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公开(公告)号：US20240100714A1
公开(公告)日：2024-03-28
申请号：US18514818
申请日：2023-11-20
Applicant: Applied Materials, Inc.
Inventor： Jagan RANGARAJAN , Edward GOLUBOVSKY , Edwin VALAZQUEZ , Adrian S. BLANK , Steven M. ZUNIGA , Balasubramaniam C. JAGANNATHAN
CPC classification number: B25J11/0095 , B25J9/042 , B25J11/0085 , B25J15/0206
Abstract: Embodiments described herein generally relate to equipment used in the manufacturing of electronic devices, and more particularly, to a cleaning system, cleaning system hardware and related methods which may be used to transport and clean the surface of a substrate. According to one embodiment, a substrate cleaning unit may include a pre-clean chamber that performs a pre-clean process on a substrate with the substrate in a horizontal orientation. The unit may also include a first cleaning chamber that performs a first cleaning process on the substrate with the substrate in a vertical orientation. The unit may also include a second cleaning chamber. The unit may also include an integrated cleaning and drying chamber that performs a cleaning and drying process on the substrate in the horizontal orientation. A substrate handler may transfer the substrate between the chambers. The first and second cleaning chambers may be positioned below the pre-clean chamber.
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公开(公告)号：US20210323117A1
公开(公告)日：2021-10-21
申请号：US16851012
申请日：2020-04-16
Applicant: Applied Materials, Inc.
Inventor： Jagan RANGARAJAN , Edward GOLUBOVSKY , Jay GURUSAMY , Steven M. ZUNIGA
IPC: B24B37/34 , B24B37/30 , B24B37/04 , H01L21/306 , H01L21/67 , H01L21/677
Abstract: Embodiments herein include high throughput density chemical mechanical polishing (CMP) modules and customizable modular CMP systems formed thereof. In one embodiment, a polishing module features a carrier support module, a carrier loading station, and a polishing station. The carrier support module features a carrier platform and one or more carrier assemblies. The one or more carrier assemblies each comprise a corresponding carrier head suspended from the carrier platform. The carrier loading station is used to transfer substrates to and from the carrier heads. The polishing station comprises a polishing platen. The carrier support module, the substrate loading station, and the polishing station comprise a one-to-one-to-one relationship within each of the polishing modules. The carrier support module is positioned to move the one or more carrier assemblies between a substrate polishing position disposed above the polishing platen and a substrate transfer position disposed above the substrate loading station.
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公开(公告)号：US20230264319A1
公开(公告)日：2023-08-24
申请号：US18094225
申请日：2023-01-06
Applicant: Applied Materials, Inc.
Inventor： Edward GOLUBOVSKY , Clinton SAKATA , Jagan RANGARAJAN , Ekaterina A. MIKHAYLICHENKO
CPC classification number: B24B41/061 , B24B37/20
Abstract: A pad carrier assembly that includes a coupling base and a pad carrier coupled to the coupling base, the coupling base and the pad carrier are configured to support a buffing pad by a mechanical clamping mechanism. Embodiments of the present disclosure will provide a method of supporting a buffing pad in a horizontal pre-clean module. The method includes mechanically clamping or retaining a buffing pad on a peripheral edge of the buffing pad, wherein the coupling base and the pad carrier are coupled and disposed in a horizontal pre-clean module, and supporting the buffing pad and preventing the buffing pad from sagging, by use of one or more pad retaining features.
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公开(公告)号：US20200086453A1
公开(公告)日：2020-03-19
申请号：US16543160
申请日：2019-08-16
Applicant: Applied Materials, Inc.
Inventor： Edward GOLUBOVSKY
Abstract: Embodiments described herein relate to rotary unions for use in wafer cleaning processes. The rotary union includes a process media and a supporting media that interact in a gap between a nozzle and rotary element. By regulating the supporting media pressure, a non-contact seal is created within the gap. The non-contact seal prevents or controls process media leakage in a rotary union while enabling delivery of the process media through a platen directly underneath of a wafer without the risk of additional contamination of the process media, reducing the defect to the wafer. Additionally, the non-contact seal precludes particle generation due to seal wear, caused for example in face seals, and does not leech out any additional foreign elements.
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公开(公告)号：US20240412985A1
公开(公告)日：2024-12-12
申请号：US18731436
申请日：2024-06-03
Applicant: Applied Materials, Inc.
Inventor： Clinton SAKATA , Ricardo MARTINEZ , Robert DUES , Shih-Yu LIU , Tarun Kumar ABICHANDANI , Brian K. KIRKPATRICK , Jagan RANGARAJAN , Adrian S. BLANK , Edward GOLUBOVSKY , Justin H. WONG
IPC: H01L21/67 , B65G47/90 , H01L21/687
Abstract: A substrate cleaning system to remove particulates from multiple substrates includes a cleaning tank for applying a cleaning liquid to substrates, a rinse tank for applying a rinsing liquid to substrates, and a robot system. The cleaning tank includes a stationary lid, an input lid, and an output lid. The input and output lids allow a substrate carrier designed to carry an individual substrate to access an inner volume of the cleaning tank for processing. A transport system moves the substrate in the substrate carrier through the inner volume of the cleaning tank by creating a series of gaps between substrates to allow proper processing. The robot system transports substrates through the input and output lids of the cleaning tank, and transports substrates into the rinse tank.
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Patent Agency Ranking
公开(公告)号：US20240100713A1
公开(公告)日：2024-03-28
申请号：US18244679
申请日：2023-09-11
Applicant: Applied Materials, Inc.
Inventor： Jagan RANGARAJAN , Edward GOLUBOVSKY , Edwin VELAZQUEZ , Adrian S. BLANK , Steven M. ZUNIGA , Balasubramaniam C. JAGANNATHAN
CPC classification number: B25J11/0095 , B25J9/042 , B25J11/0085 , B25J15/0206
Abstract: Embodiments described herein generally relate to equipment used in the manufacturing of electronic devices, and more particularly, to a cleaning system, cleaning system hardware and related methods which may be used to transport and clean the surface of a substrate. According to one embodiment, a blade handling assembly for handling a substrate in a cleaning system includes a gripping assembly including a pair of gripping blades, the blades operable with a gripping actuator to hold a substrate at its edges. The assembly includes a first blade actuator for moving the gripping assembly and substrate between a horizontal and a vertical orientation utilizing a first axis. The assembly includes a second blade actuator for moving the vertically oriented gripping assembly and substrate 180 degrees utilizing a second axis, thereby causing the substrate to face an opposite direction. Movement utilizing the first axis results in rotation of the first and second blade actuators and movement utilizing the second axis results in rotation of only the second blade actuator.
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公开(公告)号：US20210323119A1
公开(公告)日：2021-10-21
申请号：US17076315
申请日：2020-10-21
Applicant: Applied Materials, Inc.
Inventor： Jagan RANGARAJAN , Edward GOLUBOVSKY , Jay GURUSAMY , Steven M. ZUNIGA
IPC: B24B37/34 , B24B37/30 , B24B37/04 , H01L21/67 , H01L21/677 , H01L21/306
Abstract: Embodiments herein include high throughput density chemical mechanical polishing (CMP) modules and customizable modular CMP systems formed thereof. In one embodiment, a polishing module features a carrier support module, a carrier loading station, and a polishing station. The carrier support module features a carrier platform and one or more carrier assemblies. The one or more carrier assemblies each comprise a corresponding carrier head suspended from the carrier platform. The carrier loading station is used to transfer substrates to and from the carrier heads. The polishing station comprises a polishing platen. The carrier support module, the substrate loading station, and the polishing station comprise a one-to-one-to-one relationship within each of the polishing modules. The carrier support module is positioned to move the one or more carrier assemblies between a substrate polishing position disposed above the polishing platen and a substrate transfer position disposed above the substrate loading station.
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公开(公告)号：US20240363371A1
公开(公告)日：2024-10-31
申请号：US18309314
申请日：2023-04-28
Applicant: Applied Materials, Inc.
Inventor： Edward GOLUBOVSKY , Steven M. ZUNIGA , Jagan RANGARAJAN , Avyay PANCHAPAKESAN
CPC classification number: H01L21/67046 , B08B1/12 , B08B1/32 , H01L21/02052
Abstract: A substrate cleaning apparatus is provided including: a shaft having an outer body and an interior volume, the shaft having a length in a first direction; and a pad carrier assembly comprising: a housing connected to the outer body in a fixed position relative to the outer body of the shaft, the housing having an inner volume; a piston disposed in the inner volume of the housing, the piston movable in the first direction based on pressure changes in the inner volume of the shaft; a pad carrier; and a flexible member connected between the housing and the pad carrier, the flexible member configured to extend or retract in the first direction with the pad carrier based on the pressure changes in the interior volume of the shaft.
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公开(公告)号：US20220199396A1
公开(公告)日：2022-06-23
申请号：US17511437
申请日：2021-10-26
Applicant: Applied Materials, Inc.
Inventor： Edward GOLUBOVSKY , Jagan RANGARAJAN , Ekaterina MIKHAYLICHENKO
IPC: H01L21/02 , H01L21/683 , H01L21/687 , H01L21/677
Abstract: A horizontal pre-clean module includes a chamber including a basin and a lid which collectively define a processing area, a rotatable vacuum table disposed in the processing area, the rotatable vacuum table including a substrate receiving surface, a pad conditioning station disposed proximate to the rotatable vacuum table, a pad carrier positioning arm having a first end and a second end distal from the first end, a pad carrier assembly coupled to the first end of the pad carrier positioning arm, and an actuator coupled to the second end of the pad carrier positioning arm and configured to swing the pad carrier assembly between a first position over the rotatable vacuum table and a second position over the pad conditioning station. The pad carrier assembly includes a gimbal base and a pad carrier coupled to the gimbal base, the gimbal base and the pad carrier are configured to support a buffing pad by a mechanical clamping mechanism and a suction clamping mechanism.
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公开(公告)号：US20220134505A1
公开(公告)日：2022-05-05
申请号：US17510111
申请日：2021-10-25
Applicant: Applied Materials, Inc.
Inventor： Edward GOLUBOVSKY , Clinton SAKATA , Jagan RANGARAJAN , Ekaterina A. MIKHAYLICHENKO , Steven M. ZUNIGA
Abstract: A horizontal pre-clean (HPC) module for a chemical mechanical polishing (CMP) processing system is disclosed. The HPC module includes a chamber having a basin and a lid which collectively define a processing area. The module includes a rotatable vacuum table disposed in the processing area, the rotatable vacuum table including an array of channels defined in a supporting surface thereof. The module includes a pad conditioning station disposed proximate to the rotatable vacuum table. The module includes a pad carrier positioning arm coupled to a pad carrier assembly. The module includes an actuator coupled to the pad carrier positioning arm and configured to position the pad carrier assembly between a first position over the rotatable vacuum table and a second position over the pad conditioning station.
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