公开(公告)号：US20150364445A1

公开(公告)日：2015-12-17

申请号：US14685400

申请日：2015-04-13

Applicant: Electronics and Telecommunications Research Institute

Inventor： Kwang Seong CHOI ,  Hyun Cheol BAE ,  Yong Sung EOM ,  Haksun LEE

IPC: H01L25/065 ,  H01L23/66 ,  H01L23/367 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/13 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/105 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05571 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48159 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/10157 ,  H01L2924/1421 ,  H01L2924/14215 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/37001 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00

Abstract: Provided is a stack module package including: a first substrate where a first device is mounted, and a second substrate where a second device is mounted. The second substrate has a greater thickness than the first substrate, and the second device has a greater thickness than the first device. The first and second devices are vertically connected to each other. In the stack module package, vertical signal loss between the first and second substrates having different characteristics may be minimized

Abstract translation: 提供了一种堆叠模块封装，包括：安装第一器件的第一衬底和安装第二器件的第二衬底。 第二衬底具有比第一衬底更大的厚度，并且第二器件具有比第一器件更大的厚度。 第一和第二装置彼此垂直连接。 在堆叠模块封装中，可以使具有不同特性的第一和第二基板之间的垂直信号损失最小化