公开(公告)号：US20240044002A1

公开(公告)日：2024-02-08

申请号：US17881428

申请日：2022-08-04

Applicant: Applied Materials, Inc.

Inventor： Abhishek CHOWDHURY ,  Nataraj BHASKAR RAO ,  Edwin C. SUAREZ ,  Harisha SATHYANARAYANA ,  Diego Ramiro PUENTE SOTOMAYOR ,  Qanit TAKMEEL ,  Mohammad Kamruzzaman CHOWDHURY ,  Arun Chakravarthy CHAKRAVARTHY

IPC: C23C16/458

CPC classification number: C23C16/4581 ,  C23C16/4585

Abstract: A substrate handling system includes a fixed deposition ring having a plurality of circumferentially spaced notches along an outer edge of the fixed deposition ring, the fixed deposition ring being electrically non-conductive; a moving deposition ring having a plurality of circumferentially spaced recesses formed on a lower surface of the moving deposition ring, the recesses configured to radially align with the notches of the fixed deposition ring, the moving deposition ring having an inner edge and an outer edge, the moving deposition ring being electrically non-conductive; and a plurality of electrically conductive grounding plates each having a base, an intermediate member, and a contact extending from the intermediate member and being spaced from the base, the intermediate members configured to be received in the recesses and extend between the inner edge and the outer edge of the moving deposition ring.