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    Multi-layer transparent structures for electronic device housings
    2.
    发明授权
    Multi-layer transparent structures for electronic device housings 有权

    公开(公告)号：US10574800B2

    公开(公告)日：2020-02-25

    申请号：US16429583

    申请日：2019-06-03

    申请人： Apple Inc.

    发明人： Derek W. Wright ,  Justin R. Wodrich ,  Benjamin M. Rappoport

    IPC分类号： H04M1/02 ,  B32B17/10 ,  G06F1/16 ,  H04M1/18

    摘要： Transparent structures for portions of electronic device housings are disclosed. The transparent structures are formed from multiple layers of transparent (optically clear) materials. The multiple layers can include at least an outer glass layer and one or more other transparent layers that can be either glass or polymer layers. The multiple layers can be bonded together with one or more lamination layers. Accordingly, multi-layer transparent structures that are formed from multiple layers bonded together are able to be not only thin but also sufficiently strong and resistant to damage. The multi-layer transparent structures are well suited for use in consumer products, such as consumer electronic devices (e.g., portable electronic devices).

    DROP COUNTERMEASURES FOR ELECTRONIC DEVICE
    3.
    发明申请
    DROP COUNTERMEASURES FOR ELECTRONIC DEVICE 有权
    电子设备的倒计时措施

    公开(公告)号：US20140253284A1

    公开(公告)日：2014-09-11

    申请号：US13794393

    申请日：2013-03-11

    申请人： APPLE INC.

    发明人： Carl R. Peterson ,  Justin R. Wodrich ,  Kevin D. Gibbs ,  Samuel G. Smith

    IPC分类号： G05B13/00

    CPC分类号： H04B1/3888 ,  F16F15/067 ,  F16F2230/0023 ,  G01L5/0066 ,  G01P3/486 ,  G01P3/488 ,  H04M1/185 ,  H04M2250/12

    摘要： An electronic device comprises a housing, a motion sensor configured to sense motion of the housing, and a processor configured to determine an impact geometry based on the motion. A countermeasure system comprises an actuator coupled to an actuated member. The actuated member is operable by the actuator to modify the impact geometry, so that impact energy is redirected away from an impact sensitive component of the electronic device to an energy absorbing component of the electronic device.

    摘要翻译： 电子设备包括壳体，被配置为感测壳体的运动的运动传感器，以及配置成基于运动来确定冲击几何形状的处理器。 对策系统包括联接到致动构件的致动器。 致动构件可由致动器操作以改变冲击几何形状，使得冲击能量被重定向远离电子装置的冲击敏感部件到电子装置的能量吸收部件。

    Multi-layer transparent structures for electronic device housings
    5.
    发明授权
    Multi-layer transparent structures for electronic device housings 有权

    公开(公告)号：US10320959B2

    公开(公告)日：2019-06-11

    申请号：US15338157

    申请日：2016-10-28

    申请人： Apple Inc.

    发明人： Derek W. Wright ,  Justin R. Wodrich ,  Benjamin M. Rappoport

    IPC分类号： H04M1/02 ,  B32B17/10 ,  G06F1/16 ,  H04M1/18

    摘要： Transparent structures for portions of electronic device housings are disclosed. The transparent structures are formed from multiple layers of transparent (optically clear) materials. The multiple layers can include at least an outer glass layer and one or more other transparent layers that can be either glass or polymer layers. The multiple layers can be bonded together with one or more lamination layers. Accordingly, multi-layer transparent structures that are formed from multiple layers bonded together are able to be not only thin but also sufficiently strong and resistant to damage. The multi-layer transparent structures are well suited for use in consumer products, such as consumer electronic devices (e.g., portable electronic devices).

    Flexible electronic devices
    6.
    发明授权
    Flexible electronic devices 有权

    公开(公告)号：US10318061B2

    公开(公告)日：2019-06-11

    申请号：US15974545

    申请日：2018-05-08

    申请人： Apple Inc.

    发明人： Jeremy C. Franklin ,  Scott A. Myers ,  Benjamin M. Rappoport ,  Stephen Brian Lynch ,  John P. Ternus ,  Justin R. Wodrich

    IPC分类号： G06F1/16 ,  G09G3/20 ,  H01M2/02 ,  H01M2/10 ,  H01M2/16 ,  H01M2/18 ,  H04M1/02 ,  G06F3/041 ,  G06F3/044 ,  H01L27/32 ,  H01L51/00 ,  H01M10/04 ,  G06F1/3234 ,  G09G3/3208

    摘要： Flexible electronic devices may be provided. A flexible electronic device may include a flexible display, a flexible housing and one or more flexible internal components configured to allow the flexible electronic device to be deformed. Flexible displays may include flexible display layers, flexible touch-sensitive layers, and flexible display cover layers. The flexible housing may be a multi-stable flexible housing having one or more stable positions. The flexible housing may include a configurable support structure that, when engaged, provides a rigid support structure for the flexible housing. The flexible internal components may include flexible batteries, flexible printed circuits or other flexible components. A flexible battery may include flexible and rigid portions or may include a lubricious separator layer that provides flexibility for the flexible battery. A flexible printed circuit may include flexible and rigid portions or openings that allow some rigid portions to flex with respect to other rigid portions.

    Flexible printed circuit cables with service loops and overbending prevention
    8.
    发明授权
    Flexible printed circuit cables with service loops and overbending prevention 有权

    公开(公告)号：US09658648B2

    公开(公告)日：2017-05-23

    申请号：US14224892

    申请日：2014-03-25

    申请人： Apple Inc.

    发明人： Benjamin M. Rappoport ,  Justin R. Wodrich ,  Santhana Balaji ,  Shayan Malek

    IPC分类号： G06F1/16 ,  H05K1/02 ,  H05K3/00

    CPC分类号： G06F1/1633 ,  G06F1/1656 ,  H05K1/0281 ,  H05K3/0064 ,  H05K2201/09109 ,  H05K2201/2009

    摘要： An electronic device may have a signal cable formed from a flexible printed circuit. A service loop may be formed in the signal cable. The bend may be formed in a desired location on the flexible printed circuit by contraction of an elastic member having ends attached to the flexible printed circuit. The elastic member may be conductive to carry signals and provide shielding. Structures may be attached to the flexible printed circuit to promote bending in a desired location and direction. A crease or other bending promotion feature may be applied to the flexible printed circuit at a desired bend location. Overbending prevention structures such as overmolded elastomeric structures may be applied to the flexible printed circuit at the bend. Integral strain relief features may prevent overbending of the flexible printed circuit upon exiting the elastomeric structures. Overmolded structures may serve as protective bumpers.

    Electronic Devices With Moisture And Light Curable Adhesive
    9.
    发明申请
    Electronic Devices With Moisture And Light Curable Adhesive 审中-公开
    具有水分和光可固化粘合剂的电子设备

    公开(公告)号：US20170001427A1

    公开(公告)日：2017-01-05

    申请号：US14790932

    申请日：2015-07-02

    申请人： Apple Inc.

    发明人： James R. Krogdahl ,  George Kyle Lobisser ,  Justin R. Wodrich

    IPC分类号： B32B38/10 ,  B32B37/12 ,  B32B37/06

    CPC分类号： F16B11/006 ,  G06F1/1613 ,  H04M1/0202 ,  H04M1/0249

    摘要： An electronic device may include electronic device structures that are attached with a moisture and light curable adhesive. To assemble the electronic device, adhesive may be dispensed onto a first electronic device structure. An attachment structure may then be used to attach a second electronic device structure to the first electronic device structure. The electronic device may be tested with testing equipment. If the electronic device needs to be reworked, a separation tool may be used to separate the first and second electronic device structures. After separating the structures, residual moisture and light curable adhesive on the structures may be exposed to light to ensure that the moisture and light curable adhesive is fully cured. The moisture and light curable adhesive may then be removed without leaving any residue on the electronic device housing structures. The electronic device structures may include an electronic device housing and a cover glass.

    摘要翻译： 电子设备可以包括用湿气和光可固化粘合剂附着的电子设备结构。 为了组装电子设备，可以将粘合剂分配到第一电子设备结构上。 然后可以使用附接结构来将第二电子设备结构附接到第一电子设备结构。 电子设备可以用测试设备进行测试。 如果电子设备需要重新加工，则可以使用分离工具来分离第一和第二电子设备结构。 在分离结构之后，结构上的残留水分和可光固化粘合剂可能暴露于光下，以确保湿气和光固化粘合剂完全固化。 然后可以除去水分和光固化粘合剂，而不会在电子器件外壳结构上留下任何残留物。 电子设备结构可以包括电子设备外壳和盖玻璃。