POLISHING HEAD WITH LOCAL WAFER PRESSURE
    1.
    发明公开

    公开(公告)号:US20240253179A1

    公开(公告)日:2024-08-01

    申请号:US18630886

    申请日:2024-04-09

    CPC classification number: B24B37/32 B24B37/005 B24B37/04

    Abstract: A polishing system includes a carriage arm having an actuator disposed on a lower surface thereof. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a substrate carrier suspended from the carriage arm and configured to apply a pressure between a substrate and the polishing pad. The substrate carrier includes a housing, a retaining ring, and a membrane. The substrate carrier includes an upper load ring disposed in the housing. The roller of the actuator is configured to contact the upper load ring during relative rotation between the substrate carrier and the carriage arm. The actuator is configured to apply a load to a portion of the upper load ring thereby altering the pressure applied between the substrate and the polishing pad.

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