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1.发明申请公开(公告)号：US20250154325A1
公开(公告)日：2025-05-15
申请号：US18943377
申请日：2024-11-11
Inventor： GWANG-MUN CHOI , Yong-Sung EOM , Jiho JOO , KWANG-SEONG CHOI , Seok-Hwan MOON , Jungho SHIN , Jin-Hyuk OH , CHANMI LEE , Ki-Seok JANG
Abstract: Provided is an organic-inorganic compound, and the organic-inorganic compound contains a curable reactive group and includes a structure represented by Formula 1 below:
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公开(公告)号：US20230027892A1
公开(公告)日：2023-01-26
申请号：US17864774
申请日：2022-07-14
Inventor： KWANG-SEONG CHOI , Yong-Sung EOM , Jiho JOO , GWANG-MUN CHOI , Seok-Hwan MOON , Ho-Gyeong YUN , CHANMI LEE , Ki-Seok JANG
IPC: H01L33/62 , H01L25/075 , H01L33/00
Abstract: Provided is an electronic device including a plurality of substrate electrodes on a substrate, the substrate electrodes including initial electrodes and spare electrodes, a bonding material covering the initial electrodes and the spare electrodes, module structures respectively provided on first initial electrodes of the initial electrodes, and solders between each of the first initial electrodes and each of the module structures, wherein the spare electrodes include second spare electrodes, wherein the module structures are not provided on the second spare electrodes, wherein the bonding material on the first initial electrodes is harder than the bonding material on the second spare electrodes.
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3.发明申请公开(公告)号：US20210358885A1
公开(公告)日：2021-11-18
申请号：US17387800
申请日：2021-07-28
Inventor： Kwang-Seong CHOI , Yong Sung EOM , KeonSoo JANG , Seok-Hwan MOON , Hyun-cheol BAE
IPC: H01L23/00
Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.
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公开(公告)号：US20150194363A1
公开(公告)日：2015-07-09
申请号：US14324724
申请日：2014-07-07
Inventor： Chi Hoon JUN , Sang Choon KO , Seok-Hwan MOON , Woojin CHANG , Sung-Bum BAE , Young Rak PARK , Je Ho NA , Jae Kyoung MUN , Eun Soo NAM
IPC: H01L23/367 , H01L21/3205 , H01L23/467 , H01L21/3065 , H01L21/308 , H01L23/473
CPC classification number: H01L21/3065 , H01L21/3081 , H01L21/32051 , H01L23/367 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes: an active region provided on a substrate; an inlet channel formed as a single cavity buried in one side of the substrate; an outlet channel formed as a single cavity buried in the other side of the substrate; a micro channel array comprising a plurality of micro channels, wherein the plurality of micro channels are formed as a plurality of cavities buried in the substrate, and one end of the micro channel array is connected to a side of the inlet channel and the other end of the micro channel array is connected to a side of the outlet channel; and a micro heat sink array separating the micro channels from one another.
Abstract translation: 提供半导体器件及其制造方法。 半导体器件包括：设置在衬底上的有源区; 入口通道形成为隐藏在所述基板的一侧中的单个腔; 出口通道形成为埋在基板的另一侧中的单个腔; 微通道阵列，其包括多个微通道，其中所述多个微通道形成为埋在所述衬底中的多个空腔，并且所述微通道阵列的一端连接到所述入口通道的一侧，而另一端 的微通道阵列连接到出口通道的一侧; 以及将微通道彼此分离的微型散热器阵列。
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公开(公告)号：US20220384674A1
公开(公告)日：2022-12-01
申请号：US17828701
申请日：2022-05-31
Inventor： Jiho JOO , Yong Sung EOM , Kwang-Seong CHOI , Chanmi LEE , Gwang-Mun CHOI , Ki Seok JANG , Seok-Hwan MOON , Ho-Gyeong YUN
Abstract: Provided is a method for manufacturing an electronic device. The method for manufacturing the electronic device includes mapping good elements and defective elements on a substrate, providing a first transparent structure including a first adhesive layer on the substrate, selectively providing first laser light to the defective elements to cure the first adhesive layer on the defective elements and separate the defective elements from the substrate, providing a second transparent structure including a second adhesive layer, which adheres to new elements replaced for the defective elements, on the substrate, and selectively providing second laser light to the new elements to bond the new elements to the substrate.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20190211231A1
公开(公告)日：2019-07-11
申请号：US16221206
申请日：2018-12-14
Inventor： KeonSoo JANG , Yong Sung EOM , Kwang-Seong CHOI , Seok-Hwan MOON , Hyun-cheol BAE
IPC: C09J7/30 , C09J167/02 , H01L21/02
CPC classification number: C09J7/30 , C08G77/16 , C08K3/346 , C08K3/36 , C08K2003/0812 , C08K2003/2237 , C08K2003/2296 , C08K2003/3045 , C09J167/02 , H01L21/02304
Abstract: Provided are an adhesive film, and a method of fabricating a semiconductor package using the same. The adhesive film includes a thermoplastic resin containing a hydroxyl group, a thermosetting resin, and an anhydride.
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7.发明申请ACTIVE CLICHE FOR LARGE-AREA PRINTING, MANUFACTURING METHOD OF THE SAME, AND PRINTING METHOD USING THE SAME 有权用于大面积打印的主动夹层及其制造方法及使用其的印刷方法公开(公告)号：US20150273833A1
公开(公告)日：2015-10-01
申请号：US14738047
申请日：2015-06-12
Inventor： Yong Suk YANG , In-Kyu YOU , Soon-Won JUNG , Bock Soon NA , Seok-Hwan MOON
IPC: B41J2/16
CPC classification number: B41J2/1626 , B41J2/06 , B41J2/14 , B41J2/16 , B41J2/162 , B41J2/1621 , B41J2/1629 , B41J2/1631 , B41J2/1639 , B41J2/1642 , B41J2/1646 , B41J2202/04
Abstract: Provided are a large-area nano-scale active printing device, a fabricating method of the same, and a printing method using the same. The printing device may include a substrate, first interconnection lines extending along a first direction, on the substrate, an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines, second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines, and wedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines. The wedge-shaped electrodes protrude upward at centers of the holes.
Abstract translation: 提供了一种大面积纳米级活性印刷装置及其制造方法，以及使用其的印刷方法。 打印装置可以包括基板，沿着第一方向延伸的第一互连线，在基板上，设置在第一互连线上的具有部分地暴露第一互连线的孔的层间电介质层，邻近孔的第二互连线 所述层间电介质层与所述第一互连线交叉，以及设置在与所述第一和第二互连线交叉并与所述第一互连线连接的楔形电极。 楔形电极在孔的中心向上突出。
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公开(公告)号：US20200266078A1
公开(公告)日：2020-08-20
申请号：US16795009
申请日：2020-02-19
Inventor： Yong Sung EOM , KWANG-SEONG CHOI , Ki Seok JANG , Seok-Hwan MOON , Jiho JOO
Abstract: Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.
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公开(公告)号：US20200075535A1
公开(公告)日：2020-03-05
申请号：US16555060
申请日：2019-08-29
Inventor： Kwang-Seong CHOI , Yong Sung EOM , KeonSoo JANG , Seok-Hwan MOON , Hyun-cheol BAE
IPC: H01L23/00
Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.
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公开(公告)号：US20160225631A1
公开(公告)日：2016-08-04
申请号：US15093814
申请日：2016-04-08
Inventor： Chi Hoon JUN , Sang Choon KO , Seok-Hwan MOON , Woojin CHANG , Sung-Bum BAE , Young Rak PARK , Je Ho NA , Jae Kyoung MUN , Eun Soo NAM
IPC: H01L21/3065 , H01L21/308 , H01L21/3205 , H01L23/367
CPC classification number: H01L21/3065 , H01L21/3081 , H01L21/32051 , H01L23/367 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes: an active region provided on a substrate; an inlet channel formed as a single cavity buried in one side of the substrate; an outlet channel formed as a single cavity buried in the other side of the substrate; a micro channel array comprising a plurality of micro channels, wherein the plurality of micro channels are formed as a plurality of cavities buried in the substrate, and one end of the micro channel array is connected to a side of the inlet channel and the other end of the micro channel array is connected to a side of the outlet channel; and a micro heat sink array separating the micro channels from one another.
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