公开(公告)号：US20160094258A1

公开(公告)日：2016-03-31

申请号：US14857818

申请日：2015-09-17

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Hyun-cheol BAE ,  Yong Sung EOM ,  Haksun LEE ,  KWANG-SEONG CHOI

IPC: H04B1/38 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0209 ,  H01L35/325 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10219

Abstract: Provided are a transceiver module and a communication apparatus including the same. The transceiver module includes a lower substrate, a thermoelectric device on the lower substrate, and an upper substrate which is disposed on the thermoelectric device and on which high frequency devices cooled by the thermoelectric device are mounted. The upper substrate includes a ceramic printed circuit board (PCB).

Abstract translation: 提供收发器模块和包括该模块的通信装置。 收发器模块包括下基板，下基板上的热电装置和设置在热电装置上的上基板，并且其上安装有由热电装置冷却的高频装置。 上基板包括陶瓷印刷电路板（PCB）。

公开(公告)号：US20140287556A1

公开(公告)日：2014-09-25

申请号：US13904572

申请日：2013-05-29

Applicant: Electronics and Telecommunications Research Institute

Inventor： Kwang-Seong CHOI ,  Yong Sung EOM ,  Hyun-cheol BAE ,  Haksun LEE

IPC: H01L23/00

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/1152 ,  H01L2224/1181 ,  H01L2224/13022 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2924/07802 ,  H01L2924/15788 ,  H01L2924/3841 ,  H05K3/3484 ,  H05K2201/0367 ,  H05K2203/043 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029

Abstract: Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.

Abstract translation: 提供了形成凸块的方法和具有该凸块的半导体器件。 该方法可以包括提供具有衬垫的衬底，形成覆盖焊盘的凸块制作器层并且包括树脂和焊料颗粒，热处理凸块制造器层以将焊料颗粒聚集到焊盘上，去除树脂以暴露聚集的焊料 颗粒，形成树脂层以覆盖聚集的焊料颗粒，并且回流聚集的焊料颗粒以在焊盘上形成凸块。

公开(公告)号：US20170141071A1

公开(公告)日：2017-05-18

申请号：US14958341

申请日：2015-12-03

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Kwang-Seong CHOI ,  Hyun-cheol BAE ,  Yong Sung EOM ,  Jin Ho LEE ,  Haksun LEE

IPC: H01L23/00 ,  H01L21/56 ,  H01L25/00 ,  H01L21/48

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L21/563 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81002 ,  H01L2224/81091 ,  H01L2224/81143 ,  H01L2224/81208 ,  H01L2224/81224 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/81911 ,  H01L2224/83224 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/95 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01083 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/01047 ,  H01L2924/01029

Abstract: Provided is a method of fabricating a semiconductor package. The method includes providing a package substrate including a pad, mounting a semiconductor chip with a solder ball on the package substrate to allow the solder ball to be disposed on the pad, filling a space between the package substrate and the semiconductor chip with a underfill resin including a reducing agent comprising a carboxyl group, and irradiating the semiconductor chip with a laser to bond the solder ball to the pad, wherein the bonding of the solder ball to the pad comprises changing a metal oxide layer formed on surfaces of the pad and the solder ball to a metal layer by heat generated by the laser.

公开(公告)号：US20150364445A1

公开(公告)日：2015-12-17

申请号：US14685400

申请日：2015-04-13

Applicant: Electronics and Telecommunications Research Institute

Inventor： Kwang Seong CHOI ,  Hyun Cheol BAE ,  Yong Sung EOM ,  Haksun LEE

IPC: H01L25/065 ,  H01L23/66 ,  H01L23/367 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/13 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/105 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05571 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48159 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/10157 ,  H01L2924/1421 ,  H01L2924/14215 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/37001 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00

Abstract: Provided is a stack module package including: a first substrate where a first device is mounted, and a second substrate where a second device is mounted. The second substrate has a greater thickness than the first substrate, and the second device has a greater thickness than the first device. The first and second devices are vertically connected to each other. In the stack module package, vertical signal loss between the first and second substrates having different characteristics may be minimized

Abstract translation: 提供了一种堆叠模块封装，包括：安装第一器件的第一衬底和安装第二器件的第二衬底。 第二衬底具有比第一衬底更大的厚度，并且第二器件具有比第一器件更大的厚度。 第一和第二装置彼此垂直连接。 在堆叠模块封装中，可以使具有不同特性的第一和第二基板之间的垂直信号损失最小化

公开(公告)号：US20140367375A1

公开(公告)日：2014-12-18

申请号：US14089442

申请日：2013-11-25

Applicant: Electronics and Telecommunications Research Institute

Inventor： Hyun-cheol BAE ,  Yong Sung EOM ,  KWANG-SEONG CHOI ,  Haksun LEE

IPC: H05B6/00

CPC classification number: B23K35/0244 ,  B23K35/0222 ,  B23K35/3613 ,  H01L24/11 ,  H01L2224/111 ,  H01L2224/1132 ,  H01L2224/13109 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/0105

Abstract: Provided is a method of fabricating a solder particle including adding a first magnetic bar in a first container including a mixture containing first solder particles formed through a mixing process, disposing the first container in a second container including a second magnetic bar, operating the first magnetic bar and the second magnetic bar, and applying heat to the first container to melt the first solder particles.

Abstract translation: 提供一种制造焊料颗粒的方法，包括在第一容器中加入第一磁条，该第一容器包括通过混合过程形成的包含第一焊料颗粒的混合物，将第一容器设置在包括第二磁条的第二容器中， 棒和第二磁棒，并且向第一容器施加热量以熔化第一焊料颗粒。

公开(公告)号：US20160358892A1

公开(公告)日：2016-12-08

申请号：US15172097

申请日：2016-06-02

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Haksun LEE ,  KWANG-SEONG CHOI ,  Hyun-cheol BAE ,  Yong Sung EOM

IPC: H01L25/065 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81141 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06593 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/1531 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Provided is a method for manufacturing a semiconductor package, which includes providing a first substrate, providing, over the first substrate, a second substrate including an active region in which a semiconductor element is disposed and a periphery region surrounding the active region, providing an adhesive membrane between the first and second substrates, and mounting the second substrate on the first substrate, wherein the mounting of the second substrate includes aligning the second substrate on the first substrate by using an alignment member protruding from the periphery region of the second substrate.

Abstract translation: 提供一种制造半导体封装的方法，其包括提供第一衬底，在第一衬底上提供包括其中设置有半导体元件的有源区域和包围有源区域的周边区域的第二衬底，提供粘合剂 膜，并且将第二基板安装在第一基板上，其中第二基板的安装包括通过使用从第二基板的周边区域突出的对准构件来将第二基板对准在第一基板上。

公开(公告)号：US20150228617A1

公开(公告)日：2015-08-13

申请号：US14338050

申请日：2014-07-22

Applicant: Electronics and Telecommunications Research Institute

Inventor： Haksun LEE ,  KWANG-SEONG CHOI ,  Yong Sung EOM ,  Hyun-cheol BAE

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32501 ,  H01L2224/32505 ,  H01L2224/73204 ,  H01L2224/81002 ,  H01L2224/811 ,  H01L2224/83224 ,  H01L2224/83851 ,  H01L2224/83859 ,  H01L2224/83886 ,  H01L2224/83948 ,  H01L2224/83986 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/014

Abstract: Provided is a semiconductor device and a method of manufacturing the same. In the method of manufacturing a semiconductor device, a substrate is prepared which is transparent and has a plurality of first electrodes thereon, and a semiconductor chip having a plurality of second electrodes thereon is disposed on the substrate to allow the first and second electrodes to respectively face each other. A polymer layer including solder particles and an oxidizing agent is formed between the substrate and the semiconductor chip, and the solder particles is locally fused between the first and second electrodes by using a laser beam and a fused solder layer is formed which electrically connects between the first and second electrodes.

Abstract translation: 提供一种半导体器件及其制造方法。 在制造半导体器件的方法中，准备透明的衬底并且在其上具有多个第一电极，并且其上具有多个第二电极的半导体芯片设置在衬底上以允许第一和第二电极分别 面对面 在衬底和半导体芯片之间形成包括焊料颗粒和氧化剂的聚合物层，并且通过使用激光束将焊料颗粒局部融合在第一和第二电极之间，并且形成熔融焊料层， 第一和第二电极。

公开(公告)号：US20150043175A1

公开(公告)日：2015-02-12

申请号：US14218803

申请日：2014-03-18

Applicant: Electronics and Telecommunications Research Institute

Inventor： KWANG-SEONG CHOI ,  Hyun-cheol BAE ,  Haksun LEE ,  Yong Sung EOM

IPC: H05K1/11

CPC classification number: H05K3/3436 ,  H01L23/48 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/189 ,  H05K2201/10128 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

Abstract: Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.

Abstract translation: 提供了一种电子设备的接合结构，包括：在第一方向上延伸并沿第二方向布置在具有拉伸性的可拉伸显示面板上的第一电极，第二电极沿第一方向延伸并沿基板上的第二方向布置， 第一电极和介于第一电极和第二电极之间的焊接接合部分，在第二方向上彼此面对，并且在第一方向上构成多行。