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公开(公告)号：US20200266078A1
公开(公告)日：2020-08-20
申请号：US16795009
申请日：2020-02-19
发明人： Yong Sung EOM , KWANG-SEONG CHOI , Ki Seok JANG , Seok-Hwan MOON , Jiho JOO
摘要： Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.
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公开(公告)号：US20240021570A1
公开(公告)日：2024-01-18
申请号：US18347149
申请日：2023-07-05
发明人： Jiho JOO , Yong Sung EOM , CHANMI LEE , Ki Seok JANG , GWANG-MUN CHOI , KWANG-SEONG CHOI , Jin Hyuk OH
IPC分类号： H01L23/00
CPC分类号： H01L24/75 , H01L2224/75263 , H01L2224/75343 , H01L2224/75701 , H01L2224/75702 , H01L2224/75753 , H01L2924/401
摘要： Provided is a bonding apparatus. The bonding apparatus includes a stage configured to accommodate a substrate, a laser light source configured to provide laser light to devices on the substrate, and a bonding plate provided between the laser light source and the stage and configured to provide the devices on the substrate. The bonding plate includes a transparent substrate; a transparent layer below the transparent substrate; an device adhesion layer below the transparent layer and a reflective pattern provided above or below the transparent substrate and the transparent layer.
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公开(公告)号：US20210320236A1
公开(公告)日：2021-10-14
申请号：US17228310
申请日：2021-04-12
发明人： Jiho JOO , Yong Sung EOM , GWANG-MUN CHOI , KWANG-SEONG CHOI , CHANMI LEE , Ki Seok JANG
摘要： Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.
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公开(公告)号：US20140367375A1
公开(公告)日：2014-12-18
申请号：US14089442
申请日：2013-11-25
发明人： Hyun-cheol BAE , Yong Sung EOM , KWANG-SEONG CHOI , Haksun LEE
IPC分类号： H05B6/00
CPC分类号： B23K35/0244 , B23K35/0222 , B23K35/3613 , H01L24/11 , H01L2224/111 , H01L2224/1132 , H01L2224/13109 , H01L2924/00014 , H01L2924/013 , H01L2924/0105
摘要： Provided is a method of fabricating a solder particle including adding a first magnetic bar in a first container including a mixture containing first solder particles formed through a mixing process, disposing the first container in a second container including a second magnetic bar, operating the first magnetic bar and the second magnetic bar, and applying heat to the first container to melt the first solder particles.
摘要翻译： 提供一种制造焊料颗粒的方法，包括在第一容器中加入第一磁条，该第一容器包括通过混合过程形成的包含第一焊料颗粒的混合物，将第一容器设置在包括第二磁条的第二容器中， 棒和第二磁棒，并且向第一容器施加热量以熔化第一焊料颗粒。
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公开(公告)号：US20230027892A1
公开(公告)日：2023-01-26
申请号：US17864774
申请日：2022-07-14
发明人： KWANG-SEONG CHOI , Yong-Sung EOM , Jiho JOO , GWANG-MUN CHOI , Seok-Hwan MOON , Ho-Gyeong YUN , CHANMI LEE , Ki-Seok JANG
IPC分类号： H01L33/62 , H01L25/075 , H01L33/00
摘要： Provided is an electronic device including a plurality of substrate electrodes on a substrate, the substrate electrodes including initial electrodes and spare electrodes, a bonding material covering the initial electrodes and the spare electrodes, module structures respectively provided on first initial electrodes of the initial electrodes, and solders between each of the first initial electrodes and each of the module structures, wherein the spare electrodes include second spare electrodes, wherein the module structures are not provided on the second spare electrodes, wherein the bonding material on the first initial electrodes is harder than the bonding material on the second spare electrodes.
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公开(公告)号：US20210402525A1
公开(公告)日：2021-12-30
申请号：US17364128
申请日：2021-06-30
发明人： GWANG-MUN CHOI , Yong Sung EOM , KWANG-SEONG CHOI , Jiho JOO , CHANMI LEE , Ki Seok JANG
摘要： Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.
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公开(公告)号：US20160358892A1
公开(公告)日：2016-12-08
申请号：US15172097
申请日：2016-06-02
发明人： Haksun LEE , KWANG-SEONG CHOI , Hyun-cheol BAE , Yong Sung EOM
IPC分类号： H01L25/065 , H01L23/31 , H01L25/00 , H01L21/56 , H01L23/00
CPC分类号： H01L25/0657 , H01L21/561 , H01L21/563 , H01L23/3121 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L25/50 , H01L2224/0401 , H01L2224/13025 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/16146 , H01L2224/16227 , H01L2224/2919 , H01L2224/2929 , H01L2224/29387 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81141 , H01L2224/81203 , H01L2224/81815 , H01L2224/83192 , H01L2224/83201 , H01L2224/8385 , H01L2224/92125 , H01L2224/92143 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2225/06593 , H01L2924/14 , H01L2924/1434 , H01L2924/1531 , H01L2924/15311 , H01L2924/181 , H01L2224/83 , H01L2224/81 , H01L2924/00012 , H01L2924/00014
摘要： Provided is a method for manufacturing a semiconductor package, which includes providing a first substrate, providing, over the first substrate, a second substrate including an active region in which a semiconductor element is disposed and a periphery region surrounding the active region, providing an adhesive membrane between the first and second substrates, and mounting the second substrate on the first substrate, wherein the mounting of the second substrate includes aligning the second substrate on the first substrate by using an alignment member protruding from the periphery region of the second substrate.
摘要翻译： 提供一种制造半导体封装的方法，其包括提供第一衬底，在第一衬底上提供包括其中设置有半导体元件的有源区域和包围有源区域的周边区域的第二衬底，提供粘合剂 膜，并且将第二基板安装在第一基板上，其中第二基板的安装包括通过使用从第二基板的周边区域突出的对准构件来将第二基板对准在第一基板上。
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公开(公告)号：US20150228617A1
公开(公告)日：2015-08-13
申请号：US14338050
申请日：2014-07-22
发明人： Haksun LEE , KWANG-SEONG CHOI , Yong Sung EOM , Hyun-cheol BAE
IPC分类号： H01L23/00
CPC分类号： H01L24/83 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L2224/0401 , H01L2224/05568 , H01L2224/16238 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/32501 , H01L2224/32505 , H01L2224/73204 , H01L2224/81002 , H01L2224/811 , H01L2224/83224 , H01L2224/83851 , H01L2224/83859 , H01L2224/83886 , H01L2224/83948 , H01L2224/83986 , H01L2224/92125 , H01L2924/00014 , H01L2924/12042 , H01L2924/00 , H01L2924/014
摘要： Provided is a semiconductor device and a method of manufacturing the same. In the method of manufacturing a semiconductor device, a substrate is prepared which is transparent and has a plurality of first electrodes thereon, and a semiconductor chip having a plurality of second electrodes thereon is disposed on the substrate to allow the first and second electrodes to respectively face each other. A polymer layer including solder particles and an oxidizing agent is formed between the substrate and the semiconductor chip, and the solder particles is locally fused between the first and second electrodes by using a laser beam and a fused solder layer is formed which electrically connects between the first and second electrodes.
摘要翻译： 提供一种半导体器件及其制造方法。 在制造半导体器件的方法中，准备透明的衬底并且在其上具有多个第一电极，并且其上具有多个第二电极的半导体芯片设置在衬底上以允许第一和第二电极分别 面对面 在衬底和半导体芯片之间形成包括焊料颗粒和氧化剂的聚合物层，并且通过使用激光束将焊料颗粒局部融合在第一和第二电极之间，并且形成熔融焊料层， 第一和第二电极。
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公开(公告)号：US20150043175A1
公开(公告)日：2015-02-12
申请号：US14218803
申请日：2014-03-18
发明人： KWANG-SEONG CHOI , Hyun-cheol BAE , Haksun LEE , Yong Sung EOM
IPC分类号： H05K1/11
CPC分类号： H05K3/3436 , H01L23/48 , H01L2924/0002 , H05K1/0283 , H05K1/189 , H05K2201/10128 , H05K2201/10734 , Y02P70/613 , H01L2924/00
摘要： Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.
摘要翻译： 提供了一种电子设备的接合结构，包括：在第一方向上延伸并沿第二方向布置在具有拉伸性的可拉伸显示面板上的第一电极，第二电极沿第一方向延伸并沿基板上的第二方向布置， 第一电极和介于第一电极和第二电极之间的焊接接合部分，在第二方向上彼此面对，并且在第一方向上构成多行。
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10.发明公开公开(公告)号：US20230391956A1
公开(公告)日：2023-12-07
申请号：US18205153
申请日：2023-06-02
发明人： GWANG-MUN CHOI , Yong Sung EOM , Jiho JOO , KWANG-SEONG CHOI , Seok-Hwan MOON , Jin Hyuk OH , Ho-Gyeong YUN , CHANMI LEE , Ki Seok JANG
IPC分类号： C08G77/18
CPC分类号： C08G77/18
摘要： Provided is an organic-inorganic compound including a first structural body and a curable reactive group, wherein the first structural body may have a structure in which silane and isohexide are chemically bonded through a silyl ether bond.
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