公开(公告)号：US20240391056A1

公开(公告)日：2024-11-28

申请号：US18322928

申请日：2023-05-24

Applicant: Applied Materials, Inc.

Inventor： Nai-Chieh HUANG ,  Jianshe TANG ,  Shih-Haur SHEN ,  Akshay ARAVINDAN ,  Chih-Han YANG ,  Jay GURUSAMY ,  Jeonghoon OH ,  Steven M. ZUNIGA

IPC: B24B53/017

Abstract: Embodiments of the disclosure provided for a pad conditioner with multiple disks for chemical mechanical polishing. The pad conditioner includes a bearing ring connected to a lower portion of a shaft, an outer disk assembly connected to the lower portion of the shaft, the outer disk assembly, an outer disk flexure, a plurality of outer disks disposed on a bottom surface of the outer disk, and an inner disk assembly. Alternatively, the outer disk assembly includes a plurality of outer disk holders, an outer disk connector connecting the plurality of outer disk holders, and a plurality of outer disks disposed on a bottom surface of the outer disk holders. The inner disk assembly includes a flexure connected to the outer disk assembly, the inner disk assembly, and the shaft. The pad conditioner may include a spherical bearing assembly coupled to a lower portion of the shaft.

公开(公告)号：US20220143780A1

公开(公告)日：2022-05-12

申请号：US17202245

申请日：2021-03-15

Applicant: Applied Materials, Inc.

Inventor： Brian J. BROWN ,  Ekaterina MIKHAYLICHENKO ,  Jin JI ,  Jagan RANGARAJAN ,  Steven M. ZUNIGA

IPC: B24B41/06

Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems, and more particular, to modular polishing systems used in the manufacturing of semiconductor devices. In one embodiment, a polishing system includes a first portion having a plurality of polishing stations disposed therein, and a second portion coupled to the first portion, the second portion comprising a substrate cleaning system. The substrate cleaning system comprises a wet-in/dry-out substrate cleaning module comprising a chamber housing which defines a chamber volume. The polishing system further includes a substrate handler located in the second portion, where the substrate handler is positioned to transfer substrates to or from the wet-in/dry-out substrate cleaning module through one or more openings formed in one or more sidewalls of the chamber housing.

公开(公告)号：US20220143779A1

公开(公告)日：2022-05-12

申请号：US17512284

申请日：2021-10-27

Applicant: Applied Materials, Inc.

Inventor： Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Jay GURUSAMY ,  Charles C. GARRETSON ,  Vladmir GALBURT

IPC: B24B37/32 ,  B24B37/04 ,  B24B37/005

Abstract: A polishing system includes a carriage arm having an actuator disposed on a lower surface thereof. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a substrate carrier suspended from the carriage arm and configured to apply a pressure between a substrate and the polishing pad. The substrate carrier includes a housing, a retaining ring, and a membrane. The substrate carrier includes an upper load ring disposed in the housing. The roller of the actuator is configured to contact the upper load ring during relative rotation between the substrate carrier and the carriage arm. The actuator is configured to apply a load to a portion of the upper load ring thereby altering the pressure applied between the substrate and the polishing pad.

公开(公告)号：US20200376700A1

公开(公告)日：2020-12-03

申请号：US16884888

申请日：2020-05-27

Applicant: Applied Materials, Inc.

Inventor： Bum Jick KIM ,  Danielle LOI ,  Jay GURUSAMY ,  Steven M. ZUNIGA

IPC: B26D3/00 ,  B26D1/02 ,  B24B37/10 ,  B24B41/04

Abstract: Embodiments of the present disclosure generally relate to methods of manufacturing polishing platens for use on a chemical mechanical polishing (CMP) system and polishing platens formed therefrom. A method of manufacturing a polishing includes positioning a polishing platen on a support of a manufacturing system. The manufacturing system includes the support and a cutting tool facing there towards. Here, the polishing platen includes a cylindrical metal body having a polymer layer disposed on a surface thereof and the polymer layer has a thickness of about 100 μm or more. The method further includes removing at least a portion of the polymer layer using the cutting tool to form a polishing pad-mounting surface. Beneficially, the method may be used to form a pad-mounting surface having a desired flatness or shape, such as a concave or convex shape.

公开(公告)号：US20240100714A1

公开(公告)日：2024-03-28

申请号：US18514818

申请日：2023-11-20

Applicant: Applied Materials, Inc.

Inventor： Jagan RANGARAJAN ,  Edward GOLUBOVSKY ,  Edwin VALAZQUEZ ,  Adrian S. BLANK ,  Steven M. ZUNIGA ,  Balasubramaniam C. JAGANNATHAN

IPC: B25J11/00 ,  B25J9/04 ,  B25J15/02

CPC classification number: B25J11/0095 ,  B25J9/042 ,  B25J11/0085 ,  B25J15/0206

Abstract: Embodiments described herein generally relate to equipment used in the manufacturing of electronic devices, and more particularly, to a cleaning system, cleaning system hardware and related methods which may be used to transport and clean the surface of a substrate. According to one embodiment, a substrate cleaning unit may include a pre-clean chamber that performs a pre-clean process on a substrate with the substrate in a horizontal orientation. The unit may also include a first cleaning chamber that performs a first cleaning process on the substrate with the substrate in a vertical orientation. The unit may also include a second cleaning chamber. The unit may also include an integrated cleaning and drying chamber that performs a cleaning and drying process on the substrate in the horizontal orientation. A substrate handler may transfer the substrate between the chambers. The first and second cleaning chambers may be positioned below the pre-clean chamber.

公开(公告)号：US20220297258A1

公开(公告)日：2022-09-22

申请号：US17204832

申请日：2021-03-17

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Steven M. ZUNIGA

IPC: B24B37/30 ,  B24B37/04 ,  B24B37/10 ,  H01L21/321 ,  H01L21/768

Abstract: A substrate polishing apparatus includes a processing station including a plurality of polishing platens having a polishing pad thereon, and a substrate support configured to hold a substrate therein, wherein the substrate support is positionable to simultaneously position a substrate supported therein against polishing pads on at least two of the plurality of polishing platens. The processing station can form a standalone polishing system, or be one of at least two processing statins in a polishing tool, where at least one other polishing station includes a polishing platen to support a polishing pad thereon.

公开(公告)号：US20220111484A1

公开(公告)日：2022-04-14

申请号：US17501687

申请日：2021-10-14

Applicant: Applied Materials, Inc.

Inventor： Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Jay GURUSAMY

IPC: B24B37/32 ,  B24B37/005 ,  H01L21/306

Abstract: Embodiments herein generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of electronic devices. In one embodiment, a substrate carrier for polishing a surface of a substrate includes a retaining ring configured to surround a substrate during a polishing process. The retaining ring includes a first surface that is configured to contact a surface of a polishing pad during the polishing process, a second surface that is on a side of the retaining ring that is opposite to the first surface, and an array of recesses formed in the second surface. The substrate carrier for polishing a surface of a substrate also includes a plurality of load bearing pins where each load bearing pin of the plurality of load bearing pins includes a contact surface and a body that has a length, and at least a portion of the length of each load bearing pin of the plurality of load bearing pins is disposed within each recess of the array of recesses and the contact surface of each load bearing pin of the plurality of load bearing pins is positionable relative to a surface of the recess in which it is disposed during the polishing process.

公开(公告)号：US20210323117A1

公开(公告)日：2021-10-21

申请号：US16851012

申请日：2020-04-16

Applicant: Applied Materials, Inc.

Inventor： Jagan RANGARAJAN ,  Edward GOLUBOVSKY ,  Jay GURUSAMY ,  Steven M. ZUNIGA

IPC: B24B37/34 ,  B24B37/30 ,  B24B37/04 ,  H01L21/306 ,  H01L21/67 ,  H01L21/677

Abstract: Embodiments herein include high throughput density chemical mechanical polishing (CMP) modules and customizable modular CMP systems formed thereof. In one embodiment, a polishing module features a carrier support module, a carrier loading station, and a polishing station. The carrier support module features a carrier platform and one or more carrier assemblies. The one or more carrier assemblies each comprise a corresponding carrier head suspended from the carrier platform. The carrier loading station is used to transfer substrates to and from the carrier heads. The polishing station comprises a polishing platen. The carrier support module, the substrate loading station, and the polishing station comprise a one-to-one-to-one relationship within each of the polishing modules. The carrier support module is positioned to move the one or more carrier assemblies between a substrate polishing position disposed above the polishing platen and a substrate transfer position disposed above the substrate loading station.

公开(公告)号：US20190099857A1

公开(公告)日：2019-04-04

申请号：US16149939

申请日：2018-10-02

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Charles C. GARRETSON ,  Eric LAU ,  Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Edwin C. SUAREZ ,  Huanbo ZHANG ,  Brian J. BROWN

IPC: B24B37/32 ,  H01L21/687

Abstract: Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

公开(公告)号：US20240307963A1

公开(公告)日：2024-09-19

申请号：US18183000

申请日：2023-03-13

Applicant: Applied Materials, Inc.

Inventor： Ximeng XUE ,  David J. LISCHKA ,  Jay GURUSAMY ,  Steven M. ZUNIGA ,  Jeonghoon OH ,  Jagan RANGARAJAN

IPC: B22F10/28 ,  B22F10/66 ,  B29C64/153 ,  B29C64/30 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y70/10 ,  B33Y80/00

CPC classification number: B22F10/28 ,  B22F10/66 ,  B29C64/153 ,  B29C64/30 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y70/10 ,  B33Y80/00

Abstract: Embodiments of the disclosure provided herein include an apparatus and method for additive manufacturing a component for a semiconductor processing apparatus. The apparatus for additive manufacturing includes a printhead configured to selectively deposit layers on build the component, wherein the printhead may selectively deposit a first set of layers onto the build platform, and selectively deposit a second set of layers on the first set of layers, each of the second set of layers comprising a gap that forms a cooling channel through the component. The cooling channel is filled a filler material. A third set of layers covers the cooling channel before the channel is exposed to a liquidizing agent, wherein the liquidizing agent reacts with the filler material to produce an effluent fluid which is then drained. In other embodiments, the cooling channel may be machined into the component before being filled with the filler material.