SYSTEM AND PROCESS FOR POST-CHEMICAL MECHANICAL POLISHING CLEANING

    公开(公告)号:US20240226967A1

    公开(公告)日:2024-07-11

    申请号:US18400393

    申请日:2023-12-29

    CPC classification number: B08B3/041 B08B13/00 B65G54/02 B65G2201/0297

    Abstract: A substrate cleaning system to remove particulates from multiple substrates includes a cleaning tank for applying a cleaning liquid to substrates, a rinse tank for applying a rinsing liquid to substrates, and a robot system. The cleaning tank includes a stationary lid, an input lid, and an output lid. The input and output lids allow a substrate carrier designed to carry an individual substrate to access an inner volume of the cleaning tank for processing. A transport system moves the substrate in the substrate carrier through the inner volume of the cleaning tank by creating a series of gaps between substrates to allow proper processing. The robot system transports substrates through the input and output lids of the cleaning tank, and transports substrates into the rinse tank.

Patent Agency Ranking