公开(公告)号：US09980393B2

公开(公告)日：2018-05-22

申请号：US14704597

申请日：2015-05-05

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Yong Sung Eom ,  Kwang-Seong Choi ,  Hyun-cheol Bae ,  Jung Hyun Noh ,  Jong Tae Moon

IPC: H05K3/12 ,  C25D5/02 ,  H05K3/18 ,  H05K3/10 ,  H05K1/09

CPC classification number: H05K3/1216 ,  C25D5/02 ,  H01B1/02 ,  H01B1/22 ,  H05K1/09 ,  H05K1/095 ,  H05K3/102 ,  H05K3/188 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0302 ,  H05K2203/0425

Abstract: A pattern-forming method for forming a conductive circuit pattern, the pattern-forming method including the steps of: preparing a pattern-forming composition composed of: Cu powder; solder particles for electrically coupling the Cu powder; a polymer resin; a deforming agent that is selected from among acrylate oligomer, polyglycols, glycerides, polypropylene glycol, dimethyl silicon, simethinecone, tributyl phosphare, and polymethylsiloxane, and that increases bonding force between the Cu powder and the solder particles; a curing agent; and a reductant; forming a circuit pattern by printing the pattern-forming composition on a substrate; heating the circuit pattern at a temperature effective to cure the pattern-forming composition and provide the conductive circuit pattern; and electrolytically plating a metal layer onto the conductive circuit pattern. A circuit pattern having superior conductivity is formed at low cost.

公开(公告)号：US20130334291A1

公开(公告)日：2013-12-19

申请号：US13760350

申请日：2013-02-06

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Yong Sung EOM ,  Kwang-Seong Choi ,  Jung Hyun Noh

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L2224/11442 ,  H01L2224/13147 ,  H01L2224/13564 ,  H01L2224/13601 ,  H01L2224/13655 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/81024 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/83192 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01029

Abstract: Disclosed are a method of forming a solder on pad on a fine pitch PCB and a method of flip chip bonding a semiconductor device using the same. The method of forming a solder on pad on a fine pitch PCB includes: applying a solder bump maker (SBM) paste with a predetermined thickness to an entire surface of a PCB including a metal pad and a solder mask; heating the SBM paste at a temperature higher than a melting point of solder contained in the SBM paste and then cooling the SBM paste to form a solder on pad; and washing a residual polymer resin and residual solder particles of the SBM paste by using a solvent.

Abstract translation: 公开了一种在精细间距PCB上焊盘上形成焊料的方法以及使用该焊料的半导体器件的倒装芯片接合方法。 在精细间距PCB上的焊盘上形成焊料的方法包括：将具有预定厚度的焊料凸块制造商（SBM）浆料施加到包括金属焊盘和焊接掩模的PCB的整个表面; 在高于SBM糊料中所含焊料熔点的温度下加热SBM糊料，然后冷却SBM糊料以在焊盘上形成焊料; 并使用溶剂洗涤残留的聚合物树脂和SBM糊的残留焊料颗粒。