LOW-DENSITY MOLDING COMPOUND
    8.
    发明申请
    LOW-DENSITY MOLDING COMPOUND 有权
    低密度成型化合物

    公开(公告)号:US20140275336A1

    公开(公告)日:2014-09-18

    申请号:US14289093

    申请日:2014-05-28

    Abstract: A molding composition formulation includes a thermoset cross-linkable 12 to 45 micron polymeric resin. Hollow glass microspheroids are present from 2 to 12 total weight percent. An article formed from such a composition is further strengthened by the addition of a surface activating agent bonded to the surface of the glass microspheroids. Conventional particulate fillers when added to an inventive formulation provide enhanced performance when the filler particle has a size sufficiently small to insert within adjacent microspheroid interstitial voids. An unsaturated polyester resin so formed is particularly well suited for the formation of sheet molding compound formulations.

    Abstract translation: 模塑组合物配方包括热固性交联的12至45微米聚合物树脂。 中空玻璃微球存在2至12个总重量百分比。 通过添加粘合到玻璃微球表面的表面活化剂,进一步增强了由这种组合物形成的制品。 当添加到本发明的配方中时,常规的颗粒填料当填料颗粒具有足够小的尺寸以在相邻的微球间隙隙内插入时提供增强的性能。 如此形成的不饱和聚酯树脂特别适用于形成片状模塑料配方。

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