Abstract:
An electro-resistance element that has a different configuration from conventional elements and is excellent in both affinity with semiconductor manufacturing processes and resistance change characteristics is provided. An electro-resistance element has two or more states in which electric resistance values between a pair of electrodes and is switchable from one of the two or more states into another by applying a predetermined voltage or current between the electrodes. The electro-resistance element includes a substrate and a multilayer structure disposed on the substrate, the multilayer structure includes an upper electrode, a lower electrode and an electro-resistance layer disposed between the electrodes, wherein the electro-resistance layer includes Fe2O3, and Fe3O4 contained in an amount of 0% to 20% of Fe2O3 in percent by weight, the lower electrode is made of an iron oxide having a different composition from the electro-resistance layer and containing Fe3O4, and the electro-resistance layer and the lower electrode make contact with each other.
Abstract translation:提供了具有与常规元件不同的构造并且与半导体制造工艺和电阻变化特性的亲和性优异的电阻元件。 电阻元件具有两个或更多个状态,其中一对电极之间的电阻值可以通过在电极之间施加预定的电压或电流而从两个或更多个状态之一切换到另一个状态。 电阻元件包括基板和设置在基板上的多层结构,多层结构包括上电极,下电极和设置在电极之间的电阻层,其中电阻层包括Fe 2 O 3和Fe 3 O 4 含有0重量%至20重量%的Fe 2 O 3的量,下电极由具有与电阻层不同的组成并含有Fe 3 O 4的氧化铁制成,并且电阻层和下电极 互相接触。
Abstract:
An electro-resistance element that has a different configuration from conventional elements and is excellent in both affinity with semiconductor manufacturing processes and resistance change characteristics is provided. An electro-resistance element has two or more states in which electric resistance values between a pair of electrodes and is switchable from one of the two or more states into another by applying a predetermined voltage or current between the electrodes. The electro-resistance element includes a substrate and a multilayer structure disposed on the substrate, the multilayer structure includes an upper electrode, a lower electrode and an electro-resistance layer disposed between the electrodes, wherein the electro-resistance layer includes Fe2O3, and Fe3O4 contained in an amount of 0% to 20% of Fe2O3 in percent by weight, the lower electrode is made of an iron oxide having a different composition from the electro-resistance layer and containing Fe3O4, and the electro-resistance layer and the lower electrode make contact with each other.
Abstract translation:提供了具有与常规元件不同的构造并且与半导体制造工艺和电阻变化特性的亲和性优异的电阻元件。 电阻元件具有两个或更多个状态,其中一对电极之间的电阻值可以通过在电极之间施加预定的电压或电流而从两个或更多个状态之一切换到另一个状态。 电阻元件包括基板和布置在基板上的多层结构,该多层结构包括上电极,下电极和设置在电极之间的电阻层,其中电阻层包括Fe 2 <3 O 3,Fe 3 O 4含有0〜20%的Fe 2 O 3 下部电极由与电阻层不同的组成的氧化铁制成,并含有Fe 3 O 3, SUB> 4 <! - SIPO - >电极层和下电极彼此接触。
Abstract:
An electro-resistance element that has a different configuration from conventional elements and is excellent in both affinity with semiconductor manufacturing processes and heat treatment stability under a hydrogen-containing atmosphere is provided. An electro-resistance element includes an electro-resistance layer that has two or more states in which electric resistance values are different and being switchable from one of the two or more states into another by applying a predetermined voltage or current. The electro-resistance layer includes first and second elements being capable of forming a nitride, and nitrogen.
Abstract:
An electro-resistance element that has a different configuration from conventional elements and is excellent in both affinity with semiconductor manufacturing processes and heat treatment stability under a hydrogen-containing atmosphere is provided. An electro-resistance element includes an electro-resistance layer that has two or more states in which electric resistance values are different and being switchable from one of the two or more states into another by applying a predetermined voltage or current. The electro-resistance layer includes first and second elements being capable of forming a nitride, and nitrogen.
Abstract:
A protective insulating film is deposited over first and second field-effect transistors formed on a semiconductor substrate. A capacitor composed of a capacitor lower electrode, a capacitor insulating film composed of an insulating metal oxide film, and a capacitor upper electrode is formed on the protective insulating film. A first contact plug formed in the protective insulating film provides a direct connection between the capacitor lower electrode and an impurity diffusion layer of the first field-effect transistor. A second contact plug formed in the protective insulating film provides a direct connection between the capacitor upper electrode and an impurity diffusion layer of the second field-effect transistor.
Abstract:
A capacitor element is provided which is composed of a lower electrode, an upper electrode formed in opposing relation to the lower electrode, and a capacitor dielectric film made of a ferroelectric material or a high dielectric material and formed between the lower and upper electrodes. The lower electrode, the capacitor dielectric film, and the upper electrode are formed in a region extending at least from within a hole provided in an interlayer insulating film having a first hydrogen barrier film disposed on the upper surface thereof toward a position above the hole. A second hydrogen barrier film in contact with the first hydrogen barrier film is disposed to cover the upper surface of the upper electrode and the side surface of the portion of the upper electrode which has been formed above the hole.
Abstract:
The semiconductor device of the invention includes a capacitor device, which is formed on a substrate and which includes a capacitive lower electrode, a capacitive insulating film made of an insulating metal oxide film and a capacitive upper electrode. An interlevel insulating film having an opening reaching the capacitive upper electrode is formed over the capacitor device. A metal interconnection including a titanium film is formed over the interlevel insulating film so as to be electrically connected to the capacitive upper electrode through the opening. An anti-diffusion film having conductivity is formed between the capacitive upper electrode and the metal interconnection for preventing titanium atoms composing the titanium film of the metal interconnection from passing through the capacitive upper electrode and diffusing into the capacitive insulating film.
Abstract:
A protective insulating film is deposited over first and second field-effect transistors formed on a semiconductor substrate. A capacitor composed of a capacitor lower electrode, a capacitor insulating film composed of an insulating metal oxide film, and a capacitor upper electrode is formed on the protective insulating film. A first contact plug formed in the protective insulating film provides a direct connection between the capacitor lower electrode and an impurity diffusion layer of the first field-effect transistor. A second contact plug formed in the protective insulating film provides a direct connection between the capacitor upper electrode and an impurity diffusion layer of the second field-effect transistor.
Abstract:
The semiconductor device of the invention includes a capacitor device, which is formed on a substrate and which includes a capacitive lower electrode, a capacitive insulating film made of an insulating metal oxide film and a capacitive upper electrode. An interlevel insulating film having an opening reaching the capacitive upper electrode is formed over the capacitor device. A metal interconnection including a titanium film is formed over the interlevel insulating film so as to be electrically connected to the capacitive upper electrode through the opening. An anti-diffusion film having conductivity is formed between the capacitive upper electrode and the metal interconnection for preventing titanium atoms composing the titanium film of the metal interconnection from passing through the capacitive upper electrode and diffusing into the capacitive insulating film.
Abstract:
A semiconductor device forming a capacitor through an interlayer insulating layer on a semiconductor substrate on which an integrated circuit is formed. This semiconductor device has an interlayer insulating layer with moisture content of 0.5 g/cm3 or less, which covers the capacitor in one aspect, and has a passivation layer with hydrogen content of 1021 atoms/cm3 or less, which covers the interconnections of the capacitor in other aspect. By thus constituting, deterioration of the capacitor dielectric can be prevented which brings about the electrical reliability of the ferroelectric layer or high dielectric layer.
Abstract translation:一种通过半导体衬底上的层间绝缘层形成电容器的半导体器件,其上形成集成电路。 该半导体装置具有含水量为0.5g / cm 3以下的层间绝缘层,其在一个方面覆盖电容器,并且具有氢含量为1021原子/ cm3以下的钝化层,其覆盖电容器的互连 在其他方面。 通过这样构成,可以防止导致铁电层或高介电层的电可靠性的电容器电介质的劣化。