号：US07838340B2

公开(公告)日：2010-11-23

申请号：US12822675

申请日：2010-06-24

Applicant: Erwin Victor Cruz ,  Maria Cristina B. Estacio

Inventor： Erwin Victor Cruz ,  Maria Cristina B. Estacio

IPC: H01L21/00

CPC classification number: H01L23/49562 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/03912 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40249 ,  H01L2224/4103 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.

公开(公告)号：US20100258923A1

公开(公告)日：2010-10-14

申请号：US12822675

申请日：2010-06-24

Applicant: Erwin Victor Cruz ,  Maria Cristina B. Estacio

Inventor： Erwin Victor Cruz ,  Maria Cristina B. Estacio

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/49562 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/03912 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40249 ,  H01L2224/4103 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.

Abstract translation: 公开了一种制造预制夹子结构的方法。 该方法包括获得第一夹子和第二夹子，以及围绕第一夹子形成包括第一表面的模制材料，而第二夹子包括第二表面。 第一夹子结构的第一表面和第二夹子结构的第二表面通过模制材料暴露，然后形成预制的夹子结构。