公开(公告)号：US20220143779A1

公开(公告)日：2022-05-12

申请号：US17512284

申请日：2021-10-27

Applicant: Applied Materials, Inc.

Inventor： Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Jay GURUSAMY ,  Charles C. GARRETSON ,  Vladmir GALBURT

IPC: B24B37/32 ,  B24B37/04 ,  B24B37/005

Abstract: A polishing system includes a carriage arm having an actuator disposed on a lower surface thereof. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a substrate carrier suspended from the carriage arm and configured to apply a pressure between a substrate and the polishing pad. The substrate carrier includes a housing, a retaining ring, and a membrane. The substrate carrier includes an upper load ring disposed in the housing. The roller of the actuator is configured to contact the upper load ring during relative rotation between the substrate carrier and the carriage arm. The actuator is configured to apply a load to a portion of the upper load ring thereby altering the pressure applied between the substrate and the polishing pad.

公开(公告)号：US20220339755A1

公开(公告)日：2022-10-27

申请号：US17851497

申请日：2022-06-28

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Charles C. GARRETSON ,  Eric LAU ,  Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Edwin C. SUAREZ ,  Huanbo ZHANG ,  Brian J. BROWN

IPC: B24B37/32 ,  H01L21/687

Abstract: Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

公开(公告)号：US20160059377A1

公开(公告)日：2016-03-03

申请号：US14470852

申请日：2014-08-27

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Steven M. ZUNIGA ,  Andrew NAGENGAST ,  Samuel Chu-Chiang HSU ,  Gautam Shashank DANDAVATE

IPC: B24B37/10 ,  B24B37/30

CPC classification number: B24B37/107 ,  B24B37/11 ,  B24B37/30

Abstract: A polishing head for chemical mechanical planarization is provided. The polishing head includes a housing and a flexible membrane secured to the housing. At least a first, second, and third pressurizable chamber are disposed in the housing and each chamber contacts the flexible membrane. A first pressure delivery channel couples to the first chamber. A second pressure delivery channel couples to the third chamber. A first pressure feed line couples the first pressure delivery channel to the second chamber. A second pressure feed line couples the second pressure delivery channel to the second chamber. A first manually movable plug interfaces with the first pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber. A second manually movable plug interfaces with the second pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber.

Abstract translation: 提供了用于化学机械平面化的抛光头。 抛光头包括壳体和固定到壳体的柔性膜。 至少第一，第二和第三可加压室设置在壳体中，并且每个室接触柔性膜。 第一压力输送通道耦合到第一室。 第二压力输送通道联接到第三室。 第一压力供给管线将第一压力输送通道连接到第二室。 第二压力供给管线将第二压力输送通道连接到第二室。 第一可手动插头与第一压力进料管线接合以允许或阻止来自第一压力输送通道到第二室的压力。 第二可手动插头与第二压力进料管线接口，以允许或阻止来自第一压力输送通道到第二室的压力。

公开(公告)号：US20220111484A1

公开(公告)日：2022-04-14

申请号：US17501687

申请日：2021-10-14

Applicant: Applied Materials, Inc.

Inventor： Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Jay GURUSAMY

IPC: B24B37/32 ,  B24B37/005 ,  H01L21/306

Abstract: Embodiments herein generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of electronic devices. In one embodiment, a substrate carrier for polishing a surface of a substrate includes a retaining ring configured to surround a substrate during a polishing process. The retaining ring includes a first surface that is configured to contact a surface of a polishing pad during the polishing process, a second surface that is on a side of the retaining ring that is opposite to the first surface, and an array of recesses formed in the second surface. The substrate carrier for polishing a surface of a substrate also includes a plurality of load bearing pins where each load bearing pin of the plurality of load bearing pins includes a contact surface and a body that has a length, and at least a portion of the length of each load bearing pin of the plurality of load bearing pins is disposed within each recess of the array of recesses and the contact surface of each load bearing pin of the plurality of load bearing pins is positionable relative to a surface of the recess in which it is disposed during the polishing process.

公开(公告)号：US20190099857A1

公开(公告)日：2019-04-04

申请号：US16149939

申请日：2018-10-02

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Charles C. GARRETSON ,  Eric LAU ,  Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Edwin C. SUAREZ ,  Huanbo ZHANG ,  Brian J. BROWN

IPC: B24B37/32 ,  H01L21/687

Abstract: Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

公开(公告)号：US20240253183A1

公开(公告)日：2024-08-01

申请号：US18401306

申请日：2023-12-29

Applicant: Applied Materials, Inc.

Inventor： Priscilla Michelle Diep LAROSA ,  Haosheng WU ,  Jimin ZHANG ,  Taketo SEKINE ,  Chen-Wei CHANG ,  Jianshe TANG ,  Brian J. BROWN ,  Wei LU ,  Ekaterina A. MIKHAYLICHENKO ,  Huanbo ZHANG ,  Jeonghoon OH ,  Eric LAU ,  Andrew NAGENGAST ,  Takashi FUJIKAWA ,  Thomas H. OSTERHELD ,  Steven M. ZUNIGA

IPC: B24B57/02 ,  B24B37/015 ,  B24B53/017

CPC classification number: B24B57/02 ,  B24B37/015 ,  B24B53/017

Abstract: A method and apparatus for dispensing polishing fluids and onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP system with a first fluid delivery arm and a second fluid delivery arm disposed over the polishing pad to dispense fluid, such as a polishing fluid or water, and/or provide a vacuum pressure. The second fluid delivery arm is configured to dispense a fluid or vacuum pressure onto the polishing pad to effect the polishing rate at the edge of the substrate.

公开(公告)号：US20220111483A1

公开(公告)日：2022-04-14

申请号：US17087941

申请日：2020-11-03

Applicant: Applied Materials, Inc.

Inventor： Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Jay GURUSAMY

IPC: B24B37/32 ,  B24B49/16

Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of semiconductor devices. In one embodiment, the apparatus includes a polishing module, a retaining ring, wherein the retaining ring includes a protrusion on a radially outward edge, and a plurality of load pins disposed through the retaining ring.

公开(公告)号：US20240253179A1

公开(公告)日：2024-08-01

申请号：US18630886

申请日：2024-04-09

Applicant: Applied Materials, Inc.

Inventor： Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Jay GURUSAMY ,  Charles C. GARRETSON ,  Vladimir GALBURT

IPC: B24B37/32 ,  B24B37/005 ,  B24B37/04

CPC classification number: B24B37/32 ,  B24B37/005 ,  B24B37/04

Abstract: A polishing system includes a carriage arm having an actuator disposed on a lower surface thereof. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a substrate carrier suspended from the carriage arm and configured to apply a pressure between a substrate and the polishing pad. The substrate carrier includes a housing, a retaining ring, and a membrane. The substrate carrier includes an upper load ring disposed in the housing. The roller of the actuator is configured to contact the upper load ring during relative rotation between the substrate carrier and the carriage arm. The actuator is configured to apply a load to a portion of the upper load ring thereby altering the pressure applied between the substrate and the polishing pad.

公开(公告)号：US20220111482A1

公开(公告)日：2022-04-14

申请号：US17495679

申请日：2021-10-06

Applicant: Applied Materials, Inc.

Inventor： Steven M. ZUNIGA ,  Andrew NAGENGAST ,  Jay GURUSAMY

IPC: B24B37/005 ,  B24B37/02 ,  B24B37/20 ,  B24B37/12

Abstract: An apparatus for chemical mechanical polishing (CMP) of a substrate is described herein. The apparatus includes an extension disposed between a retaining ring and a chucking membrane. The extension is disposed radially outward from the edge of the substrate and is configured to contact the retaining ring during substrate processing. The extension provides a repeatable and controlled point of contact between the retaining ring and the chucking membrane. The extension may have multiple configurations, such that the contact point between the retaining ring and the chucking membrane is set at a pre-determined location or such that the contact point is moveable by an adjustable stop.