Method of forming monolithic semiconductor integrated circuit devices
    7.
    发明授权
    Method of forming monolithic semiconductor integrated circuit devices 失效
    形成单片半导体集成电路器件的方法

    公开(公告)号:US3653988A

    公开(公告)日:1972-04-04

    申请号:US3653988D

    申请日:1969-04-03

    Abstract: This method of fabricating junction-isolated semiconductor integrated circuit devices eliminates the photolithographic masking operation associated with a base diffusion by performing a non-selective P-type base diffusion into the entire surface of a thin N-type epitaxial layer. The lateral extent of base zones and resistor zones is defined by selectively diffusing low resistivity N-type deep contact zones completely through the epitaxial layer to intersect the entire perimeter of a buried Nlayer. Junction isolation, consisting of either back-to-back diodes or junction field-effect transistors, may be used.

    Abstract translation: 制造结隔离半导体集成电路器件的这种方法通过对薄N型外延层的整个表面进行非选择性P型基极扩散来消除与基极扩散相关的光刻掩模操作。 通过选择性地将低电阻率的N型深接触区域完全扩散通过外延层与掩埋的N层的整个周边相交,来限定基极区域和电阻器区域的横向范围。 可以使用由背对背二极管或结型场效应晶体管组成的结隔离。

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