发明申请
US20070075715A1 Contact Carriers (Tiles) For Populating Larger Substrates With Spring Contacts
失效
联系承运人（瓷砖）用于填充较大的基板与弹簧触点
- 专利标题： Contact Carriers (Tiles) For Populating Larger Substrates With Spring Contacts
- 专利标题（中）： 联系承运人（瓷砖）用于填充较大的基板与弹簧触点
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申请号： US11561297申请日： 2006-11-17
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公开(公告)号： US20070075715A1公开(公告)日： 2007-04-05
- 发明人: Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Thomas Dozier , William Smith
- 申请人： Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Thomas Dozier , William Smith
- 专利权人： FormFactor, Inc.
- 当前专利权人： FormFactor, Inc.
- 主分类号： G01R31/02
- IPC分类号： G01R31/02
摘要：
An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.
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