HORIZONTAL BUFFING MODULE
    1.
    发明申请

    公开(公告)号:US20220134505A1

    公开(公告)日:2022-05-05

    申请号:US17510111

    申请日:2021-10-25

    Abstract: A horizontal pre-clean (HPC) module for a chemical mechanical polishing (CMP) processing system is disclosed. The HPC module includes a chamber having a basin and a lid which collectively define a processing area. The module includes a rotatable vacuum table disposed in the processing area, the rotatable vacuum table including an array of channels defined in a supporting surface thereof. The module includes a pad conditioning station disposed proximate to the rotatable vacuum table. The module includes a pad carrier positioning arm coupled to a pad carrier assembly. The module includes an actuator coupled to the pad carrier positioning arm and configured to position the pad carrier assembly between a first position over the rotatable vacuum table and a second position over the pad conditioning station.

    PAD CARRIER ASSEMBLY FOR HORIZONTAL PRE-CLEAN MODULE

    公开(公告)号:US20230264319A1

    公开(公告)日:2023-08-24

    申请号:US18094225

    申请日:2023-01-06

    CPC classification number: B24B41/061 B24B37/20

    Abstract: A pad carrier assembly that includes a coupling base and a pad carrier coupled to the coupling base, the coupling base and the pad carrier are configured to support a buffing pad by a mechanical clamping mechanism. Embodiments of the present disclosure will provide a method of supporting a buffing pad in a horizontal pre-clean module. The method includes mechanically clamping or retaining a buffing pad on a peripheral edge of the buffing pad, wherein the coupling base and the pad carrier are coupled and disposed in a horizontal pre-clean module, and supporting the buffing pad and preventing the buffing pad from sagging, by use of one or more pad retaining features.

    SYSTEM AND PROCESS FOR POST-CHEMICAL MECHANICAL POLISHING CLEANING

    公开(公告)号:US20240226967A1

    公开(公告)日:2024-07-11

    申请号:US18400393

    申请日:2023-12-29

    CPC classification number: B08B3/041 B08B13/00 B65G54/02 B65G2201/0297

    Abstract: A substrate cleaning system to remove particulates from multiple substrates includes a cleaning tank for applying a cleaning liquid to substrates, a rinse tank for applying a rinsing liquid to substrates, and a robot system. The cleaning tank includes a stationary lid, an input lid, and an output lid. The input and output lids allow a substrate carrier designed to carry an individual substrate to access an inner volume of the cleaning tank for processing. A transport system moves the substrate in the substrate carrier through the inner volume of the cleaning tank by creating a series of gaps between substrates to allow proper processing. The robot system transports substrates through the input and output lids of the cleaning tank, and transports substrates into the rinse tank.

    DOUBLE SIDED BUFF MODULE FOR POST CMP CLEANING
    5.
    发明申请
    DOUBLE SIDED BUFF MODULE FOR POST CMP CLEANING 审中-公开
    用于CMP CMP清洁的双面缓冲模块

    公开(公告)号:US20150027491A1

    公开(公告)日:2015-01-29

    申请号:US13951913

    申请日:2013-07-26

    CPC classification number: H01L21/67046

    Abstract: A buff module and method for using the same are provided. In one embodiment, a buff module includes housing having an interior volume, a plurality of drive rollers and a pair of buff heads. The drive rollers are arranged to rotate a substrate within the interior volume on a substantially horizontal axis. The buff heads are disposed in the housing, each buff head rotatable on an axis substantially aligned with the horizontal axis and movable to a position substantially parallel with the horizontal axis.

    Abstract translation: 提供了一种buff模块及其使用方法。 在一个实施例中,抛光模块包括具有内部容积的壳体,多个驱动辊和一对抛光头。 驱动辊被布置成在基本上水平的轴线上旋转内部容积内的基板。 抛光头设置在壳体中,每个抛光头可在与水平轴线基本上对准的轴上旋转并且可移动到基本上与水平轴线平行的位置。

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