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公开(公告)号:US20240412985A1
公开(公告)日:2024-12-12
申请号:US18731436
申请日:2024-06-03
Applicant: Applied Materials, Inc.
Inventor: Clinton SAKATA , Ricardo MARTINEZ , Robert DUES , Shih-Yu LIU , Tarun Kumar ABICHANDANI , Brian K. KIRKPATRICK , Jagan RANGARAJAN , Adrian S. BLANK , Edward GOLUBOVSKY , Justin H. WONG
IPC: H01L21/67 , B65G47/90 , H01L21/687
Abstract: A substrate cleaning system to remove particulates from multiple substrates includes a cleaning tank for applying a cleaning liquid to substrates, a rinse tank for applying a rinsing liquid to substrates, and a robot system. The cleaning tank includes a stationary lid, an input lid, and an output lid. The input and output lids allow a substrate carrier designed to carry an individual substrate to access an inner volume of the cleaning tank for processing. A transport system moves the substrate in the substrate carrier through the inner volume of the cleaning tank by creating a series of gaps between substrates to allow proper processing. The robot system transports substrates through the input and output lids of the cleaning tank, and transports substrates into the rinse tank.
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公开(公告)号:US20240100713A1
公开(公告)日:2024-03-28
申请号:US18244679
申请日:2023-09-11
Applicant: Applied Materials, Inc.
Inventor: Jagan RANGARAJAN , Edward GOLUBOVSKY , Edwin VELAZQUEZ , Adrian S. BLANK , Steven M. ZUNIGA , Balasubramaniam C. JAGANNATHAN
CPC classification number: B25J11/0095 , B25J9/042 , B25J11/0085 , B25J15/0206
Abstract: Embodiments described herein generally relate to equipment used in the manufacturing of electronic devices, and more particularly, to a cleaning system, cleaning system hardware and related methods which may be used to transport and clean the surface of a substrate. According to one embodiment, a blade handling assembly for handling a substrate in a cleaning system includes a gripping assembly including a pair of gripping blades, the blades operable with a gripping actuator to hold a substrate at its edges. The assembly includes a first blade actuator for moving the gripping assembly and substrate between a horizontal and a vertical orientation utilizing a first axis. The assembly includes a second blade actuator for moving the vertically oriented gripping assembly and substrate 180 degrees utilizing a second axis, thereby causing the substrate to face an opposite direction. Movement utilizing the first axis results in rotation of the first and second blade actuators and movement utilizing the second axis results in rotation of only the second blade actuator.
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公开(公告)号:US20240222152A1
公开(公告)日:2024-07-04
申请号:US18101555
申请日:2023-01-25
Applicant: Applied Materials, Inc.
Inventor: Jason A. RYE , Adrian S. BLANK , Ekaterina MIKHAYLICHENKO , Jagan RANGARAJAN , Jagadeeshkumar SUKUMARAN , Manikandan JAYARAMAN , Ricardo MARTINEZ , Retheesh MURALIDHARAN
CPC classification number: H01L21/67028 , B08B3/022 , B08B3/123 , B08B13/00 , B08B2203/0211 , B08B2203/0288
Abstract: In one embodiment, a cleaning and drying module includes a process rotor having grip pins for holding a substrate. The process rotor rotates and moves between lowered and raised positions. A plurality of sweep arms each have a nozzle mechanism to apply a cleaning and/or drying fluid to the substrate. A collection rotor rotates synchronously with the process rotor. The collection rotor includes a collection weir defined by a bottom portion of the collection rotor and the inner surface. The collection weir collects fluids and particles from the process rotor and the substrate. Drain holes are positioned in the collection weir to drain fluids and particles from the collection weir. A rotor cover surrounds and extends above the sidewall of the collection rotor defining an annular volume between the rotor cover and the collection rotor. An exhaust draws air through the drain holes and receives the collected fluids and particles.
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公开(公告)号:US20240100714A1
公开(公告)日:2024-03-28
申请号:US18514818
申请日:2023-11-20
Applicant: Applied Materials, Inc.
Inventor: Jagan RANGARAJAN , Edward GOLUBOVSKY , Edwin VALAZQUEZ , Adrian S. BLANK , Steven M. ZUNIGA , Balasubramaniam C. JAGANNATHAN
CPC classification number: B25J11/0095 , B25J9/042 , B25J11/0085 , B25J15/0206
Abstract: Embodiments described herein generally relate to equipment used in the manufacturing of electronic devices, and more particularly, to a cleaning system, cleaning system hardware and related methods which may be used to transport and clean the surface of a substrate. According to one embodiment, a substrate cleaning unit may include a pre-clean chamber that performs a pre-clean process on a substrate with the substrate in a horizontal orientation. The unit may also include a first cleaning chamber that performs a first cleaning process on the substrate with the substrate in a vertical orientation. The unit may also include a second cleaning chamber. The unit may also include an integrated cleaning and drying chamber that performs a cleaning and drying process on the substrate in the horizontal orientation. A substrate handler may transfer the substrate between the chambers. The first and second cleaning chambers may be positioned below the pre-clean chamber.
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