公开(公告)号：US20240391056A1

公开(公告)日：2024-11-28

申请号：US18322928

申请日：2023-05-24

Applicant: Applied Materials, Inc.

Inventor： Nai-Chieh HUANG ,  Jianshe TANG ,  Shih-Haur SHEN ,  Akshay ARAVINDAN ,  Chih-Han YANG ,  Jay GURUSAMY ,  Jeonghoon OH ,  Steven M. ZUNIGA

IPC: B24B53/017

Abstract: Embodiments of the disclosure provided for a pad conditioner with multiple disks for chemical mechanical polishing. The pad conditioner includes a bearing ring connected to a lower portion of a shaft, an outer disk assembly connected to the lower portion of the shaft, the outer disk assembly, an outer disk flexure, a plurality of outer disks disposed on a bottom surface of the outer disk, and an inner disk assembly. Alternatively, the outer disk assembly includes a plurality of outer disk holders, an outer disk connector connecting the plurality of outer disk holders, and a plurality of outer disks disposed on a bottom surface of the outer disk holders. The inner disk assembly includes a flexure connected to the outer disk assembly, the inner disk assembly, and the shaft. The pad conditioner may include a spherical bearing assembly coupled to a lower portion of the shaft.

公开(公告)号：US20240383099A1

公开(公告)日：2024-11-21

申请号：US18318880

申请日：2023-05-17

Applicant: Applied Materials, Inc.

Inventor： Christopher Heung-Gyun LEE ,  Ghunbong CHEUNG ,  Jay GURUSAMY ,  Ekaterina MIKHAYLICHENKO ,  Chih-Han YANG

IPC: B24B53/00 ,  B24B49/10 ,  B24B49/18

Abstract: Embodiments of the present disclosure provided herein include an apparatus and method for pad conditioning in a chemical mechanical polishing system. The apparatus includes a first conditioning head coupleable to a first pad conditioning disk disposed at a first head distance from the first conditioning head. The apparatus further includes a second a third conditioning head configured similarly to the first conditioning head. The apparatus includes a controller configured to receive sensor readings, determine whether the sensor readings are outside of a predetermined range, and adjust the first, second, and third head distances. A method of conditioning a polishing pad includes receiving sensor readings from at least one pad thickness sensor, determining if the sensor readings are outside of a predetermined range, and, upon determining that the sensor readings are outside of the predetermined range, adjusting a head distance of a conditioning head based on the sensor readings.