公开(公告)号：US20170274497A1

公开(公告)日：2017-09-28

申请号：US15456320

申请日：2017-03-10

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Hui CHEN ,  King Yi HEUNG ,  Wei-Cheng LEE ,  Chih Chung CHOU ,  Edwin C. SUAREZ ,  Garrett Ho Yee SIN ,  Charles C. GARRETSON ,  Jeonghoon OH

IPC: B24B37/26 ,  B24B37/30

CPC classification number: B24B37/26 ,  B24B37/30

Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.