公开(公告)号：US20190030677A1

公开(公告)日：2019-01-31

申请号：US16037783

申请日：2018-07-17

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  David J. LISCHKA ,  Erik RONDUM ,  Jay GURUSAMY ,  Robert D. TOLLES ,  Steven M. ZUNIGA ,  Steven M. REEDY ,  Wai- Ming KAN

IPC: B24B37/24 ,  B24B37/005

Abstract: Implementations described herein generally relate to methods and apparatus for polishing substrates, more particularly, to methods and apparatus for identifying and/or tracking polishing material in a roll-to-roll polishing system. In one implementation, a method of polishing a substrate is provided. The method comprises advancing a polishing material across a surface of a platen. The polishing material has a polishing surface and an opposing backside surface and the backside surface has a pattern of identifying features formed thereon. The method further comprises sensing the movement of the pattern of identifying features past a detector assembly. The method further comprises controlling a position of the polishing material relative to the platen based on data received from the sensed movement of the pattern of identifying features.

公开(公告)号：US20240307963A1

公开(公告)日：2024-09-19

申请号：US18183000

申请日：2023-03-13

Applicant: Applied Materials, Inc.

Inventor： Ximeng XUE ,  David J. LISCHKA ,  Jay GURUSAMY ,  Steven M. ZUNIGA ,  Jeonghoon OH ,  Jagan RANGARAJAN

IPC: B22F10/28 ,  B22F10/66 ,  B29C64/153 ,  B29C64/30 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y70/10 ,  B33Y80/00

CPC classification number: B22F10/28 ,  B22F10/66 ,  B29C64/153 ,  B29C64/30 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y70/10 ,  B33Y80/00

Abstract: Embodiments of the disclosure provided herein include an apparatus and method for additive manufacturing a component for a semiconductor processing apparatus. The apparatus for additive manufacturing includes a printhead configured to selectively deposit layers on build the component, wherein the printhead may selectively deposit a first set of layers onto the build platform, and selectively deposit a second set of layers on the first set of layers, each of the second set of layers comprising a gap that forms a cooling channel through the component. The cooling channel is filled a filler material. A third set of layers covers the cooling channel before the channel is exposed to a liquidizing agent, wherein the liquidizing agent reacts with the filler material to produce an effluent fluid which is then drained. In other embodiments, the cooling channel may be machined into the component before being filled with the filler material.