公开(公告)号：US06512176B2

公开(公告)日：2003-01-28

申请号：US10046230

申请日：2002-01-16

申请人： Akihiro Yaguchi ,  Ryo Haruta ,  Masahiro Ichitani

发明人： Akihiro Yaguchi ,  Ryo Haruta ,  Masahiro Ichitani

IPC分类号： H01L2328

CPC分类号： H01L24/49 ,  H01L23/16 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In a ball grid array type semiconductor device mounted on a printed wiring board, the external terminals can be prevented from being broken down even when the ambient temperature on the device is repeatedly changed. A flexible adhesive member for gluing the semiconductor chip to an insulating tape is provided to cover up to a region including the lands to which the external terminals are bonded and which are provided on the insulating tape surface. The flexible adhesive member for covering the lands may be replaced by a flexible low-elasticity member.

公开(公告)号：US06340793B1

公开(公告)日：2002-01-22

申请号：US09525026

申请日：2000-03-14

申请人： Akihiro Yaguchi ,  Ryo Haruta ,  Masahiro Ichitani

发明人： Akihiro Yaguchi ,  Ryo Haruta ,  Masahiro Ichitani

IPC分类号： H01L2328

CPC分类号： H01L24/49 ,  H01L23/16 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In a ball grid array type semiconductor device mounted on a printed wiring board, the external terminals can be prevented from being broken down even when the ambient temperature on the device is repeatedly changed. A flexible adhesive member for gluing the semiconductor chip to an insulating tape is provided to cover up to a region including the lands to which the external terminals are bonded and which are provided on the insulating tape surface. The flexible adhesive member for covering the lands may be replaced by a flexible low-elasticity member.

公开(公告)号：US06563212B2

公开(公告)日：2003-05-13

申请号：US10046204

申请日：2002-01-16

申请人： Masanori Shibamoto ,  Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Junichi Arita ,  Ichiro Anjo

发明人： Masanori Shibamoto ,  Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Junichi Arita ,  Ichiro Anjo

IPC分类号： H01L2334

CPC分类号： H01L24/50 ,  H01L23/13 ,  H01L23/16 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3732 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/45099

摘要： A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to he semiconductor chip 1, the heat sink 4 is glued to a stiffener with a silicon adhesive 5 with an elastic modulus of 10 MPa or less, a TAB tape 9 is glued to the stiffener 3 with an epoxy adhesive 6, and the semiconductor chip 1 is sealed with an epoxy sealing resin 8 with an elastic modulus of 10 GPa or more for protection from outside.

摘要翻译： 其中半导体芯片1通过金属接合2接合到由具有热膨胀系数的材料形成的散热器4的一个表面接近半导体芯片1的半导体器件，散热器4被胶合到加强件 使用弹性模量为10MPa以下的硅粘合剂5，用环氧树脂粘合剂6将TAB带9胶合到加强件3，并用环氧树脂密封树脂8密封弹性模量为10的半导体芯片1 GPa或更多用于保护外部。

公开(公告)号：US06764878B2

公开(公告)日：2004-07-20

申请号：US10193289

申请日：2002-07-12

申请人： Atsushi Fujisawa ,  Takafumi Konno ,  Shingo Ohsaka ,  Ryo Haruta ,  Masahiro Ichitani

发明人： Atsushi Fujisawa ,  Takafumi Konno ,  Shingo Ohsaka ,  Ryo Haruta ,  Masahiro Ichitani

IPC分类号： H01L2148

CPC分类号： H01L24/32 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/13116 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.

摘要翻译： 在球栅阵列型半导体封装中，半导体芯片通过粘合材料安装在柔性薄膜基板的表面上。 多个凸起电极在所述基板的相对侧上排列成阵列，半导体芯片由树脂密封。 在这方面，形成绝缘层以覆盖形成在基板的表面上的导电体层图案，并且半导体芯片通过粘合材料安装在绝缘层上。 绝缘层被分成在半导体芯片下面的区域中相互不连续的多个部分。 通过该分隔绝缘层，可以防止半导体芯片与导电体层图案之间的短路，抑制包含柔性膜的基板的变形。

公开(公告)号：US06404049B1

公开(公告)日：2002-06-11

申请号：US09077190

申请日：1998-05-26

申请人： Masanori Shibamoto ,  Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Junichi Arita ,  Ichiro Anjo

发明人： Masanori Shibamoto ,  Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Junichi Arita ,  Ichiro Anjo

IPC分类号： H01L2334

CPC分类号： H01L24/50 ,  H01L23/13 ,  H01L23/16 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3732 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/45099

摘要： A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to the semiconductor chip 1, the heat sink 4 is glued to a stiffener with a silicon adhesive 5 with an elastic modulus of 10 MPa or less, a TAB tape 9 is glued to the stiffener 3 with an epoxy adhesive 6, and the semiconductor chip 1 is sealed with an epoxy sealing resin 8 with an elastic modulus of 10 GPa or more for protection from outside.

摘要翻译： 其中半导体芯片1通过金属粘合剂2结合到由具有热膨胀系数的材料形成的散热器4的一个表面接近半导体芯片1，散热器4被粘合到加强件 使用弹性模量为10MPa以下的硅粘合剂5，用环氧树脂粘合剂6将TAB带9胶合到加强件3，并用环氧树脂密封树脂8密封弹性模量为10的半导体芯片1 GPa或更多用于保护外部。

公开(公告)号：US06590275B2

公开(公告)日：2003-07-08

申请号：US10059341

申请日：2002-01-31

申请人： Atsushi Fujisawa ,  Takafumi Konno ,  Shingo Ohsaka ,  Ryo Haruta ,  Masahiro Ichitani

发明人： Atsushi Fujisawa ,  Takafumi Konno ,  Shingo Ohsaka ,  Ryo Haruta ,  Masahiro Ichitani

IPC分类号： H01L23495

CPC分类号： H01L24/32 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/13116 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.

公开(公告)号：US06448111B1

公开(公告)日：2002-09-10

申请号：US09594046

申请日：2000-06-15

申请人： Atsushi Fujisawa ,  Takafumi Konno ,  Shingo Ohsaka ,  Ryo Haruta ,  Masahiro Ichitani

发明人： Atsushi Fujisawa ,  Takafumi Konno ,  Shingo Ohsaka ,  Ryo Haruta ,  Masahiro Ichitani

IPC分类号： H01L2144

CPC分类号： H01L24/32 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/13116 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a method of forming a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.

摘要翻译： 在形成球栅阵列型半导体封装的方法中，半导体芯片通过粘合剂材料安装在柔性膜基板的表面上。 多个凸起电极在所述基板的相对侧上排列成阵列，半导体芯片由树脂密封。 在这方面，形成绝缘层以覆盖形成在基板的表面上的导电体层图案，并且半导体芯片通过粘合材料安装在绝缘层上。 绝缘层被分成在半导体芯片下面的区域中相互不连续的多个部分。 通过该分隔绝缘层，可以防止半导体芯片与导电体层图案之间的短路，抑制包含柔性膜的基板的变形。

公开(公告)号：US6120301A

公开(公告)日：2000-09-19

申请号：US686503

申请日：1996-07-24

申请人： Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Arata Kinjyo ,  Tsutomu Kakimoto

发明人： Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Arata Kinjyo ,  Tsutomu Kakimoto

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L23/12 ,  H01L23/31 ,  H01L23/498 ,  H01L21/20

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105

摘要： In the BGA in which the bonding portions of the support frame bonded to the wiring substrate via adhesive layer are molded by a resin, the areas of the bonding portions are each selected to be from 0.5 to 3.1 mm.sup.2. Furthermore, holes are formed in the substrate under the frame corresponding to the bonding portions.

摘要翻译： 在其中通过粘合剂层粘合到布线基板的支撑框架的接合部分由树脂模制的BGA中，接合部分的面积各自被选择为0.5至3.1mm 2。 此外，在对应于接合部分的框架下方的基板中形成孔。

公开(公告)号：US06621160B2

公开(公告)日：2003-09-16

申请号：US10046258

申请日：2002-01-16

申请人： Masanori Shibamoto ,  Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Junichi Arita ,  Ichiro Anjo

发明人： Masanori Shibamoto ,  Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Junichi Arita ,  Ichiro Anjo

IPC分类号： H01L2334

CPC分类号： H01L24/50 ,  H01L23/13 ,  H01L23/16 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3732 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/45099

摘要： A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to he semiconductor chip 1, the heat sink 4 is glued to a stiffener with a silicon adhesive 5 with an elastic modulus of 10 MPa or less, a TAB tape 9 is glued to the stiffener 3 with an epoxy adhesive 6, and the semiconductor chip 1 is sealed with an epoxy sealing resin 8 with an elastic modulus of 10 GPa or more for protection from outside.

摘要翻译： 其中半导体芯片1通过金属接合2接合到由具有热膨胀系数的材料形成的散热器4的一个表面接近半导体芯片1的半导体器件，散热器4被胶合到加强件 使用弹性模量为10MPa以下的硅粘合剂5，用环氧树脂粘合剂6将TAB带9胶合到加强件3，并用环氧树脂密封树脂8密封弹性模量为10的半导体芯片1 GPa或更多用于保护外部。

公开(公告)号：US06887739B2

公开(公告)日：2005-05-03

申请号：US10611910

申请日：2003-07-03

申请人： Atsushi Fujisawa ,  Takafumi Konno ,  Shingo Ohsaka ,  Ryo Haruta ,  Masahiro Ichitani

发明人： Atsushi Fujisawa ,  Takafumi Konno ,  Shingo Ohsaka ,  Ryo Haruta ,  Masahiro Ichitani

IPC分类号： H01L23/14 ,  H01L21/56 ,  H01L23/31 ,  H01L2/44

CPC分类号： H01L24/32 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/13116 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a method of forming a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.

摘要翻译： 在形成球栅阵列型半导体封装的方法中，半导体芯片通过粘合剂材料安装在柔性膜基板的表面上。 多个凸起电极在所述基板的相对侧上排列成阵列，半导体芯片由树脂密封。 在这方面，形成绝缘层以覆盖形成在基板的表面上的导电体层图案，并且半导体芯片通过粘合材料安装在绝缘层上。 绝缘层被分成在半导体芯片下面的区域中相互不连续的多个部分。 通过该分隔绝缘层，可以防止半导体芯片与导电体层图案之间的短路，抑制包含柔性膜的基板的变形。