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公开(公告)号：US20170094824A1
公开(公告)日：2017-03-30
申请号：US15267081
申请日：2016-09-15
Applicant: Apple Inc.
Inventor： James R. Krogdahl , Derek C. Krass , Paul Choiniere
IPC: H05K5/04 , B29B13/00 , B29C37/00 , B29C45/14 , H05K5/03 , C25D11/04 , B23K26/362 , B24C1/04 , H05K5/02 , B29B13/08 , B29C35/02
Abstract: A composite material is disclosed which includes a plastic layer formed on a layer of metal. The metal layer includes pores into which an adhesive is introduced. The plastic layer is injection molded onto the metal layer so as to contact the adhesive in the pores. The plastic layer is thus bonded to the metal layer.
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公开(公告)号：US20140308465A1
公开(公告)日：2014-10-16
申请号：US13863264
申请日：2013-04-15
Applicant: APPLE INC.
Inventor： James R. Krogdahl , Benjamin J. Pope , Dennis R. Pyper , Nicholas G.L. Merz , Scott A. Myers
CPC classification number: H05K3/386 , C09J5/00 , C09J2201/606 , C09J2203/326 , C09J2205/31 , H05K3/323 , H05K3/361 , Y10T156/10 , Y10T428/13 , Y10T428/31678
Abstract: An electronic device may be provided with electronic device structures such as housing structures, antenna structures, printed circuits, and structures associated with electrical components. The structures may be attached to each other using adhesive. A liquid pressure sensitive adhesive precursor material is deposited onto one or more surfaces of structures to be bonded. Light or heat can be applied to cure the liquid adhesive material and form pressure sensitive adhesive layers. During curing, chemical bonds are formed between the adhesive material and the structures. Assembly equipment may press the structures together to form pressure sensitive adhesive bonds that can be reworked without disturbing the chemically bonded portions of the adhesive material. The pressure sensitive adhesive may include conductive particles for forming conductive paths.
Abstract translation: 电子设备可以设置有诸如壳体结构，天线结构，印刷电路和与电气部件相关联的结构的电子设备结构。 结构可以使用粘合剂彼此附接。 将液体压敏粘合剂前体材料沉积在要结合的结构的一个或多个表面上。 可以施加光或热来固化液体粘合剂材料并形成压敏粘合剂层。 在固化期间，在粘合剂材料和结构之间形成化学键。 组装设备可以将结构压在一起以形成可以重新加工而不干扰粘合剂材料的化学结合部分的压敏粘合剂粘合。 压敏粘合剂可以包括用于形成导电路径的导电颗粒。
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公开(公告)号：US10688624B2
公开(公告)日：2020-06-23
申请号：US15267081
申请日：2016-09-15
Applicant: Apple Inc.
Inventor： James R. Krogdahl , Derek C. Krass , Paul Choiniere
IPC: B24C1/04 , C25D11/04 , B29C45/14 , H04M1/02 , H05K5/06 , B29K101/12 , B29K705/00 , B29K105/20
Abstract: A composite material is disclosed which includes a plastic layer formed on a layer of metal. The metal layer includes pores into which an adhesive is introduced. The plastic layer is injection molded onto the metal layer so as to contact the adhesive in the pores. The plastic layer is thus bonded to the metal layer.
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公开(公告)号：US20170001427A1
公开(公告)日：2017-01-05
申请号：US14790932
申请日：2015-07-02
Applicant: Apple Inc.
Inventor： James R. Krogdahl , George Kyle Lobisser , Justin R. Wodrich
CPC classification number: F16B11/006 , G06F1/1613 , H04M1/0202 , H04M1/0249
Abstract: An electronic device may include electronic device structures that are attached with a moisture and light curable adhesive. To assemble the electronic device, adhesive may be dispensed onto a first electronic device structure. An attachment structure may then be used to attach a second electronic device structure to the first electronic device structure. The electronic device may be tested with testing equipment. If the electronic device needs to be reworked, a separation tool may be used to separate the first and second electronic device structures. After separating the structures, residual moisture and light curable adhesive on the structures may be exposed to light to ensure that the moisture and light curable adhesive is fully cured. The moisture and light curable adhesive may then be removed without leaving any residue on the electronic device housing structures. The electronic device structures may include an electronic device housing and a cover glass.
Abstract translation: 电子设备可以包括用湿气和光可固化粘合剂附着的电子设备结构。 为了组装电子设备，可以将粘合剂分配到第一电子设备结构上。 然后可以使用附接结构来将第二电子设备结构附接到第一电子设备结构。 电子设备可以用测试设备进行测试。 如果电子设备需要重新加工，则可以使用分离工具来分离第一和第二电子设备结构。 在分离结构之后，结构上的残留水分和可光固化粘合剂可能暴露于光下，以确保湿气和光固化粘合剂完全固化。 然后可以除去水分和光固化粘合剂，而不会在电子器件外壳结构上留下任何残留物。 电子设备结构可以包括电子设备外壳和盖玻璃。
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公开(公告)号：US12189423B2
公开(公告)日：2025-01-07
申请号：US17807396
申请日：2022-06-17
Applicant: Apple Inc.
Inventor： Douglas G. Fournier , James R. Krogdahl , Daniel W. Jarvis , Edward S. Huo , Lee E. Hooton , Srikanth V. Thiruppukuzhi , Garrett R. Owoc , Michael Ngo , David A. Pakula , Robert F. Meyer
IPC: G06F3/01 , G06F1/16 , H01M50/247 , H05K1/02 , H05K1/14 , H05K7/20 , H05K9/00 , G06F3/041 , H01M50/183 , H02J7/00
Abstract: An electronic device having a display assembly is disclosed. Several layers may combine to form the display assembly. For example, the display assembly may include a touch sensitive layer (or touch detection layer), a display layer that present visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or curve that allows a portion of the display layer to bend around the force sensitive layer. Also, the connectors (that provide electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force sensitive layer may include a connector on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on perpendicular edge regions, the display assembly may reduce its footprint.
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Patent Agency Ranking
公开(公告)号：US20160131505A1
公开(公告)日：2016-05-12
申请号：US14996878
申请日：2016-01-15
Applicant: Apple Inc.
Inventor： Matthew P. Rao , Scott A. Myers , James R. Krogdahl , Alex M. Lee
CPC classification number: G01D11/26 , B32B37/1284 , G06K9/0002 , G06K9/00053 , G06K9/00919 , H03K2217/960755 , H03K2217/960765
Abstract: An environmental seal is formed around a square sensor disposed beneath a circular button cap within a button assembly. The button assembly includes shelf portions each extending separately into the interior of the assembly from a sidewall of the assembly. Portions of the sidewall are exposed between the shelf portions large enough to permit the four corners of the square sensor to contact the sidewall. The button cap is set above the sensor, resting upon the shelf portions. A first sealant bonds the top faces of the shelf portions to the bottom of the button cap. A second sealant bonds the edges of the sidewall to the corners of the sensor. The second sealant interfaces with the first sealant to form a complete environmental seal.
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公开(公告)号：US09258906B2
公开(公告)日：2016-02-09
申请号：US13863264
申请日：2013-04-15
Applicant: Apple Inc.
Inventor： James R. Krogdahl , Benjamin J. Pope , Dennis R. Pyper , Nicholas G. L. Merz , Scott A. Myers
IPC: B29C65/52 , B32B37/12 , B32B37/26 , B32B38/10 , B32B43/00 , C09J5/02 , H05K3/38 , C09J5/00 , H05K3/32 , H05K3/36
CPC classification number: H05K3/386 , C09J5/00 , C09J2201/606 , C09J2203/326 , C09J2205/31 , H05K3/323 , H05K3/361 , Y10T156/10 , Y10T428/13 , Y10T428/31678
Abstract: An electronic device may be provided with electronic device structures such as housing structures, antenna structures, printed circuits, and structures associated with electrical components. The structures may be attached to each other using adhesive. A liquid pressure sensitive adhesive precursor material is deposited onto one or more surfaces of structures to be bonded. Light or heat can be applied to cure the liquid adhesive material and form pressure sensitive adhesive layers. During curing, chemical bonds are formed between the adhesive material and the structures. Assembly equipment may press the structures together to form pressure sensitive adhesive bonds that can be reworked without disturbing the chemically bonded portions of the adhesive material. The pressure sensitive adhesive may include conductive particles for forming conductive paths.
Abstract translation: 电子设备可以设置有诸如壳体结构，天线结构，印刷电路和与电气部件相关联的结构的电子设备结构。 结构可以使用粘合剂彼此附接。 将液体压敏粘合剂前体材料沉积在要结合的结构的一个或多个表面上。 可以施加光或热来固化液体粘合剂材料并形成压敏粘合剂层。 在固化期间，在粘合剂材料和结构之间形成化学键。 组装设备可以将结构压在一起以形成可以重新加工而不干扰粘合剂材料的化学结合部分的压敏粘合剂粘合。 压敏粘合剂可以包括用于形成导电路径的导电颗粒。
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公开(公告)号：US20140287299A1
公开(公告)日：2014-09-25
申请号：US13849895
申请日：2013-03-25
Applicant: APPLE INC.
Inventor： James R. Krogdahl
CPC classification number: H05K1/02 , C09J5/06 , C09J7/29 , C09J2201/128 , C09J2201/606 , C09J2203/326 , C09J2205/302 , H05K1/0212 , H05K3/22 , H05K2203/176 , Y10T156/10 , Y10T156/1153 , Y10T428/249983 , Y10T428/28
Abstract: A heat-debonding adhesive member is provided. The heat-debonding adhesive member attaches electronic device components such as a battery and a housing together. The heat-debonding adhesive includes a heat-generating layer that generates heat for debonding structures that are attached together using the adhesive member. The heat-generating layer includes a conductive layer that generates heat when a current flows through the conductive layer. The heat-debonding adhesive includes additional adhesive layers such as a voided polymer film having air-filled voids and one or more pressure-sensitive adhesive layers. A debonding tool provides current to conductive contacts on the conductive layer for generating heat in the heat-generating layer when it is desired to debond the structures that are attached together using the adhesive member.
Abstract translation: 提供了一种热脱粘合剂。 散热粘合剂将诸如电池和壳体的电子设备部件附接在一起。 散热粘合剂包括发热层，其产生用于使用粘合构件附着在一起的剥离结构的热量。 发热层包括当电流流过导电层时产生热量的导电层。 散热粘合剂包括另外的粘合剂层，例如具有空气填充空隙的空隙聚合物膜和一个或多个压敏粘合剂层。 当需要使用粘合剂构件粘附在一起的结构时，脱粘工具为导电层上的导电接触提供电流，以在发热层中产生热量。
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公开(公告)号：US10066975B2
公开(公告)日：2018-09-04
申请号：US14996878
申请日：2016-01-15
Applicant: Apple Inc.
Inventor： Matthew P. Rao , Scott A. Myers , James R. Krogdahl , Alex M. Lee
Abstract: An environmental seal is formed around a square sensor disposed beneath a circular button cap within a button assembly. The button assembly includes shelf portions each extending separately into the interior of the assembly from a sidewall of the assembly. Portions of the sidewall are exposed between the shelf portions large enough to permit the four corners of the square sensor to contact the sidewall. The button cap is set above the sensor, resting upon the shelf portions. A first sealant bonds the top faces of the shelf portions to the bottom of the button cap. A second sealant bonds the edges of the sidewall to the corners of the sensor. The second sealant interfaces with the first sealant to form a complete environmental seal.
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公开(公告)号：US09815259B2
公开(公告)日：2017-11-14
申请号：US14334416
申请日：2014-07-17
Applicant: Apple Inc.
Inventor： James R. Krogdahl
CPC classification number: B32B27/08 , B32B7/12 , B32B2250/02 , B32B2250/24 , B32B2250/40 , B32B2255/10 , B32B2255/26 , B32B2405/00 , C09J7/29 , C09J2201/128 , C09J2201/162 , C09J2201/606 , C09J2400/226 , Y10T428/24942 , Y10T428/2848
Abstract: Double-sided reworkable pressure sensitive adhesive tape joins electronic device structures. The reworkable pressure sensitive adhesive tape has a pair of polymer carrier layers that are attached to each other using a thermoplastic adhesive. Opposing outer surfaces of the carrier layers are coated with pressure sensitive adhesive. The thermoplastic material that is used in attaching the carriers to each has a softening temperature that allows the thermoplastic material to be softened without significantly softening the carrier layers. When the thermoplastic material is softened, the structures that have been joined using the tape may be separated from each other. This divides the tape into two tape remnants. After cooling the tape remnants to restore cohesive strength to the pressure sensitive adhesive, the tape remnants can be cleanly peeled away from the structures. Additional reworkable tape may then be used to reattach the structures.
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