METHOD AND APPARATUS FOR PROCESSING A SUBSTRATE IN CLEANING MODULES

    公开(公告)号:US20240100714A1

    公开(公告)日:2024-03-28

    申请号:US18514818

    申请日:2023-11-20

    CPC classification number: B25J11/0095 B25J9/042 B25J11/0085 B25J15/0206

    Abstract: Embodiments described herein generally relate to equipment used in the manufacturing of electronic devices, and more particularly, to a cleaning system, cleaning system hardware and related methods which may be used to transport and clean the surface of a substrate. According to one embodiment, a substrate cleaning unit may include a pre-clean chamber that performs a pre-clean process on a substrate with the substrate in a horizontal orientation. The unit may also include a first cleaning chamber that performs a first cleaning process on the substrate with the substrate in a vertical orientation. The unit may also include a second cleaning chamber. The unit may also include an integrated cleaning and drying chamber that performs a cleaning and drying process on the substrate in the horizontal orientation. A substrate handler may transfer the substrate between the chambers. The first and second cleaning chambers may be positioned below the pre-clean chamber.

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