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    METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF
    4.
    发明申请
    METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF 有权
    提供柔性半导体器件及其柔性半导体器件的方法

    公开(公告)号：US20170062380A1

    公开(公告)日：2017-03-02

    申请号：US15349511

    申请日：2016-11-11

    申请人： Emmett Howard ,  Nicholas Munizza ,  Paul Yee ,  Michael Marrs

    发明人： Emmett Howard ,  Nicholas Munizza ,  Paul Yee ,  Michael Marrs

    IPC分类号： H01L23/00

    CPC分类号： H01L24/83 ,  H01L21/6835 ,  H01L24/29 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2224/8309 ,  H01L2224/83359

    摘要： Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.

    摘要翻译： 一些实施例包括一种方法。 该方法可以包括：提供载体衬底; 在所述载体基底上提供粘附修饰层; 提供器件衬底; 以及将所述器件衬底和所述载体衬底耦合在一起时，当所述器件衬底和所述载体衬底耦合在一起时，所述粘附修饰层位于所述器件衬底和所述载体衬底之间。 在这些实施例中，粘合改性层可以被配置成使得器件衬底通过粘合改性层间接地与载体衬底相互耦合，第一接合力大于第二结合力，器件衬底与 载体基材不存在粘附改性层。 还公开了相关方法和装置的其它实施例。

    METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF
    7.
    发明申请
    METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF 有权
    提供柔性半导体器件及其柔性半导体器件的方法

    公开(公告)号：US20160329268A1

    公开(公告)日：2016-11-10

    申请号：US15217405

    申请日：2016-07-22

    申请人： Emmett Howard ,  Nicholas Munizza ,  Paul Yee

    发明人： Emmett Howard ,  Nicholas Munizza ,  Paul Yee

    IPC分类号： H01L23/498 ,  H01L21/683 ,  H01L21/48

    CPC分类号： H01L23/4985 ,  H01L21/2007 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/6835 ,  H01L51/0097 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2221/68386

    摘要： Some embodiments include a method. The method can include providing a carrier substrate, providing a release layer over the carrier substrate, and providing a device substrate over the carrier substrate and the release layer. Providing the device substrate can include bonding the device substrate to the carrier substrate, and bonding the device substrate to the release layer. Further, providing the release layer can include bonding the release layer to the carrier substrate. Meanwhile, the release layer can include polymethylmethacrylate, and the device substrate can be bonded to the carrier substrate with a first adhesion strength, the device substrate can be bonded to the release layer with a second adhesion strength less than the first adhesion strength, and the release layer can be bonded to the carrier substrate with a third adhesion strength greater than the second adhesion strength. Other embodiments of related methods and devices are also disclosed.

    摘要翻译： 一些实施例包括一种方法。 该方法可以包括提供载体衬底，在载体衬底上提供释放层，以及在载体衬底和释放层上提供器件衬底。 提供器件衬底可以包括将器件衬底接合到载体衬底，以及将器件衬底接合到释放层。 此外，提供释放层可以包括将释放层粘合到载体基底。 同时，脱模层可以包括聚甲基丙烯酸甲酯，并且装置基板可以以第一粘附强度结合到载体基板上，装置基板可以以小于第一粘合强度的第二粘合强度结合到剥离层，并且 剥离层可以以大于第二粘合强度的第三粘合强度结合到载体基材。 还公开了相关方法和装置的其它实施例。