公开(公告)号：US20190287870A1

公开(公告)日：2019-09-19

申请号：US16356615

申请日：2019-03-18

Applicant: Electronics and Telecommunications Research Institute

Inventor： KeonSoo JANG ,  Yong Sung EOM ,  KWANG-SEONG CHOI ,  Seok-Hwan MOON ,  Hyun-cheol BAE

IPC: H01L23/29 ,  H01L23/00 ,  H01L21/56 ,  C08L101/12 ,  C08K3/013 ,  C08K3/36

Abstract: The inventive concept relates to a filling composition for a semiconductor package. The filling composition for a semiconductor package may include a resin, a curing agent, and an insulating filler. The insulating filler may include a first filler body part, a second filler body part, a polymer chain coupled to the first filler body part and the second filler body part, and supramolecules coupled to the polymer chain.

公开(公告)号：US20200075535A1

公开(公告)日：2020-03-05

申请号：US16555060

申请日：2019-08-29

Applicant: Electronics and Telecommunications Research Institute

Inventor： Kwang-Seong CHOI ,  Yong Sung EOM ,  KeonSoo JANG ,  Seok-Hwan MOON ,  Hyun-cheol BAE

IPC: H01L23/00

Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.

公开(公告)号：US20210358885A1

公开(公告)日：2021-11-18

申请号：US17387800

申请日：2021-07-28

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Kwang-Seong CHOI ,  Yong Sung EOM ,  KeonSoo JANG ,  Seok-Hwan MOON ,  Hyun-cheol BAE

IPC: H01L23/00

Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.

公开(公告)号：US20190211231A1

公开(公告)日：2019-07-11

申请号：US16221206

申请日：2018-12-14

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： KeonSoo JANG ,  Yong Sung EOM ,  Kwang-Seong CHOI ,  Seok-Hwan MOON ,  Hyun-cheol BAE

IPC: C09J7/30 ,  C09J167/02 ,  H01L21/02

CPC classification number: C09J7/30 ,  C08G77/16 ,  C08K3/346 ,  C08K3/36 ,  C08K2003/0812 ,  C08K2003/2237 ,  C08K2003/2296 ,  C08K2003/3045 ,  C09J167/02 ,  H01L21/02304

Abstract: Provided are an adhesive film, and a method of fabricating a semiconductor package using the same. The adhesive film includes a thermoplastic resin containing a hydroxyl group, a thermosetting resin, and an anhydride.