公开(公告)号：US20080042668A1

公开(公告)日：2008-02-21

申请号：US11877466

申请日：2007-10-23

申请人： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

发明人： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

IPC分类号： G01R1/073

CPC分类号： G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

摘要翻译： 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

公开(公告)号：US20080048688A1

公开(公告)日：2008-02-28

申请号：US11846012

申请日：2007-08-28

申请人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

发明人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

IPC分类号： G01R31/26

CPC分类号： G01R1/07307 ,  G01R3/00

摘要： A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.

摘要翻译： 用于探针卡组件的平面化器。 平面化器包括从探针卡组件中的衬底延伸的第一控制构件。 第一控制构件延伸穿过探针卡组件中的至少一个衬底，并且可从探针卡组件中的外部衬底的暴露侧进入。 驱动第一控制构件导致连接到第一控制构件的衬底的偏转。

公开(公告)号：US20070139060A1

公开(公告)日：2007-06-21

申请号：US11548183

申请日：2006-10-10

申请人： Rod Martens ,  Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

发明人： Rod Martens ,  Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

IPC分类号： G01R31/02

CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R31/2886

摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

公开(公告)号：US20070126443A1

公开(公告)日：2007-06-07

申请号：US11669010

申请日：2007-01-30

申请人： Gary Grube ,  Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu

发明人： Gary Grube ,  Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu

IPC分类号： G01R31/02

CPC分类号： G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  G01R31/2889 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49453

摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

摘要翻译： 一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。 此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。 使用接收到的数据，选择一个或多个预制元素。 再次使用接收的数据，定制一个或多个所选择的预制元素。 然后使用选定和定制的元件构建探针卡组件。

公开(公告)号：US20070062913A1

公开(公告)日：2007-03-22

申请号：US11550340

申请日：2006-10-17

申请人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

发明人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

IPC分类号： B23H9/00 ,  B23H5/00

CPC分类号： B23H9/00 ,  G01R1/07314

摘要： A method of forming a probe array includes forming a layer of tip material over a block of probe material. A first electron discharge machine (EDM) electrode is positioned over the layer of tip material, the EDM electrode having a plurality of openings corresponding to a plurality of probes to be formed. Excess material from the layer of tip material and the block of probe material is removed to form the plurality of probes. A substrate having a plurality of through holes corresponding to the plurality of probes is positioned so that the probes penetrate the plurality of through holes. The substrate is bonded to the plurality of probes. Excess probe material is removed so as to planarize the substrate.

摘要翻译： 形成探针阵列的方法包括在探针材料块上形成尖端材料层。 第一电子放电机（EDM）电极位于尖端材料层上方，EDM电极具有与要形成的多个探针对应的多个开口。 去除从尖端材料层和探针材料块的多余材料以形成多个探针。 具有对应于多个探针的多个通孔的基板被定位成使得探针穿透多个通孔。 衬底被结合到多个探针。 去除过量的探针材料以使基底平坦化。

公开(公告)号：US20050148214A1

公开(公告)日：2005-07-07

申请号：US10933063

申请日：2004-09-02

申请人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

发明人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

IPC分类号： G01R1/067 ,  G01R3/00 ,  H05K3/32 ,  H05K3/40 ,  H01R12/00

CPC分类号： G01R3/00 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06744 ,  G01R1/06761 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13012 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H05K3/326 ,  H05K3/4092 ,  Y10S438/977 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

摘要： A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.

摘要翻译： 通过光刻技术形成包括弹簧接触元件的互连的方法。 在一个实施例中，该方法包括在衬底的第一部分上施加掩模材料，掩模材料具有将限定弹簧结构的第一部分的开口，在开口中沉积结构材料（例如导电材料） 并用结构材料过度填充开口，去除结构材料的一部分，以及去除掩模材料的第一部分。 在该实施例中，弹簧结构的第一部分的至少一部分没有掩蔽材料。 在本发明的一个方面，该方法包括平坦化掩模材料层和结构材料以去除结构材料的一部分。 另一方面，形成的弹簧结构包括柱部分，梁部分和尖端结构部分中的一个。

公开(公告)号：US20070247176A1

公开(公告)日：2007-10-25

申请号：US11692035

申请日：2007-03-27

申请人： Gary Grube ,  Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu ,  Poya Lotfizadeh ,  Chih-Chiang Tseng

发明人： Gary Grube ,  Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu ,  Poya Lotfizadeh ,  Chih-Chiang Tseng

IPC分类号： G01R31/26 ,  G01R31/04

CPC分类号： G01R31/2886 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R3/00 ,  Y10T29/49126

摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

摘要翻译： 一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。 此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。 使用接收到的数据，选择一个或多个预制元素。 再次使用接收的数据，定制一个或多个所选择的预制元素。 然后使用选定和定制的元件构建探针卡组件。

公开(公告)号：US20060237856A1

公开(公告)日：2006-10-26

申请号：US11456568

申请日：2006-07-11

申请人： Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

发明人： Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

IPC分类号： H01L23/52

CPC分类号： G01R3/00 ,  B23K2101/38 ,  G01R1/06727 ,  G01R1/06744 ,  H01L21/6835 ,  H01L23/4951 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/57 ,  H05K3/4092 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00

摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.

摘要翻译： 通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。 开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。 每个弹簧接触元件具有基端部分，接触端部分和中心体部分。 接触端部在与中心体部分相同的z轴（不同高度）偏移。 基端部优选地沿着与中心主体部分的z轴相反的方向偏移。 以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。 弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸 的电子元件。 在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。

公开(公告)号：US20080094088A1

公开(公告)日：2008-04-24

申请号：US11963575

申请日：2007-12-21

申请人： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

发明人： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

IPC分类号： G01R31/26

CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

公开(公告)号：US20060255814A1

公开(公告)日：2006-11-16

申请号：US11306515

申请日：2005-12-30

申请人： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

发明人： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

IPC分类号： G01R31/02

CPC分类号： G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

摘要翻译： 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在布线基板附接到加强板的其他位置处设置空间，使得布线基板相对于加强板可以膨胀和收缩。