公开(公告)号：US20210115258A1

公开(公告)日：2021-04-22

申请号：US16606570

申请日：2018-04-13

申请人： Ares Materials Inc.

发明人： Radu REIT ,  Adrian AVENDANO-BOLIVAR ,  David ARREAGA-SALAS

IPC分类号： C08L101/12 ,  G03F7/09 ,  H01L27/12 ,  G02F1/1333 ,  B05D3/06 ,  B05D3/12

摘要： Provided are methods for selecting a polymer for use as a flexible electronics substrate. An example method includes selecting a thermosetting polymer from a plurality of polymers, wherein the thermosetting polymer: undergoes a thermomechanical transition at a transition temperature between room temperature and the highest temperature observed during processing from the glassy to the rubbery regime; wherein the thermosetting polymer has a Young's modulus below 3 GPa in the glassy regime and wherein the thermosetting polymer has a Young's modulus above 0.3 MPa in the rubbery regime. The method further includes producing a flexible electronic substrate from the selected polymer.

公开(公告)号：US20190305239A1

公开(公告)日：2019-10-03

申请号：US16462891

申请日：2017-11-27

申请人： ARES MATERIALS INC.

发明人： Radu REIT ,  David ARREAGA-SALAS

IPC分类号： H01L51/00 ,  B32B17/10 ,  H01L27/12 ,  B32B37/26

摘要： Provided are microelectronics substrates and methods of manufacturing and using the microelectronics substrate. An example of a microelectronics substrate includes a carrier, a silicate bonding layer, and a flexible substrate, wherein the flexible substrate is bonded to the silicate bonding layer. The microelectronics substrate comprises a peel strength between the flexible substrate and silicate bonding layer; wherein the peel strength between the flexible substrate and the silicate bonding layer is below 1 kgf/m.

公开(公告)号：US20200255709A1

公开(公告)日：2020-08-13

申请号：US16756081

申请日：2017-10-17

申请人： Ares Materials Inc.

发明人： Radu REIT ,  Jesus Espinoza DIAZ ,  Adrian AVENDANO-BOLIVAR ,  Apostolos VOUTSAS ,  David ARREAGA-SALAS

IPC分类号： C09J181/04 ,  B32B7/12

摘要： Provided are semi -interpenetrating optically clear adhesives, methods of use, and methods of manufacture. An example semi-interpenetrating optically clear adhesive comprises a transparent polymer network comprised of at least two or more interpenetrating polymer networks, wherein at least one polymer network is a thermoset material and at least one other polymer network is a thermoplastic material, yielding an optically clear adhesive with a transparency above 80% and an elastic toughness above 1 MJ/m3.

公开(公告)号：US20210147631A1

公开(公告)日：2021-05-20

申请号：US16629869

申请日：2018-06-20

申请人： Ares Materials Inc.

发明人： Radu REIT ,  Adrian AVENDANO-BOLIVAR ,  Apostolos VOUTSAS ,  David ARREAGA-SALAS

IPC分类号： C08G75/045 ,  H01L21/768

摘要： Provided is a method for forming an organic planarization layer. The method includes forming lithographically-patterned arrays atop a substrate; disposing a thiol-based photocurable resin on to the lithographically-patterned arrays to form a photocurable planarization layer; and curing the photocurable planarization layer to form a flat surface above the lithographically-patterned array.

公开(公告)号：US20190338092A1

公开(公告)日：2019-11-07

申请号：US16481438

申请日：2018-01-24

申请人： Ares Materials Inc.

发明人： Radu REIT ,  Adrian AVENDANO-BOLIVAR ,  David ARREAGA-SALAS

IPC分类号： C08J5/18 ,  G02B5/20 ,  C08G75/045 ,  C08J7/04 ,  G03F7/00 ,  B29C41/02

摘要： Provided are flexible color filters and methods of manufacturing flexible color filters. An example flexible color filter comprises a transparent flexible substrate comprising a thermoset thiol-click polymer. An example method of manufacturing a flexible color filter comprises dispensing a release layer on a stiff carrier substrate; dispensing a polymer resin on the release layer; curing the polymer resin into a transparent film; fabricating a flexible color filter on the transparent film; and removing the flexible color filter from the release layer and stiff carrier substrate.

公开(公告)号：US20170374736A1

公开(公告)日：2017-12-28

申请号：US15698426

申请日：2017-09-07

申请人： Ares Materials, Inc.

发明人： Radu REIT ,  David ARREAGA-SALAS

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K3/00

CPC分类号： H05K1/0283 ,  H01L27/1218 ,  H01L51/0097 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/0023 ,  H05K3/0055 ,  H05K2201/0141 ,  H05K2201/0187 ,  H05K2203/0143 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K2203/1163 ,  H05K2203/1194 ,  H05K2203/1476 ,  H05K2203/1545

摘要： A bulk substrate for stretchable electronics. The bulk substrate is manufactured with a process that forms a soft-elastic region of the bulk substrate. The soft-elastic region includes a strain capacity of greater than or equal to 25% and a first Young's modulus below 10% of a maximum local modulus of the bulk substrate. The process also forms a stiff-elastic region of the bulk substrate. The stiff-elastic region includes a strain capacity of less than or equal to 5% and a second Young's modulus greater than 10% of the maximum local modulus of the bulk substrate.

公开(公告)号：US20170338254A1

公开(公告)日：2017-11-23

申请号：US15494000

申请日：2017-04-21

申请人： ARES Materials, Inc.

发明人： Radu REIT ,  Adrian AVENDANO-BOLIVAR ,  David ARREAGA-SALAS

IPC分类号： H01L27/12 ,  B05D3/00 ,  H01L29/786 ,  B05D1/00 ,  B05D1/28 ,  H05K1/18 ,  H01L27/32

CPC分类号： H01L27/1266 ,  B05D1/005 ,  B05D1/28 ,  B05D3/007 ,  H01L27/1218 ,  H01L27/1225 ,  H01L27/3262 ,  H01L29/78603 ,  H01L29/7869 ,  H01L51/0097 ,  H01L2227/326 ,  H01L2251/5338 ,  H05K1/0393 ,  H05K1/189 ,  H05K2201/0108

摘要： Provided are flexible electronics stacks and methods of use. An example flexible electronics stack includes a flexible polymeric substrate film and a rigid inorganic electronic component. The flexible polymeric substrate film includes a thermoset polymer prepared by curing a monomer solution; wherein the monomer solution comprises about 25 wt % to about 65 wt % of one or more thiol monomers and from about 25 wt % to about 65 wt % of one or more co-monomers.