公开(公告)号：US20170274495A1

公开(公告)日：2017-09-28

申请号：US15456413

申请日：2017-03-10

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Hui CHEN ,  King Yi HEUNG ,  Chih Chung CHOU ,  Edwin C. SUAREZ ,  Garrett Ho Yee SIN ,  Charles C. GARRETSON ,  Jeonghoon OH

IPC: B24B37/10 ,  H01L21/687 ,  H01L21/67 ,  B24B37/20 ,  B24B57/02

CPC classification number: B24B37/10 ,  B24B37/20 ,  B24B57/02 ,  H01L21/67092 ,  H01L21/68785

Abstract: A polishing module includes a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.

公开(公告)号：US20220339755A1

公开(公告)日：2022-10-27

申请号：US17851497

申请日：2022-06-28

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Charles C. GARRETSON ,  Eric LAU ,  Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Edwin C. SUAREZ ,  Huanbo ZHANG ,  Brian J. BROWN

IPC: B24B37/32 ,  H01L21/687

Abstract: Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

公开(公告)号：US20170274497A1

公开(公告)日：2017-09-28

申请号：US15456320

申请日：2017-03-10

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Hui CHEN ,  King Yi HEUNG ,  Wei-Cheng LEE ,  Chih Chung CHOU ,  Edwin C. SUAREZ ,  Garrett Ho Yee SIN ,  Charles C. GARRETSON ,  Jeonghoon OH

IPC: B24B37/26 ,  B24B37/30

CPC classification number: B24B37/26 ,  B24B37/30

Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.

公开(公告)号：US20240240322A1

公开(公告)日：2024-07-18

申请号：US18096533

申请日：2023-01-12

Applicant: Applied Materials, Inc.

Inventor： Abhishek CHOWDHURY ,  Edwin C. SUAREZ ,  Xiaozhou CHE ,  Arun Chakravarthy CHAKRAVARTHY ,  Harisha SATHYANARAYANA ,  Nataraj BHASKAR RAO

IPC: C23C16/52 ,  C23C16/455 ,  C23C16/458

CPC classification number: C23C16/52 ,  C23C16/45565 ,  C23C16/4585

Abstract: Embodiments of process chambers are provided herein. In some embodiments, a process chamber includes: a chamber body having a bottom plate, a lid, and sidewalls extending from the bottom plate to the lid, wherein one of the sidewalls includes a shutter recess, wherein the chamber body and the shutter recess define an interior volume of the process chamber; a substrate support for supporting a substrate disposed in the interior volume; a showerhead disposed in the interior volume opposite the substrate support; and a shutter cover having a shutter disk coupled to a shutter arm, wherein the shutter cover is disposed in the interior volume and rotatably coupled to the chamber body between a home position and a cover position, wherein in the home position, the shutter cover is at least partially disposed in the shutter recess, and wherein in the cover position, the shutter cover extends over the substrate support.

公开(公告)号：US20240044002A1

公开(公告)日：2024-02-08

申请号：US17881428

申请日：2022-08-04

Applicant: Applied Materials, Inc.

Inventor： Abhishek CHOWDHURY ,  Nataraj BHASKAR RAO ,  Edwin C. SUAREZ ,  Harisha SATHYANARAYANA ,  Diego Ramiro PUENTE SOTOMAYOR ,  Qanit TAKMEEL ,  Mohammad Kamruzzaman CHOWDHURY ,  Arun Chakravarthy CHAKRAVARTHY

IPC: C23C16/458

CPC classification number: C23C16/4581 ,  C23C16/4585

Abstract: A substrate handling system includes a fixed deposition ring having a plurality of circumferentially spaced notches along an outer edge of the fixed deposition ring, the fixed deposition ring being electrically non-conductive; a moving deposition ring having a plurality of circumferentially spaced recesses formed on a lower surface of the moving deposition ring, the recesses configured to radially align with the notches of the fixed deposition ring, the moving deposition ring having an inner edge and an outer edge, the moving deposition ring being electrically non-conductive; and a plurality of electrically conductive grounding plates each having a base, an intermediate member, and a contact extending from the intermediate member and being spaced from the base, the intermediate members configured to be received in the recesses and extend between the inner edge and the outer edge of the moving deposition ring.

公开(公告)号：US20190099857A1

公开(公告)日：2019-04-04

申请号：US16149939

申请日：2018-10-02

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Charles C. GARRETSON ,  Eric LAU ,  Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Edwin C. SUAREZ ,  Huanbo ZHANG ,  Brian J. BROWN

IPC: B24B37/32 ,  H01L21/687

Abstract: Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

公开(公告)号：US20220157635A1

公开(公告)日：2022-05-19

申请号：US16951823

申请日：2020-11-18

Applicant: APPLIED MATERIALS, INC.

Inventor： Abhishek CHOWDHURY ,  Harisha SATHYANARAYANA ,  Edwin C. SUAREZ ,  Siqing LU ,  Nataraj BHASKAR RAO

IPC: H01L21/683 ,  H01L21/67 ,  C23C16/455 ,  C23C16/458 ,  H01L21/02

Abstract: Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a cover ring for use in a process chamber includes: an annular body that includes an upper surface and a lower surface, an inner lip extending radially inward and downward from the annular body, and a plurality of protrusions extending downward from the inner lip and disposed at regular intervals along the inner lip, wherein lowermost surfaces of the plurality of protrusions together define a planar substrate contact surface.

公开(公告)号：US20220157572A1

公开(公告)日：2022-05-19

申请号：US16951805

申请日：2020-11-18

Applicant: Applied Materials, Inc.

Inventor： Abhishek CHOWDHURY ,  Edwin C. SUAREZ ,  Harisha SATHYANARAYANA ,  Nataraj BHASKAR RAO ,  Siqing LU

IPC: H01J37/32 ,  C23C14/34 ,  C23C14/35 ,  C23C14/50 ,  C23C16/458

Abstract: Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a deposition ring including a first portion having an first inner ledge and a second portion having a second inner ledge, wherein in a first position, the first portion is spaced from the second portion, and wherein in a second position, the second portion is configured to engage the first portion so that the first inner ledge is aligned with the second inner ledge along a common plane to form a clamping surface.

公开(公告)号：US20180119281A1

公开(公告)日：2018-05-03

申请号：US15851695

申请日：2017-12-21

Applicant: Applied Materials, Inc.

Inventor： Jonghoon BAEK ,  Edwin C. SUAREZ ,  Tsutomu TANAKA ,  Edward P. HAMMOND, IV ,  Jeonghoon OH

IPC: C23C16/455 ,  H01J37/32 ,  C23C16/509

CPC classification number: C23C16/45565 ,  C23C16/509 ,  H01J37/32082 ,  H01J37/32431 ,  H01J37/3244

Abstract: Embodiments of the present invention generally relate to apparatus for reducing arcing and parasitic plasma in substrate processing chambers. The apparatus generally include a processing chamber having a substrate support, a backing plate, and a showerhead disposed therein. A showerhead suspension electrically couples the backing plate to the showerhead. An electrically conductive bracket is coupled to the backing plate and spaced apart from the showerhead. The electrically conductive bracket may include a plate, a lower portion, an upper portion, and a vertical extension. The electrically conductive bracket contacts an electrical isolator.