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公开(公告)号：US11024799B2
公开(公告)日：2021-06-01
申请号：US16360099
申请日：2019-03-21
发明人： Renu Whig , Phillip Mather , Kenneth Smith , Sanjeev Aggarwal , Jon Slaughter , Nicholas Rizzo
摘要： A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
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公开(公告)号：US09773970B2
公开(公告)日：2017-09-26
申请号：US15041178
申请日：2016-02-11
发明人： Phillip Mather , Jon Slaughter , Nicholas Rizzo
CPC分类号： H01L43/02 , G01R33/098 , H01L27/22 , H01L43/08 , H01L43/12
摘要： A magnetic field sensor including a first plurality and a second plurality of magnetoresistive sensors, wherein each magnetoresistive sensor of the first plurality and the second plurality of magnetoresistive sensors comprises: an electrode; a reference layer adjacent to the electrode, wherein the reference layer includes a synthetic antiferromagnetic structure; a magnetic sense element; and an intermediate layer between the reference layer and the magnetic sense element; and one or more conductors configured to electrically couple the magnetoresistive sensors of the first plurality and the second plurality in various configurations.
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公开(公告)号：US09606144B2
公开(公告)日：2017-03-28
申请号：US14687490
申请日：2015-04-15
发明人： Lianjun Liu , Phillip Mather
CPC分类号： G01R1/07307 , G01R33/0035 , G01R33/09 , G01R35/00
摘要： A probe card and method are provided for testing magnetic sensors at the wafer level. The probe card has one or more probe tips having a first pair of solenoid coils in parallel configuration on first opposed sides of each probe tip to supply a magnetic field in a first (X) direction, a second pair of solenoid coils in parallel configuration on second opposed sides of each probe tip to supply a magnetic field in a second (Y) direction orthogonal to the first direction, and an optional third solenoid coil enclosing or inscribing the first and second pair to supply a magnetic field in a third direction (Z) orthogonal to both the first and second directions. The first pair, second pair, and third coil are each symmetrical with a point on the probe tip array, the point being aligned with and positioned close to a magnetic sensor during test.
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公开(公告)号：US09362491B2
公开(公告)日：2016-06-07
申请号：US14954075
申请日：2015-11-30
发明人： Renu Whig , Phillip Mather , Kenneth Smith , Sanjeev Aggarwal , Jon Slaughter , Nicholas Rizzo
CPC分类号： H01L43/12 , B82Y25/00 , G01R33/0052 , G01R33/09 , G01R33/093 , G01R33/098 , H01L27/22 , H01L43/02 , H01L43/08
摘要： A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
摘要翻译： 半导体工艺集成了三个桥接电路，每个电路包括在单个芯片上作为惠斯登电桥耦合的磁阻传感器，以在三个正交方向上感测磁场。 该过程包括形成磁阻传感器的各种沉积和蚀刻步骤以及在三个桥接电路中的一个上的多个通量引导器，用于将“Z”轴磁场传送到在XY平面中定向的传感器上。
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公开(公告)号：US09893274B2
公开(公告)日：2018-02-13
申请号：US15388650
申请日：2016-12-22
发明人： Renu Whig , Phillip Mather , Kenneth Smith , Sanjeev Aggarwal , Jon Slaughter , Nicholas Rizzo
CPC分类号： H01L43/12 , B82Y25/00 , G01R33/0052 , G01R33/09 , G01R33/093 , G01R33/098 , H01L27/22 , H01L43/02 , H01L43/08
摘要： A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
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公开(公告)号：US09553261B2
公开(公告)日：2017-01-24
申请号：US15145515
申请日：2016-05-03
发明人： Renu Whig , Phillip Mather , Kenneth Smith , Sanjeev Aggarwal , Jon Slaughter , Nicholas Rizzo
IPC分类号： H01L43/12 , H01L27/10 , H01L27/22 , H01L41/06 , G01R33/02 , B82Y25/00 , G01R33/00 , G01R33/09 , H01L43/08 , H01L43/02
CPC分类号： H01L43/12 , B82Y25/00 , G01R33/0052 , G01R33/09 , G01R33/093 , G01R33/098 , H01L27/22 , H01L43/02 , H01L43/08
摘要： A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
摘要翻译： 半导体工艺集成了三个桥接电路，每个电路包括在单个芯片上作为惠斯登电桥耦合的磁阻传感器，以在三个正交方向上感测磁场。 该过程包括形成磁阻传感器的各种沉积和蚀刻步骤以及在三个桥接电路中的一个上的多个通量引导器，用于将“Z”轴磁场传送到在XY平面中定向的传感器上。
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公开(公告)号：US09291687B2
公开(公告)日：2016-03-22
申请号：US14799070
申请日：2015-07-14
发明人： Bradley Engel , Phillip Mather
CPC分类号： G01R33/098 , B82Y25/00 , G01R33/0023 , G01R33/09 , G01R33/093
摘要： A semiconductor process and apparatus provide a high-performance magnetic field sensor with three differential sensor configurations which require only two distinct pinning axes, where each differential sensor is formed from a Wheatstone bridge structure with four unshielded magnetic tunnel junction sensor arrays, each of which includes a magnetic field pulse generator for selectively applying a field pulse to stabilize or restore the easy axis magnetization of the sense layers to orient the magnetization in the correct configuration. prior to measurements of small magnetic fields. The field pulse is sequentially applied to groups of the sense layers of the Wheatstone bridge structures, thereby allowing for a higher current pulse or larger sensor array size for maximal signal to noise ratio.
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8.发明授权Apparatus and method for sequentially resetting elements of a magnetic sensor array 有权用于顺序复位磁传感器阵列的元件的装置和方法公开(公告)号：US09110123B2
公开(公告)日：2015-08-18
申请号：US14532857
申请日：2014-11-04
发明人： Bradley Engel , Phillip Mather
CPC分类号： G01R33/098 , B82Y25/00 , G01R33/0023 , G01R33/09 , G01R33/093
摘要： A semiconductor process and apparatus provide a high-performance magnetic field sensor with three differential sensor configurations which require only two distinct pinning axes, where each differential sensor is formed from a Wheatstone bridge structure with four unshielded magnetic tunnel junction sensor arrays, each of which includes a magnetic field pulse generator for selectively applying a field pulse to stabilize or restore the easy axis magnetization of the sense layers to orient the magnetization in the correct configuration. prior to measurements of small magnetic fields. The field pulse is sequentially applied to groups of the sense layers of the Wheatstone bridge structures, thereby allowing for a higher current pulse or larger sensor array size for maximal signal to noise ratio.
摘要翻译： 半导体工艺和设备提供具有三个差分传感器配置的高性能磁场传感器，其仅需要两个不同的钉扎轴，其中每个差分传感器由具有四个非屏蔽磁隧道结传感器阵列的惠斯登电桥结构形成，每个包括 磁场脉冲发生器，用于选择性地施加场脉冲以稳定或恢复感测层的容易轴磁化，以使磁化在正确配置中定向。 在测量小磁场之前。 场脉冲顺序地施加到惠斯登电桥结构的感测层的组，从而允许更高的电流脉冲或更大的传感器阵列尺寸以获得最大的信噪比。
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公开(公告)号：US11678584B2
公开(公告)日：2023-06-13
申请号：US17245882
申请日：2021-04-30
发明人： Renu Whig , Phillip Mather , Kenneth Smith , Sanjeev Aggarwal , Jon Slaughter , Nicholas Rizzo
IPC分类号： H10N50/01 , B82Y25/00 , G01R33/00 , G01R33/09 , H10B61/00 , H10N59/00 , H10N50/10 , H10N50/80
CPC分类号： H10N50/01 , B82Y25/00 , G01R33/0052 , G01R33/09 , G01R33/093 , G01R33/098 , H10B61/00 , H10N50/10 , H10N50/80 , H10N59/00
摘要： A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
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公开(公告)号：USRE49404E1
公开(公告)日：2023-01-31
申请号：US15470997
申请日：2017-03-28
发明人： Phillip Mather , Jon Slaughter , Nicholas Rizzo
摘要： Three bridge circuits (101, 111, 121), each include magnetoresistive sensors coupled as a Wheatstone bridge (100) to sense a magnetic field (160) in three orthogonal directions (110, 120, 130) that are set with a single pinning material deposition and bulk wafer setting procedure. One of the three bridge circuits (121) includes a first magnetoresistive sensor (141) comprising a first sensing element (122) disposed on a pinned layer (126), the first sensing element (122) having first and second edges and first and second sides, and a first flux guide (132) disposed non-parallel to the first side of the substrate and having an end that is proximate to the first edge and on the first side of the first sensing element (122). An optional second flux guide (136) may be disposed non-parallel to the first side of the substrate and having an end that is proximate to the second edge and the second side of the first sensing element (122).
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