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    METHODS FOR PLANARIZING A SEMICONDUCTOR CONTACTOR
    1.
    发明申请
    METHODS FOR PLANARIZING A SEMICONDUCTOR CONTACTOR 失效
    用于平面化半导体接触器的方法

    公开(公告)号：US20080048688A1

    公开(公告)日：2008-02-28

    申请号：US11846012

    申请日：2007-08-28

    申请人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

    发明人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

    IPC分类号： G01R31/26

    CPC分类号： G01R1/07307 ,  G01R3/00

    摘要： A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.

    摘要翻译： 用于探针卡组件的平面化器。 平面化器包括从探针卡组件中的衬底延伸的第一控制构件。 第一控制构件延伸穿过探针卡组件中的至少一个衬底，并且可从探针卡组件中的外部衬底的暴露侧进入。 驱动第一控制构件导致连接到第一控制构件的衬底的偏转。

    METHOD AND SYSTEM FOR COMPENSATING THERMALLY INDUCED MOTION OF PROBE CARDS
    2.
    发明申请
    METHOD AND SYSTEM FOR COMPENSATING THERMALLY INDUCED MOTION OF PROBE CARDS 有权
    用于补偿探针卡的热诱导运动的方法和系统

    公开(公告)号：US20070139060A1

    公开(公告)日：2007-06-21

    申请号：US11548183

    申请日：2006-10-10

    申请人： Rod Martens ,  Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    发明人： Rod Martens ,  Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R31/2886

    摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

    摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

    Probe Array and Method of Its Manufacture
    4.
    发明申请
    Probe Array and Method of Its Manufacture 有权
    探针阵列及其制造方法

    公开(公告)号：US20070062913A1

    公开(公告)日：2007-03-22

    申请号：US11550340

    申请日：2006-10-17

    申请人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

    发明人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

    IPC分类号： B23H9/00 ,  B23H5/00

    CPC分类号： B23H9/00 ,  G01R1/07314

    摘要： A method of forming a probe array includes forming a layer of tip material over a block of probe material. A first electron discharge machine (EDM) electrode is positioned over the layer of tip material, the EDM electrode having a plurality of openings corresponding to a plurality of probes to be formed. Excess material from the layer of tip material and the block of probe material is removed to form the plurality of probes. A substrate having a plurality of through holes corresponding to the plurality of probes is positioned so that the probes penetrate the plurality of through holes. The substrate is bonded to the plurality of probes. Excess probe material is removed so as to planarize the substrate.

    摘要翻译： 形成探针阵列的方法包括在探针材料块上形成尖端材料层。 第一电子放电机（EDM）电极位于尖端材料层上方，EDM电极具有与要形成的多个探针对应的多个开口。 去除从尖端材料层和探针材料块的多余材料以形成多个探针。 具有对应于多个探针的多个通孔的基板被定位成使得探针穿透多个通孔。 衬底被结合到多个探针。 去除过量的探针材料以使基底平坦化。

    Method and System for Compensating Thermally Induced Motion of Probe Cards
    6.
    发明申请
    Method and System for Compensating Thermally Induced Motion of Probe Cards 有权
    用于补偿探针卡热敏感运动的方法和系统

    公开(公告)号：US20080094088A1

    公开(公告)日：2008-04-24

    申请号：US11963575

    申请日：2007-12-21

    申请人： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    发明人： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    IPC分类号： G01R31/26

    CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

    摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

    摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

    Apparatus And Method For Managing Thermally Induced Motion Of A Probe Card Assembly
    7.
    发明申请
    Apparatus And Method For Managing Thermally Induced Motion Of A Probe Card Assembly 有权
    用于管理探针卡组件的热诱导运动的装置和方法

    公开(公告)号：US20060255814A1

    公开(公告)日：2006-11-16

    申请号：US11306515

    申请日：2005-12-30

    申请人： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

    发明人： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

    摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

    摘要翻译： 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在布线基板附接到加强板的其他位置处设置空间，使得布线基板相对于加强板可以膨胀和收缩。

    Method And System For Compensating Thermally Induced Motion Of Probe Cards
    8.
    发明申请
    Method And System For Compensating Thermally Induced Motion Of Probe Cards 失效
    用于补偿探针卡的热诱导运动的方法和系统

    公开(公告)号：US20060238211A1

    公开(公告)日：2006-10-26

    申请号：US11428423

    申请日：2006-07-03

    申请人： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    发明人： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

    摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

    摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。