公开(公告)号：US09768107B2

公开(公告)日：2017-09-19

申请号：US15217405

申请日：2016-07-22

Applicant: Emmett Howard ,  Nicholas Munizza ,  Paul Yee

Inventor： Emmett Howard ,  Nicholas Munizza ,  Paul Yee

IPC: H01L21/58 ,  H01L23/498 ,  H01L21/683 ,  H01L21/48 ,  H01L21/52 ,  H01L21/20 ,  H01L51/00

CPC classification number: H01L23/4985 ,  H01L21/2007 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/6835 ,  H01L51/0097 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2221/68386

Abstract: Some embodiments include a method. The method can include providing a carrier substrate, providing a release layer over the carrier substrate, and providing a device substrate over the carrier substrate and the release layer. Providing the device substrate can include bonding the device substrate to the carrier substrate, and bonding the device substrate to the release layer. Further, providing the release layer can include bonding the release layer to the carrier substrate. Meanwhile, the release layer can include polymethylmethacrylate, and the device substrate can be bonded to the carrier substrate with a first adhesion strength, the device substrate can be bonded to the release layer with a second adhesion strength less than the first adhesion strength, and the release layer can be bonded to the carrier substrate with a third adhesion strength greater than the second adhesion strength. Other embodiments of related methods and devices are also disclosed.

公开(公告)号：US20170062380A1

公开(公告)日：2017-03-02

申请号：US15349511

申请日：2016-11-11

Applicant: Emmett Howard ,  Nicholas Munizza ,  Paul Yee ,  Michael Marrs

Inventor： Emmett Howard ,  Nicholas Munizza ,  Paul Yee ,  Michael Marrs

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L21/6835 ,  H01L24/29 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2224/8309 ,  H01L2224/83359

Abstract: Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.

Abstract translation: 一些实施例包括一种方法。 该方法可以包括：提供载体衬底; 在所述载体基底上提供粘附修饰层; 提供器件衬底; 以及将所述器件衬底和所述载体衬底耦合在一起时，当所述器件衬底和所述载体衬底耦合在一起时，所述粘附修饰层位于所述器件衬底和所述载体衬底之间。 在这些实施例中，粘合改性层可以被配置成使得器件衬底通过粘合改性层间接地与载体衬底相互耦合，第一接合力大于第二结合力，器件衬底与 载体基材不存在粘附改性层。 还公开了相关方法和装置的其它实施例。

公开(公告)号：US09953951B2

公开(公告)日：2018-04-24

申请号：US15349511

申请日：2016-11-11

Applicant: Emmett Howard ,  Nicholas Munizza ,  Paul Yee ,  Michael Marrs

Inventor： Emmett Howard ,  Nicholas Munizza ,  Paul Yee ,  Michael Marrs

IPC: H01L23/00 ,  H01L21/02 ,  H01L33/12 ,  H01L21/683

CPC classification number: H01L24/83 ,  H01L21/6835 ,  H01L24/29 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2224/8309 ,  H01L2224/83359

Abstract: Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.

公开(公告)号：US20160329268A1

公开(公告)日：2016-11-10

申请号：US15217405

申请日：2016-07-22

Applicant: Emmett Howard ,  Nicholas Munizza ,  Paul Yee

Inventor： Emmett Howard ,  Nicholas Munizza ,  Paul Yee

IPC: H01L23/498 ,  H01L21/683 ,  H01L21/48

CPC classification number: H01L23/4985 ,  H01L21/2007 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/6835 ,  H01L51/0097 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2221/68386

Abstract: Some embodiments include a method. The method can include providing a carrier substrate, providing a release layer over the carrier substrate, and providing a device substrate over the carrier substrate and the release layer. Providing the device substrate can include bonding the device substrate to the carrier substrate, and bonding the device substrate to the release layer. Further, providing the release layer can include bonding the release layer to the carrier substrate. Meanwhile, the release layer can include polymethylmethacrylate, and the device substrate can be bonded to the carrier substrate with a first adhesion strength, the device substrate can be bonded to the release layer with a second adhesion strength less than the first adhesion strength, and the release layer can be bonded to the carrier substrate with a third adhesion strength greater than the second adhesion strength. Other embodiments of related methods and devices are also disclosed.

Abstract translation: 一些实施例包括一种方法。 该方法可以包括提供载体衬底，在载体衬底上提供释放层，以及在载体衬底和释放层上提供器件衬底。 提供器件衬底可以包括将器件衬底接合到载体衬底，以及将器件衬底接合到释放层。 此外，提供释放层可以包括将释放层粘合到载体基底。 同时，脱模层可以包括聚甲基丙烯酸甲酯，并且装置基板可以以第一粘附强度结合到载体基板上，装置基板可以以小于第一粘合强度的第二粘合强度结合到剥离层，并且 剥离层可以以大于第二粘合强度的第三粘合强度结合到载体基材。 还公开了相关方法和装置的其它实施例。

公开(公告)号：US20140254113A1

公开(公告)日：2014-09-11

申请号：US14288771

申请日：2014-05-28

Applicant: Emmett Howard ,  Douglas E. Loy ,  Nicholas Munizza

Inventor： Emmett Howard ,  Douglas E. Loy ,  Nicholas Munizza

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/02

CPC classification number: H05K1/0393 ,  H05K3/007 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/0191 ,  H05K2203/1383 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T428/31507 ,  Y10T428/31616 ,  Y10T428/31623 ,  Y10T428/31645

Abstract: Some embodiments include a method of providing an electronic device structure. Other embodiments for related methods and electronic device structures are also disclosed.

Abstract translation: 一些实施例包括提供电子设备结构的方法。 还公开了相关方法和电子器件结构的其它实施例。

公开(公告)号：US20070123134A1

公开(公告)日：2007-05-31

申请号：US11292408

申请日：2005-11-30

Applicant: Emmett Howard ,  Kenneth Dean ,  Dirk Jordan

Inventor： Emmett Howard ,  Kenneth Dean ,  Dirk Jordan

IPC: H01J9/24 ,  H01J9/00

CPC classification number: H01J9/025 ,  H01J3/021 ,  H01J9/148 ,  H01J29/481

Abstract: A method is provided for preventing electron emission from a sidewall (34) of a gate electrode (20) and the edge (28) of the gate electrode stack of a field emission device (10), the gate electrode (20) having a surface (24) distally disposed from an anode (40) and a side (26) proximate to emission electrodes (38). The method comprises growing dielectric material (22) over the surface (24) and side (26) of the gate electrode (20), and performing an anisotropic etch (32) normal to the surface (24) to remove the dielectric material (22) from the surface (24) and leaving at least a portion of the dielectric material (22) on the side (26) of the gate electrode (20) and edge (28) of the gate electrode stack.

Abstract translation: 提供了一种防止来自栅极电极（20）的侧壁（34）和场致发射器件（10）的栅电极堆叠的边缘（28）的电子发射的方法，栅电极（20）具有表面 （40）和靠近发射电极（38）的侧面（26）远离地设置的（24）。 该方法包括在栅电极（20）的表面（24）和侧面（26）上方生长电介质材料（22），并且执行垂直于表面（24）的各向异性蚀刻（32）以移除电介质材料 ），并且在栅电极（20）的侧面（26）和栅极电极叠层的边缘（28）上留下介电材料（22）的至少一部分。

公开(公告)号：US5804909A

公开(公告)日：1998-09-08

申请号：US832841

申请日：1997-04-04

Applicant: Thomas Nilsson ,  John Song ,  Emmett Howard

Inventor： Thomas Nilsson ,  John Song ,  Emmett Howard

IPC: H01J3/02 ,  H01J19/24

CPC classification number: H01J3/022 ,  H01J2201/30423 ,  H01J2201/319

Abstract: An edge emission FED (100) includes a supporting substrate (110); a cathode (120) disposed on the supporting substrate (110); a ballast layer (130) disposed on the cathode (120); an emissive layer (140) disposed on the ballast layer (130) and defining an emissive edge (183); a field shaper layer (150) disposed on the emissive layer (140); a dielectric layer (160) disposed on the field shaper layer (150); a gate extraction electrode (170) disposed on the dielectric layer (160); an emission well (180) defined by the ballast layer (130), the emissive edge (183), the field shaper layer (150), the dielectric layer (160), and the gate extraction electrode (170); and an anode plate (188) opposing the gate extraction electrode (170).

Abstract translation: 边缘发射FED（100）包括支撑衬底（110）; 设置在所述支撑基板（110）上的阴极（120）; 设置在阴极（120）上的镇流器层（130）; 设置在所述镇流器层（130）上并限定发射边缘（183）的发射层（140）; 设置在所述发射层（140）上的场整形器层（150）; 设置在所述场整形器层（150）上的电介质层（160）; 设置在介电层（160）上的栅极引出电极（170）; 由镇流器层（130），发射边缘（183），场整形器层（150），电介质层（160）和栅极引出电极（170）限定的发射阱（180）。 以及与栅极引出电极（170）相对的阳极板（188）。

公开(公告)号：US20060208625A1

公开(公告)日：2006-09-21

申请号：US11082715

申请日：2005-03-16

Applicant: Kenneth Dean ,  Bernard Coll ,  Emmett Howard

Inventor： Kenneth Dean ,  Bernard Coll ,  Emmett Howard

IPC: H01J1/62 ,  H01J63/04

CPC classification number: H01J29/08 ,  H01J31/127

Abstract: An apparatus is provided for reducing color bleed in a flat panel display. The apparatus comprises an anode (30) with a plurality of phosphors (28) of at least two colors sequentially disposed thereon. A cathode (14) is arranged in parallel opposed position to and separated from the anode (30) and contains a plurality of pads (40) of emitters. Each pad (40) is disposed on the cathode (14) in spaced relationship to and aligned with one of the at least two colors, respectively, wherein electrons from each of the plurality of pads of emitters that drift from its intended phosphor (28) are encouraged to drift toward an adjacent phosphor (28) of the same color.

Abstract translation: 提供一种用于减少平板显示器中的颜色渗色的装置。 该装置包括具有顺序地设置在其上的至少两种颜色的多个荧光体（28）的阳极（30）。 阴极（14）被布置成与阳极（30）相对并且与阳极（30）分离并且包含多个发射器的焊盘（40）。 每个焊盘（40）分别与阴极（14）隔开关系并且与至少两种颜色中的一种对准配置，其中来自发射器的多个焊盘中的每一个的电子从其预期的荧光体（28）漂移， 被鼓励漂移到相同颜色的相邻磷光体（28）。

公开(公告)号：US20170243810A1

公开(公告)日：2017-08-24

申请号：US15590843

申请日：2017-05-09

Applicant: Joseph Smith ,  Emmett Howard ,  Jennifer Blain Christen ,  Yong-Kyun Lee

Inventor： Joseph Smith ,  Emmett Howard ,  Jennifer Blain Christen ,  Yong-Kyun Lee

IPC: H01L23/498 ,  H01L27/146

CPC classification number: H01L23/4985 ,  A61B2562/02 ,  A61B2562/164 ,  H01L21/30604 ,  H01L21/6835 ,  H01L21/768 ,  H01L23/15 ,  H01L23/3192 ,  H01L27/1218 ,  H01L27/1262 ,  H01L27/14603 ,  H01L27/14636 ,  H01L27/153 ,  H01L27/156 ,  H01L27/3293 ,  H01L29/786 ,  H01L29/78603 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Some embodiments include a method of providing an electronic device. The method can comprise: providing a first device substrate; providing one or more first active sections over a second side of the first device substrate at a first device portion of the first device substrate; and after providing the first active section(s) over the second side of the first device substrate at the first device portion, folding a first perimeter portion of the first device substrate toward the first device portion at a first side of the first device substrate so that a first edge portion remains to at least partially frame the first device portion. The first edge portion can comprise a first edge portion width dimension smaller than a first smallest cross dimension of one or more pixel(s) of one or more semiconductor device(s) of the first active section(s). Other embodiments of related methods and devices are also disclosed.

公开(公告)号：US09741742B2

公开(公告)日：2017-08-22

申请号：US14979087

申请日：2015-12-22

Applicant: Joseph Smith ,  Emmett Howard ,  Jennifer Blain Christen

Inventor： Joseph Smith ,  Emmett Howard ,  Jennifer Blain Christen

IPC: H01L21/44 ,  H01L27/12 ,  H01L21/306 ,  H01L29/786 ,  H01L23/498 ,  H01L21/683 ,  H01L21/768 ,  H01L27/146 ,  H01L27/15 ,  H01L23/31 ,  H01L23/15

CPC classification number: H01L23/4985 ,  A61B2562/02 ,  A61B2562/164 ,  H01L21/30604 ,  H01L21/6835 ,  H01L21/768 ,  H01L23/15 ,  H01L23/3192 ,  H01L27/1218 ,  H01L27/1262 ,  H01L27/14603 ,  H01L27/14636 ,  H01L27/153 ,  H01L27/156 ,  H01L29/786 ,  H01L29/78603 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Some embodiments include a method of providing an electronic device. The method includes: (i) providing a carrier substrate, (ii) providing a device substrate comprising a first side and a second side opposite the first side, the device substrate having a flexible substrate, (iii) coupling the first side of the device substrate to the carrier substrate; and (iv) after coupling the first side of the device substrate to the carrier substrate, providing two or more active sections over the second side of the device substrate, each active section of the two or more active sections being spatially separate from each other and having at least one semiconductor device. Other embodiments of related methods and devices are also disclosed.