METHOD AND APPARATUS FOR PROCESSING A SUBSTRATE IN CLEANING MODULES

    公开(公告)号:US20240100713A1

    公开(公告)日:2024-03-28

    申请号:US18244679

    申请日:2023-09-11

    CPC classification number: B25J11/0095 B25J9/042 B25J11/0085 B25J15/0206

    Abstract: Embodiments described herein generally relate to equipment used in the manufacturing of electronic devices, and more particularly, to a cleaning system, cleaning system hardware and related methods which may be used to transport and clean the surface of a substrate. According to one embodiment, a blade handling assembly for handling a substrate in a cleaning system includes a gripping assembly including a pair of gripping blades, the blades operable with a gripping actuator to hold a substrate at its edges. The assembly includes a first blade actuator for moving the gripping assembly and substrate between a horizontal and a vertical orientation utilizing a first axis. The assembly includes a second blade actuator for moving the vertically oriented gripping assembly and substrate 180 degrees utilizing a second axis, thereby causing the substrate to face an opposite direction. Movement utilizing the first axis results in rotation of the first and second blade actuators and movement utilizing the second axis results in rotation of only the second blade actuator.

    METHOD AND APPARATUS FOR PROCESSING A SUBSTRATE IN CLEANING MODULES

    公开(公告)号:US20240100714A1

    公开(公告)日:2024-03-28

    申请号:US18514818

    申请日:2023-11-20

    CPC classification number: B25J11/0095 B25J9/042 B25J11/0085 B25J15/0206

    Abstract: Embodiments described herein generally relate to equipment used in the manufacturing of electronic devices, and more particularly, to a cleaning system, cleaning system hardware and related methods which may be used to transport and clean the surface of a substrate. According to one embodiment, a substrate cleaning unit may include a pre-clean chamber that performs a pre-clean process on a substrate with the substrate in a horizontal orientation. The unit may also include a first cleaning chamber that performs a first cleaning process on the substrate with the substrate in a vertical orientation. The unit may also include a second cleaning chamber. The unit may also include an integrated cleaning and drying chamber that performs a cleaning and drying process on the substrate in the horizontal orientation. A substrate handler may transfer the substrate between the chambers. The first and second cleaning chambers may be positioned below the pre-clean chamber.

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