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1.发明授权Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same 有权制造焊接焊盘结构的方法和使用其的倒装焊接方法公开(公告)号：US09034750B2
公开(公告)日：2015-05-19
申请号：US13846057
申请日：2013-03-18
Inventor： Kwang-Seong Choi , Ho-eun Bae , Hyun-cheol Bae , Yong Sung Eom , Su Jeong Jeon
CPC classification number: B23K1/20 , B23K3/0623 , H01L24/11 , H01L2224/11005 , H01L2224/1134 , H01L2224/1152 , H01L2924/00014
Abstract: A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.
Abstract translation: 提供了一种制造焊接焊盘结构的方法。 该方法可以包括：提供具有衬垫的衬底，在衬底上涂覆包括第一树脂和焊料粉末的焊料凸块制造器，将焊料凸块制造器加热到低于焊料粉末的熔点的温度以将焊料粉末聚集 并且移除第一树脂。
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2.发明申请METHOD OF FABRICATING A SOLDER-ON-PAD STRUCTURE AND FLIP-CHIP BONDING METHOD USING THE SAME 有权使用该方法制造焊接片式结构和使用其的片芯粘合方法公开(公告)号：US20140117070A1
公开(公告)日：2014-05-01
申请号：US13846057
申请日：2013-03-18
Inventor： Kwang-Seong Choi , Ho-eun Bae , Hyun-cheol Bae , Yong Sung EOM , Su Jeong Jeon
IPC: B23K1/20
CPC classification number: B23K1/20 , B23K3/0623 , H01L24/11 , H01L2224/11005 , H01L2224/1134 , H01L2224/1152 , H01L2924/00014
Abstract: A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.
Abstract translation: 提供了一种制造焊接焊盘结构的方法。 该方法可以包括：提供具有衬垫的衬底，在衬底上涂覆包括第一树脂和焊料粉末的焊料凸块制造器，将焊料凸块制造器加热到低于焊料粉末的熔点的温度以将焊料粉末聚集 并且移除第一树脂。
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