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    METHODS FOR PLANARIZING A SEMICONDUCTOR CONTACTOR
    1.
    发明申请
    METHODS FOR PLANARIZING A SEMICONDUCTOR CONTACTOR 失效
    用于平面化半导体接触器的方法

    公开(公告)号：US20080048688A1

    公开(公告)日：2008-02-28

    申请号：US11846012

    申请日：2007-08-28

    申请人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

    发明人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

    IPC分类号： G01R31/26

    CPC分类号： G01R1/07307 ,  G01R3/00

    摘要： A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.

    摘要翻译： 用于探针卡组件的平面化器。 平面化器包括从探针卡组件中的衬底延伸的第一控制构件。 第一控制构件延伸穿过探针卡组件中的至少一个衬底，并且可从探针卡组件中的外部衬底的暴露侧进入。 驱动第一控制构件导致连接到第一控制构件的衬底的偏转。

    PROBING A DEVICE
    2.
    发明申请
    PROBING A DEVICE 失效
    探索一个设备

    公开(公告)号：US20070262767A1

    公开(公告)日：2007-11-15

    申请号：US11748988

    申请日：2007-05-15

    申请人： Timothy Cooper ,  Benjamin Eldridge ,  Igor Khandros ,  Rod Martens ,  Gaetan Mathieu

    发明人： Timothy Cooper ,  Benjamin Eldridge ,  Igor Khandros ,  Rod Martens ,  Gaetan Mathieu

    IPC分类号： G01R31/28 ,  G01R1/06

    CPC分类号： G01R31/2886 ,  G01R31/2887

    摘要： An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.

    摘要翻译： 电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。 然后电子设备水平或对角地移动，使得端子接触探针。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

    Composite Motion Probing
    3.
    发明申请
    Composite Motion Probing 失效
    复合运动探测

    公开(公告)号：US20070170941A1

    公开(公告)日：2007-07-26

    申请号：US11697603

    申请日：2007-04-06

    申请人： Timothy Cooper ,  Benjamin Eldridge ,  Igor Khandros ,  Rod Martens ,  Gaetan Mathieu

    发明人： Timothy Cooper ,  Benjamin Eldridge ,  Igor Khandros ,  Rod Martens ,  Gaetan Mathieu

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2887 ,  G01R1/06705 ,  G01R31/2886

    摘要： An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

    摘要翻译： 电子设备相对于用于与设备电接触的探针移动到第一位置。 然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。 进入第二位置的运动包括两个部件。 移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。 第二动作往往会减轻压力。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

    METHOD AND SYSTEM FOR COMPENSATING THERMALLY INDUCED MOTION OF PROBE CARDS
    5.
    发明申请
    METHOD AND SYSTEM FOR COMPENSATING THERMALLY INDUCED MOTION OF PROBE CARDS 有权
    用于补偿探针卡的热诱导运动的方法和系统

    公开(公告)号：US20070139060A1

    公开(公告)日：2007-06-21

    申请号：US11548183

    申请日：2006-10-10

    申请人： Rod Martens ,  Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    发明人： Rod Martens ,  Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R31/2886

    摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

    摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

    Probe Array and Method of Its Manufacture
    8.
    发明申请
    Probe Array and Method of Its Manufacture 有权
    探针阵列及其制造方法

    公开(公告)号：US20070062913A1

    公开(公告)日：2007-03-22

    申请号：US11550340

    申请日：2006-10-17

    申请人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

    发明人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

    IPC分类号： B23H9/00 ,  B23H5/00

    CPC分类号： B23H9/00 ,  G01R1/07314

    摘要： A method of forming a probe array includes forming a layer of tip material over a block of probe material. A first electron discharge machine (EDM) electrode is positioned over the layer of tip material, the EDM electrode having a plurality of openings corresponding to a plurality of probes to be formed. Excess material from the layer of tip material and the block of probe material is removed to form the plurality of probes. A substrate having a plurality of through holes corresponding to the plurality of probes is positioned so that the probes penetrate the plurality of through holes. The substrate is bonded to the plurality of probes. Excess probe material is removed so as to planarize the substrate.

    摘要翻译： 形成探针阵列的方法包括在探针材料块上形成尖端材料层。 第一电子放电机（EDM）电极位于尖端材料层上方，EDM电极具有与要形成的多个探针对应的多个开口。 去除从尖端材料层和探针材料块的多余材料以形成多个探针。 具有对应于多个探针的多个通孔的基板被定位成使得探针穿透多个通孔。 衬底被结合到多个探针。 去除过量的探针材料以使基底平坦化。