Abstract:
A self-isolating, gate-controllable, space-charge-limited impedance device is provided for use advantageously in combination with other devices in semiconductor integrated circuits. In the impedance device, space-charge-limited current between a plurality of spaced surface zones is controlled by applying a potential to a surface layer through one or more electrodes.
Abstract:
An annular PN junction in conjunction with a relatively high resistivity substrate enables improved means for isolating functional elements in a monolithic semiconductor integrated circuit. In a semiconductor wafer, localized emitter zones and collector zones extend to a common depth from the surface of the wafer. The collector zone is annular in shape and encloses laterally the emitter zone. The resistivities and spacings of the regions in the wafer are such that with the annular PN junction reverse-biased, the depletion region therefrom extends completely underneath the material enclosed by the annular zone and thereby provides electrical isolation for a functional element in the enclosed material.
Abstract:
This method of fabricating junction-isolated semiconductor integrated circuit devices eliminates the photolithographic masking operation associated with a base diffusion by performing a non-selective P-type base diffusion into the entire surface of a thin N-type epitaxial layer. The lateral extent of base zones and resistor zones is defined by selectively diffusing low resistivity N-type deep contact zones completely through the epitaxial layer to intersect the entire perimeter of a buried Nlayer. Junction isolation, consisting of either back-to-back diodes or junction field-effect transistors, may be used.
Abstract:
An annular PN junction in conjunction with a relatively high resistivity substrate enables improved means for isolating functional elements in a monolithic semiconductor integrated circuit. In a semiconductor wafer, localized emitter zones and collector zones extend to a common depth from the surface of the wafer. The collector zone is annular in shape and encloses laterally the emitter zone. The resistivities and spacings of the regions in the wafer are such that with the annular PN junction reverse-biased, the depletion region therefrom extends completely underneath the material enclosed by the annular zone and thereby provides electrical isolation for a functional element in the enclosed material.