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公开(公告)号：US09538666B2
公开(公告)日：2017-01-03
申请号：US14218803
申请日：2014-03-18
Inventor： Kwang-Seong Choi , Hyun-cheol Bae , Haksun Lee , Yong Sung Eom
CPC classification number: H05K3/3436 , H01L23/48 , H01L2924/0002 , H05K1/0283 , H05K1/189 , H05K2201/10128 , H05K2201/10734 , Y02P70/613 , H01L2924/00
Abstract: Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.
Abstract translation: 提供了一种电子设备的接合结构，包括：在第一方向上延伸并沿第二方向布置在具有拉伸性的可拉伸显示面板上的第一电极，第二电极沿第一方向延伸并沿基板上的第二方向布置， 第一电极和介于第一电极和第二电极之间的焊接接合部分，在第二方向上彼此面对，并且在第一方向上构成多行。
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公开(公告)号：US09123548B1
公开(公告)日：2015-09-01
申请号：US14449028
申请日：2014-07-31
Inventor： Jin-Gun Koo , Jong Il Won , Hyun-cheol Bae , Sang Gi Kim , Yil Suk Yang
IPC: H01L29/06 , H01L29/10 , H01L21/8249
CPC classification number: H01L29/0634 , H01L21/76224 , H01L21/8249 , H01L27/0623 , H01L27/0922 , H01L29/0657 , H01L29/1095 , H01L29/41741 , H01L29/6625 , H01L29/735 , H01L29/7813 , H01L29/7835
Abstract: Provided is a semiconductor device. The semiconductor device includes: a first semiconductor layer having a first region with a first device and a second region with a second device; a device isolation pattern provided in the first semiconductor layer and electrically separating the first device and the second device from each other; a drain provided on a lower surface of the first region of the first semiconductor layer; and a second semiconductor layer provided on a lower surface of the second region of the first semiconductor layer.
Abstract translation: 提供一种半导体器件。 该半导体器件包括：第一半导体层，其具有带有第一器件的第一区域和具有第二器件的第二区域; 设置在所述第一半导体层中并将所述第一装置和所述第二装置彼此电分离的装置隔离图案; 设置在所述第一半导体层的所述第一区域的下表面上的漏极; 以及设置在所述第一半导体层的所述第二区域的下表面上的第二半导体层。
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Patent Agency Ranking
公开(公告)号：US11107790B2
公开(公告)日：2021-08-31
申请号：US16555060
申请日：2019-08-29
Inventor： Kwang-Seong Choi , Yong Sung Eom , KeonSoo Jang , Seok-Hwan Moon , Hyun-cheol Bae
IPC: H01L23/00
Abstract: A laser bonding method includes forming a bonding part including an adhesive layer and a conductive particle disposed within the adhesive layer on a substrate; aligning a bonding target by disposing the bonding target on a surface of the bonding part opposite the substrate; disposing a pressing part on a surface of the bonding target that is opposite to the bonding part and pressing the bonding target onto the bonding part through the pressing part; heating the bonding target by irradiating at least the pressing part with a laser and conducting heat from the pressing part to the bonding target and from the bonding target to the bonding part; and bonding together the bonding part and the bonding target by the heat conducted from the bonding target to the bonding part so that the conductive particle electrically connects the substrate and the bonding target. The pressing part may be removed.
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4.发明申请METHOD OF FABRICATING A SOLDER-ON-PAD STRUCTURE AND FLIP-CHIP BONDING METHOD USING THE SAME 有权使用该方法制造焊接片式结构和使用其的片芯粘合方法公开(公告)号：US20140117070A1
公开(公告)日：2014-05-01
申请号：US13846057
申请日：2013-03-18
Inventor： Kwang-Seong Choi , Ho-eun Bae , Hyun-cheol Bae , Yong Sung EOM , Su Jeong Jeon
IPC: B23K1/20
CPC classification number: B23K1/20 , B23K3/0623 , H01L24/11 , H01L2224/11005 , H01L2224/1134 , H01L2224/1152 , H01L2924/00014
Abstract: A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.
Abstract translation: 提供了一种制造焊接焊盘结构的方法。 该方法可以包括：提供具有衬垫的衬底，在衬底上涂覆包括第一树脂和焊料粉末的焊料凸块制造器，将焊料凸块制造器加热到低于焊料粉末的熔点的温度以将焊料粉末聚集 并且移除第一树脂。
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5.发明授权Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same 有权制造焊接焊盘结构的方法和使用其的倒装焊接方法公开(公告)号：US09034750B2
公开(公告)日：2015-05-19
申请号：US13846057
申请日：2013-03-18
Inventor： Kwang-Seong Choi , Ho-eun Bae , Hyun-cheol Bae , Yong Sung Eom , Su Jeong Jeon
CPC classification number: B23K1/20 , B23K3/0623 , H01L24/11 , H01L2224/11005 , H01L2224/1134 , H01L2224/1152 , H01L2924/00014
Abstract: A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.
Abstract translation: 提供了一种制造焊接焊盘结构的方法。 该方法可以包括：提供具有衬垫的衬底，在衬底上涂覆包括第一树脂和焊料粉末的焊料凸块制造器，将焊料凸块制造器加热到低于焊料粉末的熔点的温度以将焊料粉末聚集 并且移除第一树脂。
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公开(公告)号：US09980393B2
公开(公告)日：2018-05-22
申请号：US14704597
申请日：2015-05-05
Inventor： Yong Sung Eom , Kwang-Seong Choi , Hyun-cheol Bae , Jung Hyun Noh , Jong Tae Moon
CPC classification number: H05K3/1216 , C25D5/02 , H01B1/02 , H01B1/22 , H05K1/09 , H05K1/095 , H05K3/102 , H05K3/188 , H05K3/246 , H05K2201/0245 , H05K2201/0302 , H05K2203/0425
Abstract: A pattern-forming method for forming a conductive circuit pattern, the pattern-forming method including the steps of: preparing a pattern-forming composition composed of: Cu powder; solder particles for electrically coupling the Cu powder; a polymer resin; a deforming agent that is selected from among acrylate oligomer, polyglycols, glycerides, polypropylene glycol, dimethyl silicon, simethinecone, tributyl phosphare, and polymethylsiloxane, and that increases bonding force between the Cu powder and the solder particles; a curing agent; and a reductant; forming a circuit pattern by printing the pattern-forming composition on a substrate; heating the circuit pattern at a temperature effective to cure the pattern-forming composition and provide the conductive circuit pattern; and electrolytically plating a metal layer onto the conductive circuit pattern. A circuit pattern having superior conductivity is formed at low cost.
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公开(公告)号：US09006037B2
公开(公告)日：2015-04-14
申请号：US13904572
申请日：2013-05-29
Inventor： Kwang-Seong Choi , Yong Sung Eom , Hyun-cheol Bae , Haksun Lee
CPC classification number: H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/1152 , H01L2224/1181 , H01L2224/13022 , H01L2224/13109 , H01L2224/13111 , H01L2224/16237 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81815 , H01L2924/07802 , H01L2924/15788 , H01L2924/3841 , H05K3/3484 , H05K2201/0367 , H05K2203/043 , H01L2924/00 , H01L2924/00014 , H01L2924/0105 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029
Abstract: Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.
Abstract translation: 提供了形成凸块的方法和具有该凸块的半导体器件。 该方法可以包括提供具有衬垫的衬底，形成覆盖焊盘的凸块制作器层并且包括树脂和焊料颗粒，热处理凸块制造器层以将焊料颗粒聚集到焊盘上，去除树脂以暴露聚集的焊料 颗粒，形成树脂层以覆盖聚集的焊料颗粒，并且回流聚集的焊料颗粒以在焊盘上形成凸块。
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