Monolithic integrated circuit structures and methods of making same
    2.
    发明授权
    Monolithic integrated circuit structures and methods of making same 失效
    单片集成电路结构及其制作方法

    公开(公告)号:US3701198A

    公开(公告)日:1972-10-31

    申请号:US3701198D

    申请日:1970-08-14

    CPC classification number: H01L21/765 H01L27/00

    Abstract: An annular PN junction in conjunction with a relatively high resistivity substrate enables improved means for isolating functional elements in a monolithic semiconductor integrated circuit. In a semiconductor wafer, localized emitter zones and collector zones extend to a common depth from the surface of the wafer. The collector zone is annular in shape and encloses laterally the emitter zone. The resistivities and spacings of the regions in the wafer are such that with the annular PN junction reverse-biased, the depletion region therefrom extends completely underneath the material enclosed by the annular zone and thereby provides electrical isolation for a functional element in the enclosed material.

    Abstract translation: 结合相对高电阻率的衬底的环形PN结使得能够改进用于隔离单片半导体集成电路中的功能元件的装置。 在半导体晶片中,局部发射区和集电区延伸到与晶片表面相同的深度。 收集器区域是环形的,并且侧向包围发射区。 晶片中的区域的电阻率和间距是这样的,即环形PN结反向偏置,其耗尽区完全在由环形区域包围的材料下方延伸,从而为封闭材料中的功能元件提供电气隔离。

    Method of forming monolithic semiconductor integrated circuit devices
    3.
    发明授权
    Method of forming monolithic semiconductor integrated circuit devices 失效
    形成单片半导体集成电路器件的方法

    公开(公告)号:US3653988A

    公开(公告)日:1972-04-04

    申请号:US3653988D

    申请日:1969-04-03

    Abstract: This method of fabricating junction-isolated semiconductor integrated circuit devices eliminates the photolithographic masking operation associated with a base diffusion by performing a non-selective P-type base diffusion into the entire surface of a thin N-type epitaxial layer. The lateral extent of base zones and resistor zones is defined by selectively diffusing low resistivity N-type deep contact zones completely through the epitaxial layer to intersect the entire perimeter of a buried Nlayer. Junction isolation, consisting of either back-to-back diodes or junction field-effect transistors, may be used.

    Abstract translation: 制造结隔离半导体集成电路器件的这种方法通过对薄N型外延层的整个表面进行非选择性P型基极扩散来消除与基极扩散相关的光刻掩模操作。 通过选择性地将低电阻率的N型深接触区域完全扩散通过外延层与掩埋的N层的整个周边相交,来限定基极区域和电阻器区域的横向范围。 可以使用由背对背二极管或结型场效应晶体管组成的结隔离。

    Monolithic integrated circuit structure
    4.
    发明授权
    Monolithic integrated circuit structure 失效
    单片集成电路结构

    公开(公告)号:US3614555A

    公开(公告)日:1971-10-19

    申请号:US3614555D

    申请日:1968-12-23

    Abstract: An annular PN junction in conjunction with a relatively high resistivity substrate enables improved means for isolating functional elements in a monolithic semiconductor integrated circuit. In a semiconductor wafer, localized emitter zones and collector zones extend to a common depth from the surface of the wafer. The collector zone is annular in shape and encloses laterally the emitter zone. The resistivities and spacings of the regions in the wafer are such that with the annular PN junction reverse-biased, the depletion region therefrom extends completely underneath the material enclosed by the annular zone and thereby provides electrical isolation for a functional element in the enclosed material.

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