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公开(公告)号：US20210320236A1
公开(公告)日：2021-10-14
申请号：US17228310
申请日：2021-04-12
发明人： Jiho JOO , Yong Sung EOM , GWANG-MUN CHOI , KWANG-SEONG CHOI , CHANMI LEE , Ki Seok JANG
摘要： Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.
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公开(公告)号：US20180113253A1
公开(公告)日：2018-04-26
申请号：US15792550
申请日：2017-10-24
发明人： Jiho JOO , Myungjoon KWACK , Gyungock KIM , Jaegyu PARK
CPC分类号： G02B6/02085 , G02B6/02095 , G02B6/12014 , G02B6/125 , G02B6/29313 , G02B6/29323 , G02B6/29328 , G02B6/4203 , G02B6/4215 , G02B26/0833 , G02B2006/12164 , G02F1/0147 , G02F1/19 , G02F1/225 , G02F2201/307
摘要： A wavelength division multiplexer is disclosed. The wavelength division multiplexer may include an input waveguide, in which a plurality of Bragg gratings for separating multiplexed optical signals into respective optical signals are provided, and a plurality of output waveguides connected to the input waveguide and configured to receive the optical signals separated by the plurality of Bragg gratings. The plurality of Bragg gratings may include a first Bragg grating including first protrusions each having a first width, and a second Bragg grating including second protrusions each having a second width larger than the first width. Each of the first and second protrusions may include a curved side surface, to which a corresponding one of the optical signals is incident.
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公开(公告)号：US20240021570A1
公开(公告)日：2024-01-18
申请号：US18347149
申请日：2023-07-05
发明人： Jiho JOO , Yong Sung EOM , CHANMI LEE , Ki Seok JANG , GWANG-MUN CHOI , KWANG-SEONG CHOI , Jin Hyuk OH
IPC分类号： H01L23/00
CPC分类号： H01L24/75 , H01L2224/75263 , H01L2224/75343 , H01L2224/75701 , H01L2224/75702 , H01L2224/75753 , H01L2924/401
摘要： Provided is a bonding apparatus. The bonding apparatus includes a stage configured to accommodate a substrate, a laser light source configured to provide laser light to devices on the substrate, and a bonding plate provided between the laser light source and the stage and configured to provide the devices on the substrate. The bonding plate includes a transparent substrate; a transparent layer below the transparent substrate; an device adhesion layer below the transparent layer and a reflective pattern provided above or below the transparent substrate and the transparent layer.
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公开(公告)号：US20220384674A1
公开(公告)日：2022-12-01
申请号：US17828701
申请日：2022-05-31
发明人： Jiho JOO , Yong Sung EOM , Kwang-Seong CHOI , Chanmi LEE , Gwang-Mun CHOI , Ki Seok JANG , Seok-Hwan MOON , Ho-Gyeong YUN
摘要： Provided is a method for manufacturing an electronic device. The method for manufacturing the electronic device includes mapping good elements and defective elements on a substrate, providing a first transparent structure including a first adhesive layer on the substrate, selectively providing first laser light to the defective elements to cure the first adhesive layer on the defective elements and separate the defective elements from the substrate, providing a second transparent structure including a second adhesive layer, which adheres to new elements replaced for the defective elements, on the substrate, and selectively providing second laser light to the new elements to bond the new elements to the substrate.
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公开(公告)号：US20200241209A1
公开(公告)日：2020-07-30
申请号：US16750942
申请日：2020-01-23
发明人： Jaegyu PARK , Gyung Ock KIM , Jiho JOO
IPC分类号： G02B6/35
摘要： A 3D optical switch for transferring an optical signal between a plurality of layers of an optical integrated circuit, which comprises: a first optical coupler for distributing the optical signal input to a first optical waveguide deployed in a first layer among the plurality of layers to a second optical waveguide deployed in a second layer different from the first layer; a phase shifter for changing a phase of a first optical signal in the first optical waveguide passing through the first optical coupler and a phase of a second optical signal in the second optical waveguide distributed by the first optical coupler; and a second optical coupler for combining the first optical signal of which the phase is changed and the second optical signal of which the phase is changed is provided.
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公开(公告)号：US20200266078A1
公开(公告)日：2020-08-20
申请号：US16795009
申请日：2020-02-19
发明人： Yong Sung EOM , KWANG-SEONG CHOI , Ki Seok JANG , Seok-Hwan MOON , Jiho JOO
摘要： Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.
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公开(公告)号：US20170261705A1
公开(公告)日：2017-09-14
申请号：US15607717
申请日：2017-05-30
发明人： Gyungock KIM , Hyundai PARK , In Gyoo KIM , Sang Hoon KIM , Ki Seok JANG , Sang Gi KIM , Jiho JOO , Yongseok CHOI , Hyuk Je KWON , Jaegyu PARK , Sun Ae KIM , Jin Hyuk OH , Myung Joon KWACK
IPC分类号： G02B6/42 , H01L27/15 , H01L31/167 , H01L21/762 , G02B6/13 , G02B6/12
CPC分类号： G02B6/12004 , G02B6/13 , G02B6/4206 , G02B6/4214 , H01L21/762 , H01L27/15 , H01L31/167
摘要： Disclosed are an optical input/output device and an opto-electronic system including the same. The device includes a bulk silicon substrate, at least one vertical-input light detection element monolithically integrated on a portion of the bulk silicon substrate, and at least one vertical-output light source element monolithically integrated on another portion of the bulk silicon substrate adjacent to the vertical-input light detection element. The vertical-output light source element includes a III-V compound semiconductor light source active layer combined with the bulk silicon substrate by a wafer bonding method.
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公开(公告)号：US20160259126A1
公开(公告)日：2016-09-08
申请号：US14820406
申请日：2015-08-06
发明人： Myungjoon KWACK , Gyungock KIM , Jaegyu PARK , Ki Seok JANG , Jiho JOO
CPC分类号： G02B6/423 , G02B6/3644 , G02B6/4239 , G02B6/4249
摘要： An optical coupling device comprises an optical fiber block including a first block part and a second block part contacting with one side of the first block part, an optical fiber penetrating the optical fiber block and having an end surface exposed at a bottom surface of the optical fiber block, a semiconductor chip disposed below the optical fiber block and having an optical input/output element disposed on a top surface of the semiconductor chip to correspond with the end surface of the optical fiber, and a planarization layer disposed on the top surface of the semiconductor chip and having a recess region. A bottom surface of the first block part has a higher level than that of the second block part. The bottom surface of the second block part contacts with a bottom of the recess region. The optical fiber is optically coupled with the optical input/output element.
摘要翻译： 光耦合装置包括光纤块，该光纤块包括与第一块部分的一侧接触的第一块部分和第二块部分，穿过光纤块的光纤，并且具有暴露在光学器件的底表面处的端面 光纤块，设置在光纤块下方的半导体芯片，并且具有设置在半导体芯片的顶表面上的光输入/输出元件，以对应于光纤的端面;以及平坦化层，设置在光纤的顶表面上 半导体芯片并具有凹部区域。 第一块部分的底表面具有比第二块部分更高的水平。 第二块部的底面与凹部的底部接触。 光纤与光输入/输出元件光学耦合。
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公开(公告)号：US20160195432A1
公开(公告)日：2016-07-07
申请号：US15072100
申请日：2016-03-16
发明人： Jiho JOO
CPC分类号： G01J1/44 , G01J2001/444 , G02B6/4279 , H01L23/13 , H01L24/48 , H01L31/02016 , H01L31/16 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/00014 , H01L2924/15153 , H01L2924/15173 , H01L2924/15787 , H05K1/0206 , H05K1/0243 , H05K1/0306 , H05K1/115 , H05K1/181 , H05K3/3431 , H05K3/4697 , H05K2201/0191 , H05K2201/09845 , H05K2201/10121 , H05K2201/10189 , H05K2201/10272 , H05K2201/10287 , Y10T29/49117 , H01L2924/00 , H01L2224/45099
摘要： Provided is a optical transceiver module. The optical transceiver module includes a printed circuit board (PCB) configured to include a plurality of dielectric layers and a plurality of metal layers stacked alternately, a photodetector disposed on the PCB to convert an optical signal into an electrical signal, a compensator disposed on one side on the PCB and including a first transmission line that delivers an electrical signal, a power supply line configured to supply power to the photodetector, and a first high frequency connector configured to connect to the first transmission line to deliver the electrical signal, wherein the PCB includes a plurality of vias that electrically connect the plurality of dielectric layers and the plurality of metal layers, and the compensator protrudes from the PCB to compensate for a height difference from the photodetector.
摘要翻译： 提供了一种光收发模块。 光收发器模块包括：印刷电路板（PCB），其被配置为包括多个电介质层和交替堆叠的多个金属层，设置在PCB上以将光信号转换成电信号的光电检测器，设置在一个上的补偿器 并且包括传送电信号的第一传输线，被配置为向光电检测器供电的电源线以及被配置为连接到第一传输线以传送电信号的第一高频连接器，其中， PCB包括多个通孔，其电连接多个电介质层和多个金属层，并且补偿器从PCB突出以补偿与光电检测器的高度差。
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公开(公告)号：US20230027892A1
公开(公告)日：2023-01-26
申请号：US17864774
申请日：2022-07-14
发明人： KWANG-SEONG CHOI , Yong-Sung EOM , Jiho JOO , GWANG-MUN CHOI , Seok-Hwan MOON , Ho-Gyeong YUN , CHANMI LEE , Ki-Seok JANG
IPC分类号： H01L33/62 , H01L25/075 , H01L33/00
摘要： Provided is an electronic device including a plurality of substrate electrodes on a substrate, the substrate electrodes including initial electrodes and spare electrodes, a bonding material covering the initial electrodes and the spare electrodes, module structures respectively provided on first initial electrodes of the initial electrodes, and solders between each of the first initial electrodes and each of the module structures, wherein the spare electrodes include second spare electrodes, wherein the module structures are not provided on the second spare electrodes, wherein the bonding material on the first initial electrodes is harder than the bonding material on the second spare electrodes.
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